Difference between revisions of "Packaging Recipes"

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(→‎Surface Protection: added details such as "remove from tape")
(→‎Surface Protection: UV release time)
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# Perform your dicing
 
# Perform your dicing
# Remove the die from the UV release tape
+
# Remove the die from the UV release tape (60sec UV Exposure)
 
# Strip the PR from each die in Acetone and ISO & N2 dry
 
# Strip the PR from each die in Acetone and ISO & N2 dry
 
== [[Wafer Bonder (Logitech WBS7)]] ==
 
== [[Wafer Bonder (Logitech WBS7)]] ==

Revision as of 10:50, 7 August 2019

Dicing Saw Recipes (ADT 7100)

Recommended Dicing Parameters

Material Blade P/N Spindle Speed

(KRPM)

Cut Speed

(mm/s)

Alumina, AlN 2.187-8C-54RU-3 25 0.5-2
Ceramic 2.187-4C-30RU-3 18 0.5-2
GaAs 2.187-4C-9RU-3 35 1-5
GaN  (<550um) 2.187-4C-30RU-3 35 0.5-3
GaN  (>550um) 2.187-8C-30RU-3 35 0.5-2
Glass/Fused Silica 2.187-4C-22RU-3 25 1-5
InP 2.187-4C-9RU-3 35 1-5
QuCalculated Blades Exposuresartz 2.187-4C-30RU-3 25 1-5
Sapphire 2.187-8C-54RU-3 18 0.5-2
Si 2.187-4C-9RU-3 35 4-10
Si on Glasss 2.187-4C-9RU-3 25 1-5
SiC 2.187-8C-30RU-3 25 0.5-2
Ti 2.187-8C-54RU-3 15 0.5-2

Calculated Blade Exposures

Blade Diam Flange Diam. Blade Exposure
2.187" (55.55mm) 47mm 4.275mm
2.187" (55.55mm) 49mm 3.275mm
2.187" (55.55mm) 51mm 2.275mm 51mm Currently Unavailable
2.187" (55.55mm) 52mm 1.775mm
2.187" (55.55mm) 53mm 1.275mm

Mounting/Unmounting Samples

The UV-Release Tape dispenser is most-often used for mounting sample for dicing.

The Tape Model installed is Ultron 1042R. Data Sheet Here.

Surface Protection

Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).

  1. Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe.
    1. Contact Alignment PR Recipes
    2. Stepper PR Recipes
  1. Perform your dicing
  2. Remove the die from the UV release tape (60sec UV Exposure)
  3. Strip the PR from each die in Acetone and ISO & N2 dry

Wafer Bonder (Logitech WBS7)

This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.