Difference between revisions of "Maskless Aligner (Heidelberg MLA150)"

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Revision as of 15:29, 2 October 2020

UnderConstruction.jpg

Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.


Maskless Aligner (Heidelberg MLA150)
MLA150 Heidelberg Bay 6 Photo.jpg
Tool Type Lithography
Location Bay 6
Supervisor Biljana Stamenic
Supervisor Phone (805) 893-4002
Supervisor E-Mail biljana@ece.ucsb.edu
Description Maskless I-Line Photolithography
Manufacturer Heidelberg Instruments
Model MLA150
Materials I-Line Photoresists


About

The MLA150 allows for arbitrary direct patterning of I-Line photoresists, directly from a CAD drawing/file, with alignment to arbitrary features on the sample. The system uses a digital micromirror device ("DMD", an array of MEMS mirrors) for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.

The system has a continuous, automatic autofocus, using either a pneumatic or optical detection. This enables lithography on non-planar or curved substrates. We also have the high-aspect ratio (variable/long focal length) option installed for very thick (~70µm) photoresists.

Depending on the exposure options and write area, MLA is able to expose a 100mm wafer in about 30min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.

Lastly, the greyscale lithography is possible, producing repeatable, slanted or tapered structures in photoresist or photo-active dielectrics like SU-8.

Detailed Specifications

  • Wafer size:
  • Wafer / substrate thickness:
  • Exposure optics:
    • Laser #1: 375nm
    • Laser #2: 405nm
  • Focus modes:
  • Alignment:
    • Modes?
    • Accuracy:
    • Repetability
  • Additional manufacturer options:
    • Focus option?
    • Dual lasers?
    • High-resolution option?
  • Uniformity:
  • Write speeds:


Documentation

Design Tools/Info

Recipes