Difference between revisions of "Packaging Recipes"

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== [[Dicing Saw (ADT)|Dicing Saw Recipes (ADT 7100)]] ==
 
== [[Dicing Saw (ADT)|Dicing Saw Recipes (ADT 7100)]] ==
  
=== Cutting Parameters ===
+
=== Recommended Dicing Parameters ===
{| class="wikitable"
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{| class="wikitable sortable"
| colspan="4" |Recommended Dicing Parameters
 
 
|-
 
|-
|
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!Material
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!Blade P/N
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!Spindle Speed
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(KRPM)
|-
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!Cut Speed
|Material
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(mm/s)
|Blade P/N
 
|Spindle Speed (KRPM)
 
|Cut Speed (mm/s)
 
 
|-
 
|-
 
|Alumina, AlN
 
|Alumina, AlN

Revision as of 13:49, 17 October 2018

Dicing Saw Recipes (ADT 7100)

Recommended Dicing Parameters

Material Blade P/N Spindle Speed

(KRPM)

Cut Speed

(mm/s)

Alumina, AlN 2.187-8C-54RU-3 25 0.5-2
Ceramic 2.187-4C-30RU-3 18 0.5-2
GaAs 2.187-4C-9RU-3 35 1-5
GaN  (<550um) 2.187-4C-30RU-3 35 0.5-3
GaN  (>550um) 2.187-8C-30RU-3 35 0.5-2
Glass/Fused Silica 2.187-4C-22RU-3 25 1-5
InP 2.187-4C-9RU-3 35 1-5
Quartz 2.187-4C-30RU-3 25 1-5
Sapphire 2.187-8C-54RU-3 18 0.5-2
Si 2.187-4C-9RU-3 35 4-10
Si on Glasss 2.187-4C-9RU-3 25 1-5
SiC 2.187-8C-30RU-3 25 0.5-2
Ti 2.187-8C-54RU-3 15 0.5-2
Blade Diam Flange Diam. Blade Exposure
2.187" (55.55mm) 47mm 4.275mm
2.187" (55.55mm) 49mm 3.275mm
2.187" (55.55mm) 51mm 2.275mm
2.187" (55.55mm) 52mm 1.775mm
2.187" (55.55mm) 53mm 1.275mm

Mounting/Unmounting Samples

The UV-Release Tape dispenser is most-often used for mounting sample for dicing.

The Tape Model installed is XYZXYZ. Data Sheet Here.

  • Procedure for mounting sample on UV-Release Tape
  • Full Release: 60 sec exposure
  • Partial Release for Shipping: 9 sec exposure

Surface Protection

Users most often use sacrificial photoresists to protect the surface from accumulating dicing dust. The static-buildup of dielectric films causes the dust to adhere strongly. Ensure that the PR thickness will adequately coat all your exposed topography (eg. use a ≥2µm thick PR for protecting 1.5-2.0µm tall etched features).

  1. Choose a photoresist of appropriate thickness, and spin-coat it & soft-bake it according to a standard recipe. Contact Alignment PR Recipes Stepper PR Recipes
  1. Perform your dicing
  2. Strip the PR in Acetone and ISO & N2 dry

Wafer Bonder (Logitech WBS7)

This tool is used for bonding samples to Silicon carrier wafers with CrystalBond wax.