Difference between revisions of "NanoFab Process Group"
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(→Dicing Procedures: changed link from "new/fresh tape" to just "on tape" - will include the variation on the target page.) |
(added Equip Cal section, and 3 Litho tools I know we have procedures for.) |
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* [[ProcessGroup: Unaxis PM3 Process Verification Procedure|Unaxis PM3: Process Verification Procedure]] |
* [[ProcessGroup: Unaxis PM3 Process Verification Procedure|Unaxis PM3: Process Verification Procedure]] |
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* [[ProcessGroup: IBD Process Verification Procedure|Veeco IBD: Process Verification Procedure]] |
* [[ProcessGroup: IBD Process Verification Procedure|Veeco IBD: Process Verification Procedure]] |
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| + | == Equipment Calibration Procedures == |
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| + | === Lithography Tools === |
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| + | * [[ProcessGroup: GCA 6300 Stepper|GCA 6300 Stepper #1: Calibration Procedure]] |
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| + | * [[ProcessGroup: GCA AutoStep 200, Stepper|GCA AutoStep 200, Stepper #2: Calibration procedure]] |
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| + | * [[ProcessGroup: ASML 5500 Stepper|ASML 5500 Stepper#3: Calibration Verification/Update procedure]] |
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Revision as of 16:48, 4 September 2018
This page lists various processes used internally by the NanoFab Process Group.
Dicing Procedures
Photoresist Application, Cleaning and Shipping
- PR Spin for Dicing Protect - ~800nm thick PR only (UV6)
- PR Clean of UV-6
- Shipping Samples on Dicing Tape+Frame
Dicing Alignment Mark Exposure
For providing alignment marks to use while dicing.
- ASML Stepper #3: Dicing Alignment Guides
- How to program the ASML to shoot some alignment markers for use during dicing.
Process Control Calibration Procedures
Etching Tools
- Unaxis PM1: Indium Phosphide Etch Verification Procedure
- ICP#1/2: SiO2 Etch Verification Procedure
- PlasmaTherm SLR: SiO2 Etch Verification Procedure
- PlasmaTherm DSEiii: Si Etch Verification Procedure
Deposition Tools
- PECVD#1: Process Verification Procedure
- PECVD#2: Process Verification Procedure
- Unaxis PM3: Process Verification Procedure
- Veeco IBD: Process Verification Procedure