Difference between revisions of "Mechanical Polisher (Allied)"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(initial Page)
 
(One intermediate revision by one other user not shown)
Line 2: Line 2:
 
|picture=AlliedPolisher10-1110.jpg
  
|picture=AlliedPolisher10-1110.jpg
 
|type = Wet Processing
  
|type = Wet Processing
−
|super= Brian Lingg
 +
|super= Bill Millerski
 
|location=ESB 111x?
  
|location=ESB 111x?
 
|description = Mechanical Polisher
  
|description = Mechanical Polisher
Line 23: Line 23:
   
 
== Operating Procedures ==
  
== Operating Procedures ==
  +
* ''To Be Added''
  +
  +
== Recipes ==
 
* ''To Be Added''
  
* ''To Be Added''

Revision as of 08:32, 28 October 2021

Mechanical Polisher (Allied)
AlliedPolisher10-1110.jpg
Tool Type Wet Processing
Location ESB 111x?
Supervisor Bill Millerski
Supervisor Phone (805) 893-2655
Supervisor E-Mail wmillerski@ucsb.edu
Description Mechanical Polisher
Manufacturer Allied High Tech Products Inc.
Model 10-1110
Sign up for this tool


About

The Allied Polisher allows for bulk thinning of substrates, and fine polishing of optical waveguide facets. Various materials are typically lapped/polished, such as Silicon GaAs, InP.

Detailed Specs

  • Max. Substrate Size
  • Lapping Films available:
    • 10µm AlOx
    • 5µm AlOx
    • 2µm AlOx
    • 1µm AlOx
    • 0.5 AlOx

Operating Procedures

  • To Be Added

Recipes

  • To Be Added
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Mechanical_Polisher_(Allied)&oldid=159371"