Difference between revisions of "PECVD Recipes"

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(→‎PECVD 1 (PlasmaTherm 790): added placeholder for Cleaning recipes)
(→‎Cleaning Recipes (Unaxis VLR Dep): added clean times from SOP, and link to SOP)
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== Cleaning Recipes (Unaxis VLR Dep) ==
 
== Cleaning Recipes (Unaxis VLR Dep) ==
  To Be Added...
+
You must edit the Post-Dep Clean recipe to correspond to your deposited thickness and material. See the [[ICP-PECVD (Unaxis VLR)#Documentation|Operating Procedure on the Unaxis Tool Page]] for details.
 +
* SiNx etches at 20nm/min
 +
* SiO2 etches at 40nm/min

Revision as of 10:07, 13 March 2020

Back to Vacuum Deposition Recipes.

PECVD 1 (PlasmaTherm 790)

Historical Particulate Data

SiN deposition (PECVD #1)

Historical Data

Thin-Film Properties
Uniformity Data

SiO2 deposition (PECVD #1)

Historical Data

Thin-Film Properties

Uniformity Data

Low-Stress SiN - LS-SiN (PECVD#1)

SiOxNy deposition (PECVD #1)

Cleaning Recipes (PECVD #1)

To Be Added...

PECVD 2 (Advanced Vacuum)

Historical Particulate Data

SiO2 deposition (PECVD #2)

Standard Recipe

Historical Data

Thin-Film Properties
Uniformity Data

SiN deposition (PECVD #2)

Standard Recipe

Historical Data

Thin-Film Properties
Uniformity Data

Low-Stress SiN deposition (PECVD #2)

Low-Stress SilIcon Nitride (< 100 MPa)

Standard Recipe

Historical Data

Thin-Film Properties
Uniformity Data

Amorphous-Si deposition (PECVD #2)

Cleaning Recipes (PECVD #2)

To Be Added...

ICP-PECVD (Unaxis VLR)

SiN deposition (Unaxis VLR)

These Si3N4 recipes are not valid currently, and are still under development. 
-- Demis 2019-11-22


SiO2 deposition (Unaxis VLR)



Cleaning Recipes (Unaxis VLR Dep)

You must edit the Post-Dep Clean recipe to correspond to your deposited thickness and material. See the Operating Procedure on the Unaxis Tool Page for details.

  • SiNx etches at 20nm/min
  • SiO2 etches at 40nm/min