Difference between revisions of "Mike Silva"
Jump to navigation
Jump to search
(→Tools) |
|||
(2 intermediate revisions by the same user not shown) | |||
Line 18: | Line 18: | ||
|-valign="top" |
|-valign="top" |
||
| |
| |
||
− | *[[High Temp Oven (Blue M)]] |
||
− | *[[Sputter 5 (Lesker AXXIS)]] |
||
− | *[[Ion Beam Deposition (Veeco NEXUS)]] |
||
− | *[[ICP Etch 2 (Panasonic E640)]] |
||
− | *[[Plasma Clean (Gasonics 2000)]] |
||
|| |
|| |
||
+ | |||
− | *[[HF Vapor Etch]] |
||
− | * [[Tube Furnace Wafer Bonding (Thermco)]] |
||
− | * [[Step Profilometer (Dektak 6M)]] |
||
− | * [[Film Stress (Tencor Flexus)]] |
||
− | * [[Optical Film Thickness (Nanometric)]] |
||
|} |
|} |
Latest revision as of 08:31, 14 April 2023
|
About
Information to come.
Current Work
Information to come.
Tools
Mike Silva is in charge of the following tools: