Difference between revisions of "Packaging Recipes"

Revision as of 13:47, 17 October 2018

Dicing Saw Recipes (ADT 7100)

Cutting Parameters

Recommended Dicing Parameters

Material	Blade P/N	Spindle Speed (KRPM)	Cut Speed (mm/s)
Alumina, AlN	2.187-8C-54RU-3	25	0.5-2
Ceramic	2.187-4C-30RU-3	18	0.5-2
GaAs	2.187-4C-9RU-3	35	1-5
GaN (<550um)	2.187-4C-30RU-3	35	0.5-3
GaN (>550um)	2.187-8C-30RU-3	35	0.5-2
Glass/Fused Silica	2.187-4C-22RU-3	25	1-5
InP	2.187-4C-9RU-3	35	1-5
Quartz	2.187-4C-30RU-3	25	1-5
Sapphire	2.187-8C-54RU-3	18	0.5-2
Si	2.187-4C-9RU-3	35	4-10
Si on Glasss	2.187-4C-9RU-3	25	1-5
SiC	2.187-8C-30RU-3	25	0.5-2
Ti	2.187-8C-54RU-3	15	0.5-2

Blade Diam	Flange Diam.	Blade Exposure
2.187" (55.55mm)	47mm	4.275mm
2.187" (55.55mm)	49mm	3.275mm
2.187" (55.55mm)	51mm	2.275mm
2.187" (55.55mm)	52mm	1.775mm
2.187" (55.55mm)	53mm	1.275mm

Mounting/Unmounting Samples

The UV-Release Tape dispenser is most-often used for mounting sample for dicing.

The Tape Model installed is XYZXYZ. Data Sheet Here.

Procedure for mounting sample on UV-Release Tape
Full Release: 60 sec exposure
Partial Release for Shipping: 9 sec exposure

Surface Protection

Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).

Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. Contact Alignment PR Recipes Stepper PR Recipes

Perform your dicing
Strip the PR in Acetone and ISO & N2 dry

Wafer Bonder (Logitech WBS7)

This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.

@@ Line 106: / Line 106: @@
 |1.275mm
 |}
-{| class="wikitable"
 === Mounting/Unmounting Samples ===
 The UV-Release Tape dispenser is most-often used for mounting sample for dicing.
@@ Line 115: / Line 113: @@
 * Full Release: 60 sec exposure
 * Partial Release for Shipping: 9 sec exposure
 === Surface Protection ===
 Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).
@@ Line 122: / Line 119: @@
 # Perform your dicing
 # Strip the PR in Acetone and ISO & N2 dry
 == [[Wafer Bonder (Logitech WBS7)]] ==
 This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.
+* [[Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond|Wax Mounting Procedure, with Spin-On Crystalbond]]
+* [[Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick|Wax Mounting Procedure, with bulk Crystalbond Stick]]
+{| class="wikitable"
+|}
-=== Wax Mounting Procedure, with Spin-On Crystalbond ===
- Draft only - in progress.  -- Demis 2018-10-16
-* Mix a fresh squirt bottle of CrystalBond diluted with Acetone (see [[Don Freeborn]] for method).
-** XYZ grams of crystalbond, mixed into
-** XYZ mL of Acetone, in dedicated squirt bottle
-** Shake/stir to completely dissolve the wax
-* Place 4-inch silicon carrier wafer on POLOS spinner in solvent bench, with non-vacuum 4-inch chuck installed.
-* Set up POLOS recipe
-** Spin at XYZ rpm for XYZ sec.
-* Squirt wax solution onto wafer
-* I/O to spin.
-* Place carrier wafer on Logitech bonder surface
-* Place sample to be bonded on top
-* Place 110mm chemical filter paper on top
-* Close lid, secure lid clamp
-* Run recipe:
-** XYZ °C
-** XYZ seconds
-** Vacuum etc.?