Molecular Vapor Deposition
The Molecular Vapor deposition system is used for deposition of a monolayer-thick fluorocarbon film for producing extremely hydrophobic surfaces used for anti-sticking layers for nanoimprinting or anti-stiction layers for MEMS. The system has integrated Oxygen plasma cleaning for organic removal and surface activation and can be run at temperatures up to 80°C. Multi-step recipes can be created. The system is currently configured for FDTS (perflourodecyltricholorsilane) and water to producing the coatings. Up to 6” wafers can be coated in the system.