Difference between revisions of "Packaging Recipes"
Jump to navigation
Jump to search
(inital pages) |
(added Logitech Wafer bonder section, initial draft of procedure for wax mounting) |
||
Line 1: | Line 1: | ||
+ | |||
== [[Dicing Saw (ADT)|Dicing Saw Recipes (ADT 7100)]] == | == [[Dicing Saw (ADT)|Dicing Saw Recipes (ADT 7100)]] == | ||
Line 55: | Line 56: | ||
# Perform your dicing | # Perform your dicing | ||
# Strip the PR in Acetone and ISO & N2 dry | # Strip the PR in Acetone and ISO & N2 dry | ||
+ | |||
+ | == [[Wafer Bonder (Logitech WBS7)]] == | ||
+ | This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax. | ||
+ | |||
+ | === Wax Mounting Procedure, with Spin-On Crystalbond === | ||
+ | Draft only - in progress. -- Demis 2018-10-16 | ||
+ | * Mix a fresh squirt bottle of CrystalBond diluted with Acetone (see [[Don Freeborn]] for method). | ||
+ | ** XYZ grams of crystalbond, mixed into | ||
+ | ** XYZ mL of Acetone, in dedicated squirt bottle | ||
+ | ** Shake/stir to completely dissolve the wax | ||
+ | * Place 4-inch silicon carrier wafer on POLOS spinner in solvent bench, with non-vacuum 4-inch chuck installed. | ||
+ | * Set up POLOS recipe | ||
+ | ** Spin at XYZ rpm for XYZ sec. | ||
+ | * Squirt wax solution onto wafer | ||
+ | * I/O to spin. | ||
+ | * Place carrier wafer on Logitech bonder surface | ||
+ | * Place sample to be bonded on top | ||
+ | * Place 110mm chemical filter paper on top | ||
+ | * Close lid, secure lid clamp | ||
+ | * Run recipe: | ||
+ | ** XYZ °C | ||
+ | ** XYZ seconds | ||
+ | ** Vacuum etc.? |
Revision as of 09:12, 16 October 2018
Dicing Saw Recipes (ADT 7100)
Cutting Parameters
Material | Blade Type | Spindle Speed | Cut Speed |
---|---|---|---|
Blade Diam | Flange Diam. | Blade Exposure |
---|---|---|
Mounting/Unmounting Samples
The UV-Release Tape dispenser is most-often used for mounting sample for dicing.
The Tape Model installed is XYZXYZ. Data Sheet Here.
- Procedure for mounting sample on UV-Release Tape
- Full Release: 60 sec exposure
- Partial Release for Shipping: 9 sec exposure
Surface Protection
Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).
- Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. Contact Alignment PR Recipes Stepper PR Recipes
- Perform your dicing
- Strip the PR in Acetone and ISO & N2 dry
Wafer Bonder (Logitech WBS7)
This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.
Wax Mounting Procedure, with Spin-On Crystalbond
Draft only - in progress. -- Demis 2018-10-16
- Mix a fresh squirt bottle of CrystalBond diluted with Acetone (see Don Freeborn for method).
- XYZ grams of crystalbond, mixed into
- XYZ mL of Acetone, in dedicated squirt bottle
- Shake/stir to completely dissolve the wax
- Place 4-inch silicon carrier wafer on POLOS spinner in solvent bench, with non-vacuum 4-inch chuck installed.
- Set up POLOS recipe
- Spin at XYZ rpm for XYZ sec.
- Squirt wax solution onto wafer
- I/O to spin.
- Place carrier wafer on Logitech bonder surface
- Place sample to be bonded on top
- Place 110mm chemical filter paper on top
- Close lid, secure lid clamp
- Run recipe:
- XYZ °C
- XYZ seconds
- Vacuum etc.?