Difference between revisions of "Mike Silva"
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{{staff|{{PAGENAME}} |
{{staff|{{PAGENAME}} |
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| − | |position = |
+ | |position = Equipment Engineering Manager |
| − | |room = |
+ | |room = 1109B |
| − | |phone = (805) |
+ | |phone = (805) 893-3096 |
| − | |cell = |
+ | |cell = (805) 245-9356 |
|email = silva@ece.ucsb.edu |
|email = silva@ece.ucsb.edu |
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}} |
}} |
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=About= |
=About= |
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| + | Information to come. |
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=Current Work= |
=Current Work= |
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| + | Information to come. |
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=Tools= |
=Tools= |
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|-valign="top" |
|-valign="top" |
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| − | *[[Sputter 5 (Lesker AXXIS)]] |
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| − | *[[PECVD 2 (Advanced Vacuum)]] |
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| − | *[[Thermal Evap 1]] |
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| − | *[[Ion Beam Deposition (Veeco NEXUS)]] |
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| − | *[[ICP Etch 2 (Panasonic E640)]] |
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| − | *[[Plasma Clean (Gasonics 2000)]] |
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| − | *[[HF Vapor Etch]] |
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| − | * [[Tube Furnace Wafer Bonding (Thermco)]] |
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| − | * [[Step Profile (Dektak IIA)]] |
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* [[Step Profilometer (Dektak 6M)]] |
* [[Step Profilometer (Dektak 6M)]] |
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| − | * [[ |
+ | * [[Plasma Clean (Gasonics 2000)]] |
| − | * [[Tencor Flexus Film Stress]] |
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| − | * [[Optical Film Thickness (Nanometric)]] |
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Revision as of 10:03, 28 October 2021
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About
Information to come.
Current Work
Information to come.
Tools
Mike Silva is in charge of the following tools: