Difference between revisions of "RIE Etching Recipes"
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(Created page with "{{recipes}} =RIE 1 (Custom) = =RIE 2 (MRC) = =RIE 3 (MRC) = =RIE 5 (PlasmaTherm) = =Si Deep RIE (PlasmaTherm/Bosch Etch)=") |
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+ | {{recipes|Dry Etching}} |
| − | =[[RIE 1 (Custom)]] = |
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=[[RIE 2 (MRC)]] = |
=[[RIE 2 (MRC)]] = |
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| + | ==CdZnTe Etching (RIE 2)== |
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| + | *[//wiki.nanotech.ucsb.edu/w/images/f/f5/11-CZT_etching-1.pdf CdZnTe Etch Recipes - CH<sub>4</sub>-H<sub>2</sub>-Ar] |
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| + | |||
| + | ==ZnS Etching (RIE 2)== |
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| + | *[//wiki.nanotech.ucsb.edu/w/images/b/b4/ZnS_Plasma_Etch-1.pdf ZnS Etch Recipe - CH<sub>4</sub>-H<sub>2</sub>-Ar] |
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| + | |||
| + | ==ITO Etching (RIE 2)== |
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| + | *[//wiki.nanotech.ucsb.edu/w/images/f/f4/RIE2-ITO-Etch-MHA-Plasma-RevA.pdf ITO Etch Recipes - CH<sub>4</sub>-H<sub>2</sub>-Ar] |
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| + | |||
| + | ==InP-InGaAsP-InGaAlAs Etching (RIE 2)== |
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| + | *[//wiki.nanotech.ucsb.edu/w/images/6/6f/RIE2-InGaAs-InP-InAlAs-Etch-Plasma-RIE-RevA.pdf InP-InGaAsP-InAlGaAs Etch Recipes - CH<sub>4</sub>-H<sub>2</sub>-Ar] |
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| + | |||
=[[RIE 3 (MRC)]] = |
=[[RIE 3 (MRC)]] = |
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| + | ==SiO<sub>2</sub> Etching (RIE 3)== |
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| + | *[//wiki.nanotech.ucsb.edu/w/images/2/2f/SiO2-Etch-Recipe-using-RIE-3-a.pdf SiO<sub>2</sub> Etch Recipe with a very low surface damage - CHF<sub>3] |
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| + | ==SiN<sub>x</sub> Etching (RIE 3)== |
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| + | *[//wiki.nanotech.ucsb.edu/w/images/9/98/51-SiNx-Etch-Recipe-using-RIE3.pdf SiN<sub>x</sub> Etch Recipe with a very low surface damage - CHF<sub>3] |
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| + | |||
=[[RIE 5 (PlasmaTherm)]] = |
=[[RIE 5 (PlasmaTherm)]] = |
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| + | ==AlGaAs\GaAs Etching (RIE 5)== |
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| − | =[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]= |
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| + | *[//wiki.nanotech.ucsb.edu/w/images/b/b5/13-GaAs-AlGaAs_Etching-RIE-5.pdf GaAs\AlGaAs Etch Recipes - BCl<sub>3</sub>-SiCl<sub>4</sub>] |
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| + | |||
| + | ==GaN Etching (RIE 5)== |
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| + | *[//wiki.nanotech.ucsb.edu/w/images/c/cb/08-Plasma_Etching_of_GaN-RIE5.pdf GaN Etch Recipes - Cl<sub>2</sub>-BCl<sub>3</sub>-Ar] |
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| + | == Photoresist and ARC (RIE 5) == |
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| + | |||
| + | === DUV42P (AR2) etching === |
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| + | * O2 = 20sccm // Pressure = 10mT // RF = 100W // Time = 40 sec |
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| + | * No need to pump/purge, can etch right away. |
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| + | * No helium cooling, Run in manual mode. |
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Latest revision as of 10:02, 14 June 2021
Back to Dry Etching Recipes.
RIE 2 (MRC)
CdZnTe Etching (RIE 2)
ZnS Etching (RIE 2)
ITO Etching (RIE 2)
InP-InGaAsP-InGaAlAs Etching (RIE 2)
RIE 3 (MRC)
SiO2 Etching (RIE 3)
SiNx Etching (RIE 3)
RIE 5 (PlasmaTherm)
AlGaAs\GaAs Etching (RIE 5)
GaN Etching (RIE 5)
Photoresist and ARC (RIE 5)
DUV42P (AR2) etching
- O2 = 20sccm // Pressure = 10mT // RF = 100W // Time = 40 sec
- No need to pump/purge, can etch right away.
- No helium cooling, Run in manual mode.