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Showing below up to 250 results in range #51 to #300.

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  1. CDE ResMap Quick-Start instructions‏‎ (2 revisions)
  2. Critical Point Dryer‏‎ (2 revisions)
  3. SSI Solaris 150 - Operating Procedure‏‎ (2 revisions)
  4. ASML Stepper 3: Wafer Handler Reset Procedure‏‎ (2 revisions)
  5. Michael Barreraz‏‎ (2 revisions)
  6. Nanofab Job Postings‏‎ (2 revisions)
  7. Main Page mod‏‎ (2 revisions)
  8. Ellipsometer (Woollam) - Measuring thin metals with oxide pre-measurement‏‎ (2 revisions)
  9. Surfscan photo‏‎ (2 revisions)
  10. GCA 6300 training manual -old instructions‏‎ (2 revisions)
  11. Strip Annealer‏‎ (2 revisions)
  12. Exposing a wafer piece‏‎ (2 revisions)
  13. SiO2 Etching Test using CF4/CHF3‏‎ (2 revisions)
  14. Unaxis SiN100C 300nm-2019‏‎ (2 revisions)
  15. ADT 7100 - Recovering an Old Recipe (2019)‏‎ (2 revisions)
  16. Process Group - Lab Stocking/Supplies Tasks‏‎ (2 revisions)
  17. Surfscan6200 photos‏‎ (2 revisions)
  18. Autostep 200 Old training manual‏‎ (2 revisions)
  19. Step Profilometer (Dektak 6M)‏‎ (2 revisions)
  20. Errors‏‎ (2 revisions)
  21. Video Training: Uploading to GauchoCast/Panopto (Internal)‏‎ (2 revisions)
  22. Test Data of etching SiO2 with CHF3/CF4/O2‏‎ (2 revisions)
  23. Wire Saw (Takatori)‏‎ (3 revisions)
  24. Vapor HF Etch (uETCH)‏‎ (3 revisions)
  25. ADT UV-Tape Table 1042R‏‎ (3 revisions)
  26. Glossary‏‎ (3 revisions)
  27. Vacuum Oven (YES)‏‎ (3 revisions)
  28. PECVD1-SiN standard recipe.pdf‏‎ (3 revisions)
  29. ASML 5500: Recovering from a Typo in Reticle ID‏‎ (3 revisions)
  30. Sputter 1 (Custom)‏‎ (3 revisions)
  31. Gold Plating Bench‏‎ (3 revisions)
  32. Nick test‏‎ (3 revisions)
  33. MLA150 - CAD Files and Templates‏‎ (3 revisions)
  34. Video Training: Hosting with Zoom and GacuhoCast/Panopto‏‎ (3 revisions)
  35. Mike Day‏‎ (3 revisions)
  36. User Accessible Commands‏‎ (3 revisions)
  37. ASML Stepper 3 Dicing Guide Programming‏‎ (3 revisions)
  38. MVD - Wafer Coating - Process Traveler‏‎ (3 revisions)
  39. Ellipsometer (Rudolph)‏‎ (3 revisions)
  40. Peder Lenvik‏‎ (3 revisions)
  41. YES-SPR220-Various-Temps‏‎ (3 revisions)
  42. Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond‏‎ (3 revisions)
  43. Test Data of Etching SiO2 with CHF3/CF4-Florine ICP Etcher‏‎ (3 revisions)
  44. Photolithography - Improving Adhesion Photoresist Adhesion‏‎ (3 revisions)
  45. MLA Recipes‏‎ (3 revisions)
  46. Vacuum Sealer‏‎ (3 revisions)
  47. Test Data of etching SiO2 with CHF3/CF4-Florine ICP Etcher‏‎ (3 revisions)
  48. DS-K101-304 Bake Temp. versus Develop Rate‏‎ (3 revisions)
  49. Process Group - Process Control Data‏‎ (4 revisions)
  50. IBD: Calibrating Optical Thickness‏‎ (4 revisions)
  51. Mechanical Polisher (Allied)‏‎ (4 revisions)
  52. GCA 6300 Reboot Procedures‏‎ (4 revisions)
  53. KLA Tencor P7 - Basic profile instructions‏‎ (4 revisions)
  54. Test Data of etching SiO2 with CHF3/CF4-Florine‏‎ (4 revisions)
  55. Claudia Gutierrez‏‎ (4 revisions)
  56. Tube Furnace AlGaAs Oxidation (Lindberg)‏‎ (4 revisions)
  57. ASML DUV: Edge Bead Removal via Photolithography‏‎ (4 revisions)
  58. Step Profile (Dektak IIA)‏‎ (4 revisions)
  59. Suss MA-6 Backside Alignment QuickStart‏‎ (4 revisions)
  60. Wafer Scanning process Traveler‏‎ (4 revisions)
  61. Filmetrics F10-RT-UVX Operating Procedure‏‎ (4 revisions)
  62. Jack Whaley‏‎ (4 revisions)
  63. Electronics Presentations‏‎ (4 revisions)
  64. MLA150 - Large Image GDS Generation‏‎ (4 revisions)
  65. Laser Etch Monitor Simulation in Python‏‎ (4 revisions)
  66. Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer‏‎ (5 revisions)
  67. Old Deposition Data - 2021-12-15‏‎ (5 revisions)
  68. Tino Sy‏‎ (5 revisions)
  69. Spin Rinse Dryer (SemiTool)‏‎ (5 revisions)
  70. PubList2018‏‎ (5 revisions)
  71. Goniometer (Rame-Hart A-100) - Operating Procedure‏‎ (5 revisions)
  72. Old Training Manual‏‎ (5 revisions)
  73. Holographic Lith/PL Setup (Custom)‏‎ (5 revisions)
  74. Sputter 2 (SFI Endeavor)‏‎ (5 revisions)
  75. GCA 6300 Mask Making Guidance‏‎ (5 revisions)
  76. Thermal Evaporator 1‏‎ (5 revisions)
  77. Tube Furnace Wafer Bonding (Thermco)‏‎ (5 revisions)
  78. Wafer Cleaver (PELCO Flip-Scribe)‏‎ (5 revisions)
  79. Resistivity Mapper (CDE RESMAP)‏‎ (6 revisions)
  80. E-BEAM‏‎ (6 revisions)
  81. Digital Microscope (Olympus DSX1000)‏‎ (6 revisions)
  82. Luis Zuzunaga‏‎ (6 revisions)
  83. S-Cubed Flexi - Operating Procedure‏‎ (6 revisions)
  84. Photolithography - Manual Edge-Bead Removal Techniques‏‎ (6 revisions)
  85. Probe Station: I-V Curves with Keithley 2400 and Python Script‏‎ (6 revisions)
  86. Olympus LEXT OLS4000 Confocal uScope - Quick Start‏‎ (6 revisions)
  87. Photonics Presentations‏‎ (6 revisions)
  88. Photoluminescence PL Setup (Custom)‏‎ (6 revisions)
  89. Optical Film Thickness (Filmetrics)‏‎ (6 revisions)
  90. NanoFab Process Group‏‎ (6 revisions)
  91. Field Emission SEM 2 (JEOL 7600F)‏‎ (7 revisions)
  92. Programming a Job‏‎ (7 revisions)
  93. PECVD1-(PlasmaTherm 790)‏‎ (7 revisions)
  94. Amscope Quickstart Usage Guide‏‎ (7 revisions)
  95. High Temp Oven (Blue M)‏‎ (7 revisions)
  96. RIE 1 (Custom)‏‎ (7 revisions)
  97. GCA Old full training manual‏‎ (7 revisions)
  98. Flip-Chip Bonder (Finetech)‏‎ (7 revisions)
  99. Wafer Scanning/Coating Process Traveler ( combined/less detailed)‏‎ (7 revisions)
