Difference between revisions of "PECVD Recipes"

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*[//www.nanotech.ucsb.edu/wiki/images/4/4c/SiNx_Films_by_PECVD2.pdf SiNx Film Stress vs LF and HF Duration Time, and Gas Flowing-rate]
 
   
   
  +
 
*[//www.nanotech.ucsb.edu/wiki/images/4/4c/SiNx_Films_by_PECVD2.pdf SiNx Film Stress vs LF and HF Duration Time, and Gas Flowing-rate]
 
*[//www.nanotech.ucsb.edu/wiki/images/e/e1/New_Adv_PECVD-Nitride2_300C_standard_recipe_Nitride2_Standard_Recipe.pdf Nitride2 Standard Recipe 2014-5/9/2018]
 
*[//www.nanotech.ucsb.edu/wiki/images/e/e1/New_Adv_PECVD-Nitride2_300C_standard_recipe_Nitride2_Standard_Recipe.pdf Nitride2 Standard Recipe 2014-5/9/2018]
 
*[//www.nanotech.ucsb.edu/wiki/images/5/52/STD_Nitride_5-9-18_Dep.recipe.pdf STD Nitride2 Standard Recipe 5/9/2018]
 
*[//www.nanotech.ucsb.edu/wiki/images/5/52/STD_Nitride_5-9-18_Dep.recipe.pdf STD Nitride2 Standard Recipe 5/9/2018]

Revision as of 13:59, 12 December 2019

Back to Vacuum Deposition Recipes.

PECVD 1 (PlasmaTherm 790)

Note: Software upgrade performed on 2018-10-10. Note any changes in film.

SiN deposition (PECVD #1)


SiO2 deposition (PECVD #1)


OTHER recipes: Low-Stress (LS) SiN and SiOxNy deposition (PECVD #1)

PECVD 2 (Advanced Vacuum)


SiO2 deposition (PECVD #2)


SiN deposition (PECVD #2)



Low-Stress SiN deposition (PECVD #2)

Low-Stress SilIcon Nitride (< 100 MPa)


Amorphous-Si deposition (PECVD #2)

ICP-PECVD (Unaxis VLR)

SiN deposition (Unaxis VLR)

These Si3N4 recipes are not valid currently, and are still under development. 
-- Demis 2019-11-22

SiO2 deposition (Unaxis VLR)