Difference between revisions of "PECVD Recipes"

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== Cleaning Recipes (PECVD #1) ==
 
== Cleaning Recipes (PECVD #1) ==
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The cleaning procedure is very important in order to have consistent result on this tool and also to keep particulate count low. After each deposition you should clean the tool follow instructions carefully.
  +
 
To Be Added...
 
To Be Added...
   

Revision as of 13:57, 7 April 2020

Back to Vacuum Deposition Recipes.

PECVD 1 (PlasmaTherm 790)

Historical Particulate Data

SiN deposition (PECVD #1)

Historical Data

Thin-Film Properties
Uniformity Data

SiO2 deposition (PECVD #1)

Historical Data

Thin-Film Properties

Uniformity Data

Low-Stress SiN - LS-SiN (PECVD#1)

SiOxNy deposition (PECVD #1)

Cleaning Recipes (PECVD #1)

The cleaning procedure is very important in order to have consistent result on this tool and also to keep particulate count low. After each deposition you should clean the tool follow instructions carefully.

To Be Added...

PECVD 2 (Advanced Vacuum)

Historical Particulate Data

SiO2 deposition (PECVD #2)

Standard Recipe

Historical Data

Thin-Film Properties
Uniformity Data

SiN deposition (PECVD #2)

Standard Recipe

Historical Data

Thin-Film Properties
Uniformity Data

Low-Stress SiN deposition (PECVD #2)

Low-Stress SilIcon Nitride (< 100 MPa)

Standard Recipe

Historical Data

Thin-Film Properties
Uniformity Data

Amorphous-Si deposition (PECVD #2)

Cleaning Recipes (PECVD #2)

To Be Added...

ICP-PECVD (Unaxis VLR)

Historical Particulate Data

SiN deposition (Unaxis VLR)

The recipe SiN 100C is not valid currently, and is still under development. 
-- Demis 2019-11-22

SiN 250C Data 2020

SiN LS 250C Data 2020

SiO2 deposition (Unaxis VLR)

SiO2 100C Data 2019

SiO2 250C Data 2019

SiO2 250C Data 2020

Cleaning Recipes (Unaxis VLR Dep)

You must edit the Post-Dep Clean recipe to correspond to your deposited thickness and material. See the Operating Procedure on the Unaxis Tool Page for details.

  • SiNx etches at 20nm/min
  • SiO2 etches at 40nm/min