  100. ASML 5500: Recovering from an Error‏‎ (7 revisions)
  101. Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)‏‎ (7 revisions)
  102. Stocked Chemical List‏‎ (7 revisions)
  103. Dan Read‏‎ (7 revisions)
  104. Autostep 200 User Accessible Commands‏‎ (7 revisions)
  105. Deposition Data - temporary 2021-12-15‏‎ (7 revisions)
  106. Ovens 1, 2 & 3 (Labline)‏‎ (7 revisions)
  107. Bill Millerski‏‎ (7 revisions)
  108. PECV1 Wafer Coating Process Traveler‏‎ (7 revisions)
  109. ADT 7100 - Initial Setup Before Cutting‏‎ (7 revisions)
  110. Optical Film Thickness & Wafer-Mapping (Filmetrics F50)‏‎ (7 revisions)
  111. SEM Sample Coater (Hummer)‏‎ (8 revisions)
  112. Filmetrics F40-UV Quick Start‏‎ (8 revisions)
  113. FIJI - Microscope Measurement Tools‏‎ (8 revisions)
  114. Focused Ion-Beam Lithography (Raith Velion)‏‎ (8 revisions)
  115. Wafer Bonder (SUSS SB6-8E)‏‎ (8 revisions)
  116. Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick‏‎ (8 revisions)
  117. Profilm3D - Quick Start - Surface Roughness Measurement (PSI Mode)‏‎ (8 revisions)
  118. Oven 4 (Thermo-Fisher HeraTherm)‏‎ (9 revisions)
  119. Step Profilometer (KLA Tencor P-7)‏‎ (9 revisions)
  120. KLA Tencor P7 - Saving Profile Data‏‎ (9 revisions)
  121. Bill Mitchell‏‎ (9 revisions)
  122. Optical Film Thickness (Nanometric)‏‎ (9 revisions)
  123. YES-150C-Various-Resists‏‎ (9 revisions)
  124. Old Deposition Data - NastaziaM 2021-11-22‏‎ (9 revisions)
  125. KLayout Design Tips‏‎ (9 revisions)
  126. Ashers (Technics PEII)‏‎ (9 revisions)
  127. Process Group - Billing Instructions‏‎ (9 revisions)
  128. KLA-Tencor Surfscan - Standard Operating Procedure‏‎ (9 revisions)
  129. MLA150 - Design Guidelines‏‎ (9 revisions)
  130. Nano-Imprint (Nanonex NX2000)‏‎ (9 revisions)
  131. Fluorescence Microscope (Olympus MX51)‏‎ (9 revisions)
  132. Wafer Coating Process Traveler1‏‎ (10 revisions)
  133. GCA 6300 USer Accessible Commands‏‎ (10 revisions)
  134. Intellemetrics Laser Etch Monitor Procedure for Panasonic ICP Etchers‏‎ (10 revisions)
  135. InP Etch Test Result in Details‏‎ (10 revisions)
  136. Ning Cao‏‎ (10 revisions)
  137. UV Ozone Reactor‏‎ (10 revisions)
  138. CC-PRIME OnBoarding 2022-08‏‎ (10 revisions)
  139. Unaxis wafer coating procedure‏‎ (10 revisions)
  140. Adam Abrahamsen‏‎ (10 revisions)
  141. IR Aligner (SUSS MJB-3 IR)‏‎ (11 revisions)
  142. Deep UV Optical Microscope (Olympus)‏‎ (11 revisions)
  143. Process Group - Remote Fabrication Jobs‏‎ (11 revisions)
  144. XeF2 Etch (Xetch)‏‎ (12 revisions)
  145. Ovens - Overview of All Lab Ovens‏‎ (12 revisions)
  146. Molecular Vapor Deposition‏‎ (12 revisions)
  147. Film Stress (Tencor Flexus)‏‎ (12 revisions)
