Difference between revisions of "Packaging Recipes"

Revision as of 15:30, 17 October 2018

Dicing Saw Recipes (ADT 7100)

Recommended Dicing Parameters

Material	Blade P/N	Spindle Speed (KRPM)	Cut Speed (mm/s)
Alumina, AlN	2.187-8C-54RU-3	25	0.5-2
Ceramic	2.187-4C-30RU-3	18	0.5-2
GaAs	2.187-4C-9RU-3	35	1-5
GaN (<550um)	2.187-4C-30RU-3	35	0.5-3
GaN (>550um)	2.187-8C-30RU-3	35	0.5-2
Glass/Fused Silica	2.187-4C-22RU-3	25	1-5
InP	2.187-4C-9RU-3	35	1-5
QuCalculated Blades Exposuresartz	2.187-4C-30RU-3	25	1-5
Sapphire	2.187-8C-54RU-3	18	0.5-2
Si	2.187-4C-9RU-3	35	4-10
Si on Glasss	2.187-4C-9RU-3	25	1-5
SiC	2.187-8C-30RU-3	25	0.5-2
Ti	2.187-8C-54RU-3	15	0.5-2

Blade Diam	Flange Diam.	Blade Exposure
2.187" (55.55mm)	47mm	4.275mm
2.187" (55.55mm)	49mm	3.275mm
2.187" (55.55mm)	51mm	2.275mm
2.187" (55.55mm)	52mm	1.775mm
2.187" (55.55mm)	53mm	1.275mm

Mounting/Unmounting Samples

The UV-Release Tape dispenser is most-often used for mounting sample for dicing.

The Tape Model installed is XYZXYZ. Data Sheet Here.

Procedure for mounting sample on UV-Release Tape
Full Release: 60 sec exposure
Partial Release for Shipping: 9 sec exposure

Surface Protection

Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).

Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. Contact Alignment PR Recipes Stepper PR Recipes

Perform your dicing
Strip the PR in Acetone and ISO & N2 dry

Wafer Bonder (Logitech WBS7)

This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.

@@ Line 47: / Line 47: @@
 |1-5
 |-
+|QuCalculated Blades Exposuresartz
-|Quartz
 |2.187-4C-30RU-3
 |25