Difference between revisions of "Mike Silva"
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|room = 1109B |
|room = 1109B |
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|phone = (805) 893-3096 |
|phone = (805) 893-3096 |
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− | |cell = (805) |
+ | |cell = (805) 245-9356 |
|email = silva@ece.ucsb.edu |
|email = silva@ece.ucsb.edu |
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}} |
}} |
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|-valign="top" |
|-valign="top" |
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− | *[[High Temp Oven (Blue M)]] |
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− | *[[Sputter 5 (Lesker AXXIS)]] |
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− | *[[Ion Beam Deposition (Veeco NEXUS)]] |
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− | *[[ICP Etch 2 (Panasonic E640)]] |
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− | *[[Plasma Clean (Gasonics 2000)]] |
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+ | |||
− | *[[HF Vapor Etch]] |
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− | * [[Tube Furnace Wafer Bonding (Thermco)]] |
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− | * [[Step Profilometer (Dektak 6M)]] |
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− | * [[Film Stress (Tencor Flexus)]] |
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− | * [[Optical Film Thickness (Nanometric)]] |
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Latest revision as of 08:31, 14 April 2023
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About
Information to come.
Current Work
Information to come.
Tools
Mike Silva is in charge of the following tools: