Difference between revisions of "PECVD Recipes"

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== SiO<sub>2</sub> deposition (PECVD #1) ==
 
== SiO<sub>2</sub> deposition (PECVD #1) ==
*[[media:|SiO<sub>2</sub> Deposition Recipe]]
+
*[[media:PECVD1-SiO2-standard recipe 1000A.pdf|SiO<sub>2</sub> Deposition Recipe]]
 
*[[media:PECVD1 SiO2 Data-March 2014 SiO2 Data.pdf|SiO<sub>2</sub> Data (Deposition rate, Refractive Index, Stress, HF etch rate)]]
 
*[[media:PECVD1 SiO2 Data-March 2014 SiO2 Data.pdf|SiO<sub>2</sub> Data (Deposition rate, Refractive Index, Stress, HF etch rate)]]
   

Revision as of 16:34, 21 March 2014

Back to Vacuum Deposition Recipes.

PECVD 1 (PlasmaTherm 790)

SiN deposition (PECVD #1)

SiO2 deposition (PECVD #1)

SiOxNy deposition (PECVD #1)

PECVD 2 (Advanced Vacuum)

SiN deposition (PECVD #2)

SiO2 deposition (PECVD #2)

Amorphous-Si deposition (PECVD #2)

ICP-PECVD (Unaxis VLR)

SiN deposition (Unaxis VLR)

SiN (2% SiH4)

50° 100° 250°

SiN (2% SiH4 - No-Ar)

50° 100° 250°

SiN (2% SiH4 - No-Ar - Extra N2)

50° 100° 250°

SiN (100% SiH4 )

50° 100° 250°

SiO2 deposition (Unaxis VLR)

SiO2 (2% SiH4)

50° 100° 250°

SiO2 (2% SiH4 - No Ar)

50° 100° 250°

SiO2 (100% SiH4 HDR)

50° 100° 250°

SiO2 (100% SiH4 LDR)

50° 100° 250°

Amorphous Si (100%SiH4 Ar He)

90° 250°