Packaging Recipes

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Revision as of 11:07, 17 October 2018 by Hopkins a (talk | contribs) (Cutting Parameters)
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Dicing Saw Recipes (ADT 7100)

Cutting Parameters

Recommended Dicing Parameters
Material Blade P/N Spindle Speed (KRPM) Cut Speed (mm/s)
Alumina, AlN 2.187-8C-54RU-3 25 0.5-2
Ceramic 2.187-4C-30RU-3 18 0.5-2
GaAs 2.187-4C-9RU-3 35 1-5
GaN  (<550um) 2.187-4C-30RU-3 35 0.5-3
GaN  (>550um) 2.187-8C-30RU-3 35 0.5-2
Glass/Fused Silica 2.187-4C-22RU-3 25 1-5
InP 2.187-4C-9RU-3 35 1-5
Quartz 2.187-4C-30RU-3 25 1-5
Sapphire 2.187-8C-54RU-3 18 0.5-2
Si 2.187-4C-9RU-3 35 4-10
Si on Glasss 2.187-4C-9RU-3 25 1-5
SiC 2.187-8C-30RU-3 25 0.5-2
Ti 2.187-8C-54RU-3 15 0.5-2
Blade Diam Flange Diam. Blade Exposure
2.187" (55.55mm) 47mm 4.275mm
2.187" (55.55mm) 49mm 3.275mm
2.187" (55.55mm) 51mm 2.275mm
2.187" (55.55mm) 52mm 1.775mm
2.187" (55.55mm) 53mm 1.275mm

Mounting/Unmounting Samples

The UV-Release Tape dispenser is most-often used for mounting sample for dicing.

The Tape Model installed is XYZXYZ. Data Sheet Here.

  • Procedure for mounting sample on UV-Release Tape
  • Full Release: 60 sec exposure
  • Partial Release for Shipping: 9 sec exposure

Surface Protection

Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).

  1. Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. Contact Alignment PR Recipes Stepper PR Recipes
  1. Perform your dicing
  2. Strip the PR in Acetone and ISO & N2 dry

Wafer Bonder (Logitech WBS7)

This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.

Wax Mounting Procedure, with Spin-On Crystalbond

Draft only - in progress.  -- Demis 2018-10-16
  • Mix a fresh squirt bottle of CrystalBond diluted with Acetone (see Don Freeborn for method).
    • XYZ grams of crystalbond, mixed into
    • XYZ mL of Acetone, in dedicated squirt bottle
    • Shake/stir to completely dissolve the wax
  • Place 4-inch silicon carrier wafer on POLOS spinner in solvent bench, with non-vacuum 4-inch chuck installed.
  • Set up POLOS recipe
    • Spin at XYZ rpm for XYZ sec.
  • Squirt wax solution onto wafer
  • I/O to spin.
  • Place carrier wafer on Logitech bonder surface
  • Place sample to be bonded on top
  • Place 110mm chemical filter paper on top
  • Close lid, secure lid clamp
  • Run recipe:
    • XYZ °C
    • XYZ seconds
    • Vacuum etc.?