Difference between revisions of "Packaging Recipes"

Revision as of 10:11, 23 September 2021

Dicing Saw Recipes (ADT 7100)

Recommended Dicing Parameters

This table is for our stocked Thermocarbon Resnoid blades.

-4C blades are 4mils/100µm wide, while -8C blades are 8mils/200µm wide. Plan for ~50–100µm extra edge clearance to account for chipping etc.

Narrower (~30-50µm) Nickel Hubbed blades are often used for even narrower dicing streets, these must be purchased by the user.

Material	Blade P/N	Spindle Speed (KRPM)	Cut Speed (mm/s)
Alumina, AlN	2.187-8C-54RU-3	25	0.5-2
Ceramic	2.187-4C-30RU-3	18	0.5-2
GaAs	2.187-4C-9RU-3	35	1-5
GaN (<550um)	2.187-4C-30RU-3	35	0.5-3
GaN (>550um)	2.187-8C-30RU-3	35	0.5-2
Glass/Fused Silica	2.187-4C-22RU-3	25	1-5
InP	2.187-4C-9RU-3	35	1-5
Quartz	2.187-4C-30RU-3	25	1-5
Sapphire	2.187-8C-54RU-3	18	0.5-2
Si	2.187-4C-9RU-3	35	4-10
Si on Glasss	2.187-4C-9RU-3	25	1-5
SiC	2.187-8C-30RU-3	25	0.5-2
Ti	2.187-8C-54RU-3	15	0.5-2

Calculated Blade Exposures

Blade Diam	Flange Diam.	Blade Exposure
2.187" (55.55mm)	47mm	4.275mm
2.187" (55.55mm)	49mm	3.275mm
2.187" (55.55mm)	51mm	2.275mm	51mm Currently Unavailable
2.187" (55.55mm)	52mm	1.775mm
2.187" (55.55mm)	53mm	1.275mm

Mounting/Unmounting Samples

The UV-Release Tape dispenser is most-often used for mounting sample for dicing.

The Tape Model installed is Ultron 1042R. Data Sheet Here.

Procedure for mounting sample on UV-Release Tape
Full Release: 60 sec exposure
Partial Release for Shipping: 9 sec exposure

Surface Protection

Photoresist

Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).

Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe.
1. Contact Alignment PR Recipes
2. Stepper PR Recipes

Perform your dicing
Remove the die from the UV release tape (60sec UV Exposure)
Strip the PR from each die in Acetone and ISO & N2 dry

Blue Tape

Alternatively our low-tack residue-free Blue tape can be used to protect the die surface. Blue tape removal is easy for large die, but does require manual removal from each die, and eliminates sample exposure to solvents.

The very edges of the die may accumulate a bit more dicing dust due to the tape delaminating slightly during dicing. Plan for about 50-100µm of edge clearance on each die.

Wafer Bonder (Logitech WBS7)

This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.

