Difference between revisions of "OLD - PECVD2 Recipes"
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*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dERkYm85bGtYQVpjVk5GTGJuMkg2anc&usp=drive_web#gid=sharing Nitride2 Thickness uniformity 2014] |
*[https://docs.google.com/spreadsheet/ccc?key=0AnwBU1s4JQo2dERkYm85bGtYQVpjVk5GTGJuMkg2anc&usp=drive_web#gid=sharing Nitride2 Thickness uniformity 2014] |
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| − | *Deposition Rate: ≈ 7. |
+ | *Deposition Rate: ≈ 7.93 nm/min (users must calibrate this prior to critical deps) |
| − | *Refractive Index: ≈ 1. |
+ | *Refractive Index: ≈ 1.961 |
*Stress ≈ 495MPa |
*Stress ≈ 495MPa |
||
*HF etch rate:~49nm/min |
*HF etch rate:~49nm/min |
||
Revision as of 16:29, 3 December 2014
PECVD 2 (Advanced Vacuum)
Photos
SiN deposition (PECVD #2)
- Deposition Rate: ≈ 7.93 nm/min (users must calibrate this prior to critical deps)
- Refractive Index: ≈ 1.961
- Stress ≈ 495MPa
- HF etch rate:~49nm/min
SiO2 deposition (PECVD #2)
- Deposition Rate: ≈ 28.50 nm/min (users must calibrate this prior to critical deps)
- Refractive Index: ≈ 1.474
- Stress ≈ -259MPa
- HF etch rate~626nm/min
LS SiN deposition (PECVD #2)
- Deposition Rate: ≈ 7.96 nm/min (users must calibrate this prior to critical deps)
- Refractive Index: ≈ 1.937
- Stress ≈ 2.77MPa
- HF etch rate~47nm/min