  148. Laser Etch Monitoring‏‎ (12 revisions)
  149. Chemical-Mechanical Polisher (Logitech)‏‎ (12 revisions)
  150. Brian Thibeault‏‎ (12 revisions)
  151. Chemical List‏‎ (12 revisions)
  152. ASML Stepper 3 Standard Operating Procedure‏‎ (13 revisions)
  153. InP etch result in details‏‎ (13 revisions)
  154. ASML Stepper 3 - UCSB Test Reticles‏‎ (13 revisions)
  155. Suss Aligners (SUSS MJB-3)‏‎ (13 revisions)
  156. Main Page‏‎ (14 revisions)
  157. Rapid Thermal Processor (SSI Solaris 150)‏‎ (14 revisions)
  158. Lee Sawyer‏‎ (14 revisions)
  159. Unaxis VLR Etch - Process Control Data‏‎ (15 revisions)
  160. Autostep 200 Mask Making Guidance‏‎ (15 revisions)
  161. UNAVAILABLE - Optical Profilometer - White-Light/Phase-Shift Interference (Filmetrics Profilm3D)‏‎ (15 revisions)
  162. DUV Flood Expose‏‎ (15 revisions)
  163. Wafer Bonder (Logitech WBS7)‏‎ (16 revisions)
  164. Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer)‏‎ (16 revisions)
  165. Plasma Activation (EVG 810)‏‎ (16 revisions)
  166. PECVD1 Wafer Coating Process Traveler‏‎ (16 revisions)
  167. E-Beam Lithography System (JEOL JBX-6300FS)‏‎ (16 revisions)
  168. Field Emission SEM 1 (FEI Sirion)‏‎ (16 revisions)
  169. Biljana Stamenic‏‎ (17 revisions)
  170. Plasma Clean (YES EcoClean)‏‎ (17 revisions)
  171. Usage Data and Statistics‏‎ (17 revisions)
  172. Thermal Processing Recipes‏‎ (17 revisions)
  173. UCSB NanoFab Microscope Training‏‎ (17 revisions)
  174. Oxford ICP Etcher (PlasmaPro 100 Cobra)‏‎ (18 revisions)
  175. Laser Scanning Confocal M-scope (Olympus LEXT)‏‎ (18 revisions)
  176. Oxygen Plasma System Recipes‏‎ (18 revisions)
  177. Atomic Force Microscope (Bruker ICON)‏‎ (18 revisions)
  178. Probe Station & Curve Tracer‏‎ (18 revisions)
  179. Rapid Thermal Processor (AET RX6)‏‎ (18 revisions)
  180. Sputter 5 (AJA ATC 2200-V)‏‎ (18 revisions)
  181. Oven 5 (Labline)‏‎ (19 revisions)
  182. Automated Coat/Develop System (S-Cubed Flexi)‏‎ (19 revisions)
  183. Aidan Hopkins‏‎ (19 revisions)
  184. Lift-Off with DUV Imaging + PMGI Underlayer‏‎ (19 revisions)
  185. DSEIII (PlasmaTherm/Deep Silicon Etcher)‏‎ (19 revisions)
  186. Filmetrics F40-UV Microscope-Mounted‏‎ (19 revisions)
  187. Troubleshooting and Recovery‏‎ (19 revisions)
  188. Tech Talks Seminar Series‏‎ (19 revisions)
  189. IR Thermal Microscope (QFI)‏‎ (20 revisions)
  190. RIE 5 (PlasmaTherm)‏‎ (20 revisions)
  191. RIE 2 (MRC)‏‎ (20 revisions)
  192. Sputter 4 (AJA ATC 2200-V)‏‎ (20 revisions)
  193. Brian Lingg‏‎ (20 revisions)
  194. Tom Reynolds‏‎ (20 revisions)
  195. CAIBE (Oxford Ion Mill)‏‎ (21 revisions)
  196. Ellipsometer (Woollam)‏‎ (21 revisions)
  197. GoPro Hero8 Black (Internal)‏‎ (21 revisions)