@@ Line 1: / Line 1: @@
-== [[Dicing Saw (ADT)|Dicing Saw Recipes (ADT 7100)]] ==
+==[[Dicing Saw (ADT)|Dicing Saw Recipes (ADT 7100)]]==
-=== Cutting Parameters ===
+===Recommended Dicing Parameters===
+This table is for our stocked [https://www.dicing.com Thermocarbon] Resnoid blades.
-{| class="wikitable"
-| colspan="4" |Recommended Dicing Parameters
+-4C blades are 4mils/100µm wide, while -8C blades are 8mils/200µm wide.  Plan for ~50–100µm extra edge clearance to account for chipping etc.
-|-
-|
+Narrower (~30-50µm) Nickel Hubbed blades are often used for even narrower dicing streets, these must be purchased by the user.
-|
+{| class="wikitable sortable"
-|
-|
 |-
-|Material
+!Material
-|Blade P/N
+!Blade P/N
-|Spindle Speed (KRPM)
+!Spindle Speed
+(KRPM)
-|Cut Speed (mm/s)
+!Cut Speed
+(mm/s)
 |-
 |Alumina, AlN
@@ Line 81: / Line 82: @@
 |0.5-2
 |}
+===Calculated Blade Exposures===
 {| class="wikitable"
 !Blade Diam
 !Flange Diam.
 !Blade Exposure
+!
 |-
 |2.187" (55.55mm)
 |47mm
 |4.275mm
+|
 |-
 |2.187" (55.55mm)
 |49mm
 |3.275mm
+|
 |-
 |2.187" (55.55mm)
 |51mm
 |2.275mm
+|''51mm Currently Unavailable''
 |-
 |2.187" (55.55mm)
 |52mm
 |1.775mm
+|
 |-
 |2.187" (55.55mm)
 |53mm
 |1.275mm
+|
 |}
+===Mounting/Unmounting Samples===
-{| class="wikitable"
-=== Mounting/Unmounting Samples ===
 The UV-Release Tape dispenser is most-often used for mounting sample for dicing.
-The Tape Model installed is XYZXYZ.  [[?|Data Sheet Here]].
+The Tape Model installed is Ultron 1042R.  [[ADT_UV-Tape_Table_1042R|Data Sheet Here]].
-* Procedure for mounting sample on UV-Release Tape
-* Full Release: 60 sec exposure
-* Partial Release for Shipping: 9 sec exposure
+*[[ADT WM-966 - UV Tape Mounting Standard Procedure|Procedure for mounting sample on UV-Release Tape]]
-=== Surface Protection ===
+*Full Release: 60 sec exposure
+*Partial Release for Shipping: 9 sec exposure
+===Surface Protection===
+====Photoresist====
 Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).
-# Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe.  [[Contact Alignment Recipes|Contact Alignment PR Recipes]]  [[Stepper Recipes|Stepper PR Recipes]]
+#Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe.
-# Perform your dicing
+##[[Contact Alignment Recipes|Contact Alignment PR Recipes]]
-# Strip the PR in Acetone and ISO & N2 dry
+##[[Stepper Recipes|Stepper PR Recipes]]
+#Perform your dicing
-== [[Wafer Bonder (Logitech WBS7)]] ==
+#Remove the die from the UV release tape (60sec UV Exposure)
+#Strip the PR from each die in Acetone and ISO & N2 dry
+====Blue Tape====
+Alternatively our low-tack residue-free Blue tape can be used to protect the die surface.  Blue tape removal is easy for large die, but does require manual removal from each die, and eliminates sample exposure to solvents.
+The very edges of the die may accumulate a bit more dicing dust due to the tape delaminating slightly during dicing. Plan for about 50-100µm of edge clearance on each die.
+==[[Wafer Bonder (Logitech WBS7)]]==
 This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.
-=== Wax Mounting Procedure, with Spin-On Crystalbond ===
+*[[Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick|Wax Mounting Procedure, with bulk Crystalbond Wax]]
+*[[Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond|Wax Mounting Procedure, with Spin-On Crystalbond]]
- Draft only - in progress.  -- Demis 2018-10-16
-* Mix a fresh squirt bottle of CrystalBond diluted with Acetone (see [[Don Freeborn]] for method).
+{| class="wikitable"
-** XYZ grams of crystalbond, mixed into
-** XYZ mL of Acetone, in dedicated squirt bottle
+|}
-** Shake/stir to completely dissolve the wax
-* Place 4-inch silicon carrier wafer on POLOS spinner in solvent bench, with non-vacuum 4-inch chuck installed.
-* Set up POLOS recipe
-** Spin at XYZ rpm for XYZ sec.
-* Squirt wax solution onto wafer
-* I/O to spin.
-* Place carrier wafer on Logitech bonder surface
-* Place sample to be bonded on top
-* Place 110mm chemical filter paper on top
-* Close lid, secure lid clamp
-* Run recipe:
-** XYZ °C
-** XYZ seconds
-** Vacuum etc.?