Difference between revisions of "Mike Silva"
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|position = Senior Development Engineer |
|position = Senior Development Engineer |
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|room = 1109B |
|room = 1109B |
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| − | |phone = (805) 839- |
+ | |phone = (805) 839-3096 |
| − | |cell = (805) |
+ | |cell = (805) 450-2263 |
|email = silva@ece.ucsb.edu |
|email = silva@ece.ucsb.edu |
||
}} |
}} |
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| Line 18: | Line 18: | ||
|-valign="top" |
|-valign="top" |
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| |
| |
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| − | *[[DUV Flood Expose]] |
||
*[[High Temp Oven (Blue M)]] |
*[[High Temp Oven (Blue M)]] |
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| − | *[[Sputter 5 (Lesker AXXIS)]] |
+ | *[[Sputter 5 (Lesker AXXIS)]] |
| − | *[[PECVD 2 (Advanced Vacuum)]] |
||
| − | *[[Thermal Evap 1]] |
||
*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
||
*[[ICP Etch 2 (Panasonic E640)]] |
*[[ICP Etch 2 (Panasonic E640)]] |
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| Line 29: | Line 26: | ||
*[[HF Vapor Etch]] |
*[[HF Vapor Etch]] |
||
* [[Tube Furnace Wafer Bonding (Thermco)]] |
* [[Tube Furnace Wafer Bonding (Thermco)]] |
||
| − | * [[Step Profile (Dektak IIA)]] |
||
* [[Step Profilometer (Dektak 6M)]] |
* [[Step Profilometer (Dektak 6M)]] |
||
| − | * [[Ellipsometer (Rudolph)]] |
||
* [[Film Stress (Tencor Flexus)]] |
* [[Film Stress (Tencor Flexus)]] |
||
* [[Optical Film Thickness (Nanometric)]] |
* [[Optical Film Thickness (Nanometric)]] |
||
Revision as of 09:43, 25 April 2019
|
About
Information to come.
Current Work
Information to come.
Tools
Mike Silva is in charge of the following tools: