https://wiki.nanofab.ucsb.edu/w/index.php?title=Plasma_Clean_(Gasonics_2000)&feed=atom&action=history
Plasma Clean (Gasonics 2000) - Revision history
2024-03-29T12:14:13Z
Revision history for this page on the wiki
MediaWiki 1.35.13
https://wiki.nanofab.ucsb.edu/w/index.php?title=Plasma_Clean_(Gasonics_2000)&diff=161878&oldid=prev
John d: mention tool removed, link to YES and Pan1 Ashing
2024-02-23T19:12:29Z
<p>mention tool removed, link to YES and Pan1 Ashing</p>
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<td colspan="2" style="background-color: #fff; color: #202122; text-align: center;">← Older revision</td>
<td colspan="2" style="background-color: #fff; color: #202122; text-align: center;">Revision as of 19:12, 23 February 2024</td>
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<td style="color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;"><div>}}</div></td>
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<td style="color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;"><div> '''This tool has been removed. The [[Plasma Clean (YES EcoClean)|YES EcoClean]] and [[ICP Etch 1 (Panasonic E646V)|Panasonic ICP #1 Ashing]] are the process replacements.''' ''-- DJ 2023''</div></td>
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<td class="diff-marker"><a class="mw-diff-movedpara-left" title="Paragraph was moved. Click to jump to new location." href="#movedpara_4_1_rhs">⚫</a></td>
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<td class="diff-marker"><a class="mw-diff-movedpara-right" title="Paragraph was moved. Click to jump to old location." href="#movedpara_3_0_lhs">⚫</a></td>
<td style="color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #a3d3ff; vertical-align: top; white-space: pre-wrap;"><div><a name="movedpara_4_1_rhs"></a>=About=</div></td>
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<td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"></td>
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<td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"><div>The Aura 2000 system is a microwave downstream asher used for the removal of resist and other organic materials. Samples are loaded onto 8” carrier wafers into the system. Samples can be heated from 100C to above 350C by heat lamps, while being exposed to microwave-cracked oxygen to remove organic materials. The microwave excitation of the oxygen is done downstream from the chamber and the reactive oxygen flows through a showerhead to expose the sample, thus completely eliminating ion bombardment. Resist etch rates of several microns per minute can be achieved and is also effective on fluorine and chlorine plasma exposed resist.</div></td>
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<td style="background-color: #f8f9fa; color: #202122; font-size: 88%; border-style: solid; border-width: 1px 1px 1px 4px; border-radius: 0.33em; border-color: #eaecf0; vertical-align: top; white-space: pre-wrap;"><div>The Aura 2000 system is a microwave downstream asher used for the removal of resist and other organic materials. Samples are loaded onto 8” carrier wafers into the system. Samples can be heated from 100C to above 350C by heat lamps, while being exposed to microwave-cracked oxygen to remove organic materials. The microwave excitation of the oxygen is done downstream from the chamber and the reactive oxygen flows through a showerhead to expose the sample, thus completely eliminating ion bombardment. Resist etch rates of several microns per minute can be achieved and is also effective on fluorine and chlorine plasma exposed resist.</div></td>
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John d
https://wiki.nanofab.ucsb.edu/w/index.php?title=Plasma_Clean_(Gasonics_2000)&diff=445&oldid=prev
Zwarburg: Created page with "{{tool|{{PAGENAME}} |picture=Gasonics.jpg |type = Dry Etch |super= Mike Silva |phone=(805)839-3918x219 |location=Bay 5 |email=silva@ece.ucsb.edu |description = Aura 2000-LL Downs…"
2012-07-01T14:37:52Z
<p>Created page with "{{tool|{{PAGENAME}} |picture=Gasonics.jpg |type = Dry Etch |super= Mike Silva |phone=(805)839-3918x219 |location=Bay 5 |email=silva@ece.ucsb.edu |description = Aura 2000-LL Downs…"</p>
<p><b>New page</b></p><div>{{tool|{{PAGENAME}}<br />
|picture=Gasonics.jpg<br />
|type = Dry Etch<br />
|super= Mike Silva<br />
|phone=(805)839-3918x219<br />
|location=Bay 5<br />
|email=silva@ece.ucsb.edu<br />
|description = Aura 2000-LL Downstream Asher<br />
|manufacturer = Gasonics<br />
|materials = <br />
}} <br />
= About =<br />
<br />
The Aura 2000 system is a microwave downstream asher used for the removal of resist and other organic materials. Samples are loaded onto 8” carrier wafers into the system. Samples can be heated from 100C to above 350C by heat lamps, while being exposed to microwave-cracked oxygen to remove organic materials. The microwave excitation of the oxygen is done downstream from the chamber and the reactive oxygen flows through a showerhead to expose the sample, thus completely eliminating ion bombardment. Resist etch rates of several microns per minute can be achieved and is also effective on fluorine and chlorine plasma exposed resist.</div>
Zwarburg