Difference between revisions of "Maskless Aligner (Heidelberg MLA150)"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(initial page with placeholders)
 
(link to MLA150 recipes)
Line 41: Line 41:
 
* [[MLA150 - Design Guidelines]]
 
* [[MLA150 - Design Guidelines]]
 
* [[MLA150 - CAD Files and Templates]]
 
* [[MLA150 - CAD Files and Templates]]
  +
  +
== Recipes ==
  +
* '''Recipes > Lithography >''' [[MLA150 Recipes|'''<u>MLA150</u>''']]
  +
** ''Starting recipes for various I-Line photoresists''

Revision as of 22:25, 13 September 2020

UnderConstruction.jpg

Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.


Maskless Aligner (Heidelberg MLA150)
Tool Type Lithography
Location Bay 6
Supervisor Biljana Stamenic
Supervisor Phone (805) 893-4002
Supervisor E-Mail biljana@ece.ucsb.edu
Description Maskless I-Line Photolithography
Manufacturer Heidelberg Instruments
Model MLA150
Materials I-Line Photoresists


About

The MLA150 allows for arbitrary direct patterning of I-Line photoresists, directly from a CAD drawing/file, and alignment to arbitrary features on the sample. The system uses a optical digital light process (MEMS light-field patterning) to programatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.

Detailed Specifications

  • Wafer size:
  • Wafer / substrate thickness:
  • Exposure optics:
    • Laser #1:
    • Laser #2:
  • Focus modes:
  • Alignment:
    • Modes?
    • Accuracy:
    • Repetability
  • Additional manufacturer options (none installed on our systems):
    • Focus option?
    • Dual lasers?
    • High-resolution option?
  • Uniformity:
  • Write speeds:


Documentation

Design Tools/Info

Recipes

  • Recipes > Lithography > MLA150
    • Starting recipes for various I-Line photoresists