Difference between revisions of "Oven 4 (Thermo-Fisher HeraTherm)"
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| − | {{ |
+ | {{tool2|{{PAGENAME}} |
|picture=Oven4.jpg |
|picture=Oven4.jpg |
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|type = Lithography |
|type = Lithography |
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| − | |super= |
+ | |super= Michael Barreraz |
| + | |super2= Aidan Hopkins |
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|location=Bay 6 |
|location=Bay 6 |
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|description = Programmable Oven |
|description = Programmable Oven |
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|manufacturer = Thermo Scientific |
|manufacturer = Thermo Scientific |
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|model = HeraTherm |
|model = HeraTherm |
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| + | |toolid=68 |
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}} |
}} |
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| − | == |
+ | ==About== |
This oven is often used for long thermal cures and wafer bonding. It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of the oven. |
This oven is often used for long thermal cures and wafer bonding. It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of the oven. |
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| − | == |
+ | ==Specifications== |
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| − | * {{todo|User Manual}} |
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| + | |||
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| + | |||
| + | * |
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| + | {{Instructions}} |
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| + | |||
| + | [https://wiki.nanotech.ucsb.edu/w/images/8/8e/Heratherm_instructions.pdf Instructions] |
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| + | <br /> |
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Latest revision as of 16:25, 13 September 2022
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About
This oven is often used for long thermal cures and wafer bonding. It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of the oven.
Specifications
- Maximum Temperature = 330 C (no active cooling)
- Gases: N2, manually set with needle valve (not programmable)
- Multi-step programmable temperature ramps
- Programmable atmospheric purge (for cooling)
Documentation