Difference between revisions of "Mike Silva"
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Abrahamsen (talk | contribs) (→About) |
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{{staff|{{PAGENAME}} |
{{staff|{{PAGENAME}} |
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| − | |position = |
+ | |position = Equipment Engineering Manager |
|room = 1109B |
|room = 1109B |
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| − | |phone = (805) |
+ | |phone = (805) 893-3096 |
|cell = (805) 245-9356 |
|cell = (805) 245-9356 |
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|email = silva@ece.ucsb.edu |
|email = silva@ece.ucsb.edu |
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| Line 8: | Line 8: | ||
=About= |
=About= |
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| + | Information to come. |
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| − | Father of many. Grenade dropper. Willing and ready. Experienced. |
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=Current Work= |
=Current Work= |
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| + | Information to come. |
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| − | Nope. |
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=Tools= |
=Tools= |
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|-valign="top" |
|-valign="top" |
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| |
| |
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| − | *[[DUV Flood Expose]] |
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*[[High Temp Oven (Blue M)]] |
*[[High Temp Oven (Blue M)]] |
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| − | *[[Sputter 5 (Lesker AXXIS)]] |
+ | *[[Sputter 5 (Lesker AXXIS)]] |
| − | *[[PECVD 2 (Advanced Vacuum)]] |
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| − | *[[Thermal Evap 1]] |
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*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
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*[[ICP Etch 2 (Panasonic E640)]] |
*[[ICP Etch 2 (Panasonic E640)]] |
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| Line 29: | Line 26: | ||
*[[HF Vapor Etch]] |
*[[HF Vapor Etch]] |
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* [[Tube Furnace Wafer Bonding (Thermco)]] |
* [[Tube Furnace Wafer Bonding (Thermco)]] |
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| − | * [[Step Profile (Dektak IIA)]] |
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* [[Step Profilometer (Dektak 6M)]] |
* [[Step Profilometer (Dektak 6M)]] |
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| − | * [[Ellipsometer (Rudolph)]] |
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* [[Film Stress (Tencor Flexus)]] |
* [[Film Stress (Tencor Flexus)]] |
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* [[Optical Film Thickness (Nanometric)]] |
* [[Optical Film Thickness (Nanometric)]] |
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Revision as of 09:21, 6 April 2021
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About
Information to come.
Current Work
Information to come.
Tools
Mike Silva is in charge of the following tools: