Difference between revisions of "Maskless Aligner (Heidelberg MLA150)"

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(→‎About: updated some specs)
(→‎Video Trainings: added old video training back)
 
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{{tool2|{{PAGENAME}}
{{tool|{{PAGENAME}}
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|picture=MLA150_Heidelberg_Bay_6_Photo.jpg
|picture=MLA150.jpg
 
 
|type = Lithography
 
|type = Lithography
 
|super = Biljana Stamenic
 
|super = Biljana Stamenic
 +
|super2 = Lee Sawyer
 
|location = Bay 6
 
|location = Bay 6
|description = Maskless I-Line Photolithography
+
|description = Direct-Write (Maskless) I-Line Photolithography
|manufacturer = Heidelberg Instruments
+
|manufacturer = [https://heidelberg-instruments.com Heidelberg Instruments]
 
|model = MLA150
 
|model = MLA150
 +
|toolid=32
 
|materials = I-Line Photoresists
 
|materials = I-Line Photoresists
 
}}  
 
}}  
 
==About==
 
==About==
The MLA150 allows for arbitrary direct patterning of I-Line photoresists, directly from a CAD drawing/file, with alignment to arbitrary features on the sample. The system uses a  [https://en.wikipedia.org/wiki/Digital_micromirror_device digital micromirror device] ("DMD", an array of MEMS mirrors) for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.
+
The MLA150 allows for arbitrary direct-write patterning of I-Line photoresists from an uploaded CAD drawing/file (GDS, DXF, CIF etc.). The system uses a  [https://en.wikipedia.org/wiki/Digital_micromirror_device digital micromirror device] ("DMD", an array of MEMS mirrors) for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.
  
The system has a continuous, automatic autofocus, using either a pneumatic or optical detection. This enables lithography on non-planar or curved substrates. We also have the high-aspect ratio (variable/long focal length) option installed for very thick (~70µm) photoresists.
+
Depending on the exposure options and write area, the MLA is able to expose a 100mm wafer in about 30min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.  
  
Depending on the exposure options and write area, MLA is able to expose a 100mm wafer in about 30min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.
+
The system has a continuous, automatic autofocus, using pneumatic and optical detection. This potentially enables lithography on non-planar or curved substrates.
  
Lastly, the greyscale lithography is possible, producing repeatable, slanted or tapered structures in photoresist or photo-active dielectrics like SU-8.
+
The software allows for custom drawings and aligment marks to be exposed onto any feature located on the microscope.
 +
 
 +
Greyscale lithography allows for photoresist profiles with repeatable slanted or tapered structures, via an 8-bit greyscale bitmap or layer-structured DXF file.
 +
 
 +
The high-aspect ratio (variable/long focal length) option enables vertical sidewalls on very thick (~100µm) photoresists.
 +
 
 +
[[File:MLA150 Spatial Light Modulator Description.png|alt=Schematic of spatial light modulator exposure technique.|none|thumb|550x600px|Exposure method using a spatial light modulator, continuously moving stage and continuous autofocus. See [https://heidelberg-instruments.com/key-features/maskless-laser-lithography/ HIMT] for more info.]]
  
 
==Detailed Specifications==
 
==Detailed Specifications==
  
*Wafer size:  
+
*Maximum Writeable Area: 150 x 150mm
*Wafer / substrate thickness:  
+
*Substrate size: 9-inch square or 200mm round down to 5-mm pieces
 +
**''Contact staff for pieces < 5 mm.''
 +
*Wafer / substrate thickness: Max. 9mm / Min. 0.1mm
 
*Exposure optics:
 
*Exposure optics:
 +
**[https://en.wikipedia.org/wiki/Digital_micromirror_device Digital micromirror device (DMD)]
 
**Laser #1: 375nm
 
**Laser #1: 375nm
 
**Laser #2: 405nm
 
**Laser #2: 405nm
* Focus modes:
+
**Lens NA = 0.95
* Alignment:
+
*Alignment Accuracy: Global ≤ 500nm; Local ("Field") ≤ 250nm
** Modes?
+
*Linewidth variation: ≤100nm (relevant to stitched exposure fields)
** Accuracy:  
+
*Minimum Features: ~0.40µm line/space demonstrated with 0.5µm-thick PR. Requires additional effort.  ≥1µm is relatively straightforward.
** Repetability
+
*Write Grid (Address Unit):
 +
**High Quality Mode (std.): 40nm
 +
**Fast Mode: 100nm
  
 
*Additional manufacturer options:
 
*Additional manufacturer options:
**Focus option?
+
**High-resolution option (Write Mode 1)
**Dual lasers?
+
**Extended Focus Range
**High-resolution option?
+
**Variable Focal Depth
 +
**Optical (laser) Autofocus in addition to std. Pneumatic Autofocus
 +
**Greyscale Mode
 +
**(No backside alignment)
 +
 
 +
==Documentation==
  
* Uniformity:
+
===Operating Procedures===
* Write speeds:
 
  
 +
*[https://wiki.nanotech.ucsb.edu/w/images/e/ec/MLA150_SOP_Rev_L_%28LS%29.docx.pdf MLA150 - Standard Operating Procedure] - updated Oct 7th 2022
 +
**''Includes File-upload procedure, CAD Conversion, Exposure and Alignment.''
 +
*[[MLA150 - Large Image GDS Generation|Large Image Patterning]] - one way to generate a GDS file out of an arbitrary image (eg. JPG, BMP, PNG etc.)
 +
*[https://wiki.nanotech.ucsb.edu/w/images/4/48/MLA150_Substrate_Template_Rules.pdf Substrate Templates] have been updated, reflecting allowed sample sizes for each focus mode.
  
==Documentation==
+
===[[MLA150 - Troubleshooting|<u>Troubleshooting & Known Bugs</u>]]===
*[[MLA150 - Standard Operating Procedure]]
+
 
 +
*''See the above page for troubleshooting/recovery info and workarounds to known bugs.''
 +
*Double-side polished transparent substrates can sometimes produce difficulties, due to the exposure light reflecting from the wafer underside. Many users have found ways to make them work properly - contact [[Demis D. John|staff]] if you need help with this.
 +
 
 +
===Video Trainings===
 +
'''Important:''' You must be authorized by a supervisor to use the tool! The video training is only one part of the training. Contact [[Biljana Stamenic|'''<u>the Supervisor</u>''']] for training procedures.
 +
 
 +
* '''[https://gauchocast.hosted.panopto.com/Panopto/Pages/Viewer.aspx?id=5813cf18-37cb-48f1-aee6-acd50055c65e Heidelberg MLA150 Training Video]'''
 +
** ''Bookmarks in the video can point you to specific solutions/procedures.''
 +
* '''UPDATES to the Video Training''': ''please review the addendums below:''
 +
** New software has been installed, the '''[https://wiki.nanotech.ucsb.edu/w/images/e/ec/MLA150_SOP_Rev_L_%28LS%29.docx.pdf SOP]''' shows the newer menu options.
 +
** CRITICAL: There are now TWO locations on which you must choose "Optical Autofocus".  Failure to do so can result in <u>system damage</u>.
 +
** [https://wiki.nanotech.ucsb.edu/w/images/4/48/MLA150_Substrate_Template_Rules.pdf Substrate Templates] have been updated, which are currently not reflected in the video.
 +
** Numerous solved issues have been added to the [[MLA150 - Troubleshooting|'''Troubleshooting page''']].
 +
 
 +
==Design Tools/Info==
 +
 
 +
*[[MLA150 - Design Guidelines|Design Guidelines + Tips]]
 +
*[[MLA150 - CAD Files and Templates|CAD Files and Templates]]
 +
*[https://wiki.nanotech.ucsb.edu/w/images/4/48/MLA150_Substrate_Template_Rules.pdf Substrate Template Guidelines]
  
== Design Tools/Info ==
+
==Recipes==
* [[MLA150 - Design Guidelines]]
 
* [[MLA150 - CAD Files and Templates]]
 
  
== Recipes ==
+
*'''Recipes > Lithography >''' '''<u>[[Maskless Aligner Recipes#Maskless Aligner .28Heidelberg MLA150.29|Maskless Aligner MLA150]]</u>'''
* '''Recipes > Lithography >''' '''<u>[[Maskless Aligner Recipes#Maskless Aligner .28Heidelberg MLA150.29|Maskless Aligner MLA150]]</u>'''
+
**''Starting recipes for various I-Line photoresists''
** ''Starting recipes for various I-Line photoresists''
 

Latest revision as of 15:29, 23 November 2022

Maskless Aligner (Heidelberg MLA150)
MLA150 Heidelberg Bay 6 Photo.jpg
Location Bay 6
Tool Type Lithography
Manufacturer Heidelberg Instruments
Model MLA150
Description Direct-Write (Maskless) I-Line Photolithography

Primary Supervisor Biljana Stamenic
(805) 893-4002
biljana@ece.ucsb.edu

Secondary Supervisor

Lee Sawyer


Materials I-Line Photoresists
Recipes N/A

SignupMonkey: Sign up for this tool


About

The MLA150 allows for arbitrary direct-write patterning of I-Line photoresists from an uploaded CAD drawing/file (GDS, DXF, CIF etc.). The system uses a digital micromirror device ("DMD", an array of MEMS mirrors) for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.

Depending on the exposure options and write area, the MLA is able to expose a 100mm wafer in about 30min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.

The system has a continuous, automatic autofocus, using pneumatic and optical detection. This potentially enables lithography on non-planar or curved substrates.

The software allows for custom drawings and aligment marks to be exposed onto any feature located on the microscope.

Greyscale lithography allows for photoresist profiles with repeatable slanted or tapered structures, via an 8-bit greyscale bitmap or layer-structured DXF file.

The high-aspect ratio (variable/long focal length) option enables vertical sidewalls on very thick (~100µm) photoresists.

Schematic of spatial light modulator exposure technique.
Exposure method using a spatial light modulator, continuously moving stage and continuous autofocus. See HIMT for more info.

Detailed Specifications

  • Maximum Writeable Area: 150 x 150mm
  • Substrate size: 9-inch square or 200mm round down to 5-mm pieces
    • Contact staff for pieces < 5 mm.
  • Wafer / substrate thickness: Max. 9mm / Min. 0.1mm
  • Exposure optics:
  • Alignment Accuracy: Global ≤ 500nm; Local ("Field") ≤ 250nm
  • Linewidth variation: ≤100nm (relevant to stitched exposure fields)
  • Minimum Features: ~0.40µm line/space demonstrated with 0.5µm-thick PR. Requires additional effort. ≥1µm is relatively straightforward.
  • Write Grid (Address Unit):
    • High Quality Mode (std.): 40nm
    • Fast Mode: 100nm
  • Additional manufacturer options:
    • High-resolution option (Write Mode 1)
    • Extended Focus Range
    • Variable Focal Depth
    • Optical (laser) Autofocus in addition to std. Pneumatic Autofocus
    • Greyscale Mode
    • (No backside alignment)

Documentation

Operating Procedures

Troubleshooting & Known Bugs

  • See the above page for troubleshooting/recovery info and workarounds to known bugs.
  • Double-side polished transparent substrates can sometimes produce difficulties, due to the exposure light reflecting from the wafer underside. Many users have found ways to make them work properly - contact staff if you need help with this.

Video Trainings

Important: You must be authorized by a supervisor to use the tool! The video training is only one part of the training. Contact the Supervisor for training procedures.
  • Heidelberg MLA150 Training Video
    • Bookmarks in the video can point you to specific solutions/procedures.
  • UPDATES to the Video Training: please review the addendums below:
    • New software has been installed, the SOP shows the newer menu options.
    • CRITICAL: There are now TWO locations on which you must choose "Optical Autofocus". Failure to do so can result in system damage.
    • Substrate Templates have been updated, which are currently not reflected in the video.
    • Numerous solved issues have been added to the Troubleshooting page.

Design Tools/Info

Recipes