Packaging Recipes
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Dicing Saw Recipes (ADT 7100)
Cutting Parameters
Recommended Dicing Parameters | |||
Material | Blade P/N | Spindle Speed (KRPM) | Cut Speed (mm/s) |
Alumina, AlN | 2.187-8C-54RU-3 | 25 | 0.5-2 |
Ceramic | 2.187-4C-30RU-3 | 18 | 0.5-2 |
GaAs | 2.187-4C-9RU-3 | 35 | 1-5 |
GaN (<550um) | 2.187-4C-30RU-3 | 35 | 0.5-3 |
GaN (>550um) | 2.187-8C-30RU-3 | 35 | 0.5-2 |
Glass/Fused Silica | 2.187-4C-22RU-3 | 25 | 1-5 |
InP | 2.187-4C-9RU-3 | 35 | 1-5 |
Quartz | 2.187-4C-30RU-3 | 25 | 1-5 |
Sapphire | 2.187-8C-54RU-3 | 18 | 0.5-2 |
Si | 2.187-4C-9RU-3 | 35 | 4-10 |
Si on Glasss | 2.187-4C-9RU-3 | 25 | 1-5 |
SiC | 2.187-8C-30RU-3 | 25 | 0.5-2 |
Ti | 2.187-8C-54RU-3 | 15 | 0.5-2 |
Blade Diam | Flange Diam. | Blade Exposure |
---|---|---|
2.187" (55.55mm) | 47mm | 4.275mm |
2.187" (55.55mm) | 49mm | 3.275mm |
2.187" (55.55mm) | 51mm | 2.275mm |
2.187" (55.55mm) | 52mm | 1.775mm |
2.187" (55.55mm) | 53mm | 1.275mm |
Blade Diam | Flange Diam. | Blade Exposure |
---|---|---|
Mounting/Unmounting Samples
The UV-Release Tape dispenser is most-often used for mounting sample for dicing.
The Tape Model installed is XYZXYZ. Data Sheet Here.
- Procedure for mounting sample on UV-Release Tape
- Full Release: 60 sec exposure
- Partial Release for Shipping: 9 sec exposure
Surface Protection
Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).
- Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. Contact Alignment PR Recipes Stepper PR Recipes
- Perform your dicing
- Strip the PR in Acetone and ISO & N2 dry
Wafer Bonder (Logitech WBS7)
This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.
Wax Mounting Procedure, with Spin-On Crystalbond
Draft only - in progress. -- Demis 2018-10-16
- Mix a fresh squirt bottle of CrystalBond diluted with Acetone (see Don Freeborn for method).
- XYZ grams of crystalbond, mixed into
- XYZ mL of Acetone, in dedicated squirt bottle
- Shake/stir to completely dissolve the wax
- Place 4-inch silicon carrier wafer on POLOS spinner in solvent bench, with non-vacuum 4-inch chuck installed.
- Set up POLOS recipe
- Spin at XYZ rpm for XYZ sec.
- Squirt wax solution onto wafer
- I/O to spin.
- Place carrier wafer on Logitech bonder surface
- Place sample to be bonded on top
- Place 110mm chemical filter paper on top
- Close lid, secure lid clamp
- Run recipe:
- XYZ °C
- XYZ seconds
- Vacuum etc.?