Difference between revisions of "Oven 4 (Thermo-Fisher HeraTherm)"

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{{tool|{{PAGENAME}}
+
{{tool2|{{PAGENAME}}
 
|picture=Oven4.jpg
 
|picture=Oven4.jpg
 
|type = Lithography
 
|type = Lithography
|super= Tony Bosch
+
|super= Michael Barreraz
 +
|super2= Aidan Hopkins
 
|location=Bay 6
 
|location=Bay 6
 
|description = Programmable Oven
 
|description = Programmable Oven
 
|manufacturer = Thermo Scientific
 
|manufacturer = Thermo Scientific
 
|model = HeraTherm
 
|model = HeraTherm
 +
|toolid=68
 
}}
 
}}
  
== About ==
+
==About==
 
This oven is often used for long thermal cures and wafer bonding.  It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate).  A manual needle valve for nitrogen purge has been installed on the back of the oven.
 
This oven is often used for long thermal cures and wafer bonding.  It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate).  A manual needle valve for nitrogen purge has been installed on the back of the oven.
  
== Specifications ==
+
==Specifications==
* Maximum Temperature = 330 C (no active cooling)
 
* Gases: N2, manually set with needle valve (not programmable)
 
* Multi-step programmable temperature ramps
 
* Programmable atmospheric purge (for cooling)
 
  
== Documentation ==
+
*Maximum Temperature = 330 C (no active cooling)
* {{todo|User Manual}}
+
*Gases: N2, manually set with needle valve (not programmable)
 +
*Multi-step programmable temperature ramps
 +
*Programmable atmospheric purge (for cooling)
 +
 
 +
==Documentation==
 +
 
 +
*
 +
{{Instructions}}
 +
 
 +
[https://wiki.nanotech.ucsb.edu/w/images/8/8e/Heratherm_instructions.pdf Instructions]
 +
 
 +
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Latest revision as of 15:25, 13 September 2022

Oven 4 (Thermo-Fisher HeraTherm)
Oven4.jpg
Location Bay 6
Tool Type Lithography
Manufacturer Thermo Scientific
Model HeraTherm
Description Programmable Oven

Primary Supervisor Michael Barreraz
(805) 893-4147
mikebarreraz@ece.ucsb.edu

Secondary Supervisor

Aidan Hopkins


Recipes N/A

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About

This oven is often used for long thermal cures and wafer bonding. It has programmable temperature ramps and hold times, but the ramp rate is only "low/med./high" (not an exact ramp rate). A manual needle valve for nitrogen purge has been installed on the back of the oven.

Specifications

  • Maximum Temperature = 330 C (no active cooling)
  • Gases: N2, manually set with needle valve (not programmable)
  • Multi-step programmable temperature ramps
  • Programmable atmospheric purge (for cooling)

Documentation

Template:Instructions

Instructions