Difference between revisions of "Packaging Recipes"

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(inital pages)
 
(added Logitech Wafer bonder section, initial draft of procedure for wax mounting)
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== [[Dicing Saw (ADT)|Dicing Saw Recipes (ADT 7100)]] ==
 
== [[Dicing Saw (ADT)|Dicing Saw Recipes (ADT 7100)]] ==
  
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# Perform your dicing
 
# Perform your dicing
 
# Strip the PR in Acetone and ISO & N2 dry
 
# Strip the PR in Acetone and ISO & N2 dry
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== [[Wafer Bonder (Logitech WBS7)]] ==
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This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.
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=== Wax Mounting Procedure, with Spin-On Crystalbond ===
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Draft only - in progress.  -- Demis 2018-10-16
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* Mix a fresh squirt bottle of CrystalBond diluted with Acetone (see [[Don Freeborn]] for method).
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** XYZ grams of crystalbond, mixed into
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** XYZ mL of Acetone, in dedicated squirt bottle
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** Shake/stir to completely dissolve the wax
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* Place 4-inch silicon carrier wafer on POLOS spinner in solvent bench, with non-vacuum 4-inch chuck installed.
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* Set up POLOS recipe
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** Spin at XYZ rpm for XYZ sec.
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* Squirt wax solution onto wafer
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* I/O to spin.
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* Place carrier wafer on Logitech bonder surface
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* Place sample to be bonded on top
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* Place 110mm chemical filter paper on top
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* Close lid, secure lid clamp
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* Run recipe:
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** XYZ °C
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** XYZ seconds
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** Vacuum etc.?

Revision as of 09:12, 16 October 2018

Dicing Saw Recipes (ADT 7100)

Cutting Parameters

Material Blade Type Spindle Speed Cut Speed
Blade Diam Flange Diam. Blade Exposure

Mounting/Unmounting Samples

The UV-Release Tape dispenser is most-often used for mounting sample for dicing.

The Tape Model installed is XYZXYZ. Data Sheet Here.

  • Procedure for mounting sample on UV-Release Tape
  • Full Release: 60 sec exposure
  • Partial Release for Shipping: 9 sec exposure

Surface Protection

Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).

  1. Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. Contact Alignment PR Recipes Stepper PR Recipes
  1. Perform your dicing
  2. Strip the PR in Acetone and ISO & N2 dry

Wafer Bonder (Logitech WBS7)

This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.

Wax Mounting Procedure, with Spin-On Crystalbond

Draft only - in progress.  -- Demis 2018-10-16
  • Mix a fresh squirt bottle of CrystalBond diluted with Acetone (see Don Freeborn for method).
    • XYZ grams of crystalbond, mixed into
    • XYZ mL of Acetone, in dedicated squirt bottle
    • Shake/stir to completely dissolve the wax
  • Place 4-inch silicon carrier wafer on POLOS spinner in solvent bench, with non-vacuum 4-inch chuck installed.
  • Set up POLOS recipe
    • Spin at XYZ rpm for XYZ sec.
  • Squirt wax solution onto wafer
  • I/O to spin.
  • Place carrier wafer on Logitech bonder surface
  • Place sample to be bonded on top
  • Place 110mm chemical filter paper on top
  • Close lid, secure lid clamp
  • Run recipe:
    • XYZ °C
    • XYZ seconds
    • Vacuum etc.?