Difference between revisions of "PECVD1 Recipes"
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*[https://docs.google.com/spreadsheets/d/1rixyzAAq6q08M5OwvZiDVoh3K8B566XKM-UZAQIAnsg/edit#gid=sharing SiO<sub>x</sub>N<sub>y</sub> Data December 2014] |
*[https://docs.google.com/spreadsheets/d/1rixyzAAq6q08M5OwvZiDVoh3K8B566XKM-UZAQIAnsg/edit#gid=sharing SiO<sub>x</sub>N<sub>y</sub> Data December 2014] |
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*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEttR2JSTkRoamR0SUZ4bE5QUW9uS2c&usp=sharing SiO<sub>x</sub>N<sub>y</sub> 3000A Thickness uniformity 2014] |
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEttR2JSTkRoamR0SUZ4bE5QUW9uS2c&usp=sharing SiO<sub>x</sub>N<sub>y</sub> 3000A Thickness uniformity 2014] |
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| + | |||
| + | *Deposition rate~14.99nm/min (users must calibrate this prior to critical deps) |
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| + | *HF e.r.~417nm/min |
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| + | *Stress~133MPa |
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| + | *Refractive Index~1.714 |
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| + | |||
| + | == LS SiN deposition (PECVD #1) == |
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| + | <!-- Placeholders - Not uploaded yet--> |
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| + | *[[media:PECVD1-SiN-Recipe.pdf|LS SiN Deposition Recipes - Varying N/O Ratio]] |
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| + | *[[media:PECVD1-SiN-Plot.pdf|LS SiN Stress/Index vs. O/N Ratio]] |
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| + | *[[media:PECVD1-LS SIN recipe 2014.pdf|LS SiN Recipe]] |
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| + | *[https://docs.google.com/spreadsheets/d/1rixyzAAq6q08M5OwvZiDVoh3K8B566XKM-UZAQIAnsg/edit#gid=sharing LS SiN Data December 2014] |
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| + | *[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dEttR2JSTkRoamR0SUZ4bE5QUW9uS2c&usp=sharing LS SiN 3000A Thickness uniformity 2014] |
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*Deposition rate~14.99nm/min (users must calibrate this prior to critical deps) |
*Deposition rate~14.99nm/min (users must calibrate this prior to critical deps) |
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Revision as of 16:34, 5 December 2014
PECVD 1 (PlasmaTherm 790)
SiN deposition (PECVD #1)
- SiN Standard Recipe
- SiN Data December 2014
- SiN 1000A Thickness uniformity 2014
- Low Stress Si3N4 - Variable Stress Recipes
- Low Stress Si3N4 - Variable Stress Plot
- Deposition rate~11.23nm/min (users must calibrate this prior to critical deps)
- HF e.r.~89nm/min
- Stress~450MPa
- Refractive Index~1.942
SiO2 deposition (PECVD #1)
- Deposition rate~35.52nm/min (users must calibrate this prior to critical deps)
- HF e.r.~645nm/min
- Stress~-408MPa
- Refractive Index~1.461
SiOxNy deposition (PECVD #1)
- SiOxNy Deposition Recipes - Varying N/O Ratio
- SiOxNy Stress/Index vs. O/N Ratio
- SiOxNy Recipe
- SiOxNy Data December 2014
- SiOxNy 3000A Thickness uniformity 2014
- Deposition rate~14.99nm/min (users must calibrate this prior to critical deps)
- HF e.r.~417nm/min
- Stress~133MPa
- Refractive Index~1.714
LS SiN deposition (PECVD #1)
- LS SiN Deposition Recipes - Varying N/O Ratio
- LS SiN Stress/Index vs. O/N Ratio
- LS SiN Recipe
- LS SiN Data December 2014
- LS SiN 3000A Thickness uniformity 2014
- Deposition rate~14.99nm/min (users must calibrate this prior to critical deps)
- HF e.r.~417nm/min
- Stress~133MPa
- Refractive Index~1.714