  198. Wafer Coating Process Traveler‏‎ (23 revisions)
  199. Mike Silva‏‎ (24 revisions)
  200. DUMMY TOOL‏‎ (24 revisions)
  201. Don Freeborn‏‎ (24 revisions)
  202. Demis D. John‏‎ (25 revisions)
  203. Stepper 2 (AutoStep 200) Operating Procedures‏‎ (25 revisions)
  204. Packaging Recipes‏‎ (26 revisions)
  205. Sputter 3 (AJA ATC 2000-F)‏‎ (26 revisions)
  206. Stepper 1 (GCA 6300) - Standard Operating Procedure‏‎ (26 revisions)
  207. Nanofab Staff Internal Pages‏‎ (26 revisions)
  208. PECVD1 Wafer Coating Process‏‎ (27 revisions)
  209. ASML Stepper 3 Error Recovery, Troubleshooting and Calibration‏‎ (27 revisions)
  210. Tony Bosch‏‎ (28 revisions)
  211. Atomic Layer Deposition (Oxford FlexAL)‏‎ (29 revisions)
  212. Services‏‎ (29 revisions)
  213. ICP-Etch (Unaxis VLR)‏‎ (29 revisions)
  214. Other Dry Etching Recipes‏‎ (29 revisions)
  215. Vapor HF Etch‏‎ (30 revisions)
  216. RIE 3 (MRC)‏‎ (31 revisions)
  217. Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher‏‎ (31 revisions)
  218. HF Vapor Etch‏‎ (31 revisions)
  219. Tube Furnace (Tystar 8300)‏‎ (32 revisions)
  220. MLA150 - Troubleshooting‏‎ (33 revisions)
  221. Old training manual‏‎ (34 revisions)
  222. Stepper 2 (Autostep 200) - Job Programming‏‎ (34 revisions)
  223. Ion Beam Deposition (Veeco NEXUS)‏‎ (35 revisions)
  224. Contact Aligner (SUSS MA-6)‏‎ (35 revisions)
  225. Maskless Aligner (Heidelberg MLA150)‏‎ (39 revisions)
  226. COVID-19 User Policies‏‎ (39 revisions)
  227. Atomic Layer Deposition Recipes‏‎ (39 revisions)
  228. RIE Etching Recipes‏‎ (40 revisions)
  229. Dicing Saw (ADT)‏‎ (40 revisions)
  230. ASML 5500 Mask Making Guidelines‏‎ (41 revisions)
  231. Direct-Write Lithography Recipes‏‎ (41 revisions)
  232. Microscopes‏‎ (41 revisions)
  233. Lab Rules‏‎ (41 revisions)
  234. Research‏‎ (42 revisions)
  235. Surface Analysis (KLA/Tencor Surfscan)‏‎ (46 revisions)
  236. Lab Rules OLD 2018‏‎ (47 revisions)
  237. Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)‏‎ (47 revisions)
  238. Wet Benches‏‎ (47 revisions)
  239. PECVD 2 (Advanced Vacuum)‏‎ (48 revisions)
  240. Autostep 200 Troubleshooting and Recovery‏‎ (48 revisions)
  241. Contact Alignment Recipes‏‎ (49 revisions)
  242. ICP Etch 2 (Panasonic E640)‏‎ (51 revisions)
  243. Editing Tutorials‏‎ (52 revisions)
  244. Staff List‏‎ (53 revisions)
  245. Test Data of etching SiO2 with CHF3/CF4-ICP1‏‎ (55 revisions)
  246. Stepper 2 (AutoStep 200)‏‎ (56 revisions)
  247. OLD - PECVD2 Recipes‏‎ (56 revisions)
  248. ICP Etch 1 (Panasonic E626I)‏‎ (58 revisions)
  249. InP Etch Rate and Selectivity (InP/SiO2)‏‎ (60 revisions)
  250. Oxford ICP Etcher - Process Control Data‏‎ (60 revisions)

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