Difference between revisions of "Oven 5 (Labline)"

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(About)
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= About =
 
= About =
 
 
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The oven temperature can be controlled from 30C-200C with a ramp rate between 0.1C-1.0C/min. Maximum temperature is 200C. There is a N2 purge to provide a dry intert atmosphere during use.
The Sharon is a cryo-pumped thin film evaporator with a Temescal four hearth 270° bent beam evaporation source. The system incorporates a Commonwealth Scientific Corp. ion source for in-situ sample cleaning. Fixturing in the Sharon will accept any size sample up to 3.5-inch diameter. In addition, a rotation fixture is easily installed which permits adjustable angle, 360° variable speed rotation of any size sample, up to 1.5-inch diameter. This feature is particularly useful for promoting step coverage of irregular surfaces.
 
 
The Sharon is used for the evaporation of high purity metals, e.a. Al, Au, Ni, Ge, AuGe, Ti, Pt etc., for interconnect and ohmic contact metalization for fabrication of III-V compound semiconductor and silicon device fabrication.
 
 
 
   
 
=Documentation=
 
=Documentation=

Revision as of 14:21, 9 February 2017

About

The oven temperature can be controlled from 30C-200C with a ramp rate between 0.1C-1.0C/min. Maximum temperature is 200C. There is a N2 purge to provide a dry intert atmosphere during use.

Documentation

Oven 5

Oven 5 (Labline)
Oven5.jpg
Tool Type Lithography
Location Bay 5
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ?
Manufacturer Labline