Difference between revisions of "Maskless Aligner (Heidelberg MLA150)"

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{{WIP}}
 
 
{{tool|{{PAGENAME}}
 
{{tool|{{PAGENAME}}
 
|picture=MLA150_Heidelberg_Bay_6_Photo.jpg
 
|picture=MLA150_Heidelberg_Bay_6_Photo.jpg
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|super = Biljana Stamenic
 
|super = Biljana Stamenic
 
|location = Bay 6
 
|location = Bay 6
|description = Maskless I-Line Photolithography
+
|description = Direct-Write (Maskless) I-Line Photolithography
|manufacturer = Heidelberg Instruments
+
|manufacturer = [https://heidelberg-instruments.com Heidelberg Instruments]
 
|model = MLA150
 
|model = MLA150
 +
|toolid=32
 
|materials = I-Line Photoresists
 
|materials = I-Line Photoresists
 
}}  
 
}}  
 
==About==
 
==About==
The MLA150 allows for arbitrary direct patterning of I-Line photoresists, directly from an uploaded CAD drawing/file (GDS, DXF, CIF etc.). The system uses a  [https://en.wikipedia.org/wiki/Digital_micromirror_device digital micromirror device] ("DMD", an array of MEMS mirrors) for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.
+
The MLA150 allows for arbitrary direct-write patterning of I-Line photoresists from an uploaded CAD drawing/file (GDS, DXF, CIF etc.). The system uses a  [https://en.wikipedia.org/wiki/Digital_micromirror_device digital micromirror device] ("DMD", an array of MEMS mirrors) for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.
  
The system has a continuous, automatic autofocus, using either a pneumatic or optical detection. This enables lithography on non-planar or curved substrates. We also have the high-aspect ratio (variable/long focal length) option installed for very thick (~70µm) photoresists.
+
Depending on the exposure options and write area, the MLA is able to expose a 100mm wafer in about 30min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.  
  
Depending on the exposure options and write area, the MLA is able to expose a 100mm wafer in about 30min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm. Arbitrary drawings can be exposed onto any feature located on the microscope.
+
The system has a continuous, automatic autofocus, using pneumatic and optical detection. This potentially enables lithography on non-planar or curved substrates.
  
Greyscale lithography is capable of producing repeatable slanted or tapered structures in photoresist or photo-active dielectrics like SU-8.
+
The software allows for custom drawings and aligment marks to be exposed onto any feature located on the microscope.
 +
 
 +
Greyscale lithography allows for photoresist profiles with repeatable slanted or tapered structures, via an 8-bit greyscale bitmap or layer-structured DXF file.
 +
 
 +
The high-aspect ratio (variable/long focal length) option enables vertical sidewalls on very thick (~100µm) photoresists.
 +
 
 +
[[File:MLA150 Spatial Light Modulator Description.png|alt=Schematic of spatial light modulator exposure technique.|none|thumb|550x600px|Exposure method using a spatial light modulator, continuously moving stage and continuous autofocus. See [https://heidelberg-instruments.com/key-features/maskless-laser-lithography/ HIMT] for more info.]]
  
 
==Detailed Specifications==
 
==Detailed Specifications==
  
*Wafer size:  
+
*Maximum Writeable Area: 150 x 150mm
*Wafer / substrate thickness: Max. 9mm.
+
*Substrate size: 9-inch square or 200mm round down to 5-mm pieces
**Thicker is possible, contact supervisor.  
+
**''Contact staff for pieces < 5 mm.''
 +
*Wafer / substrate thickness: Max. 9mm / Min. 0.1mm
 
*Exposure optics:
 
*Exposure optics:
**[https://en.wikipedia.org/wiki/Digital_micromirror_device Digital micromirror device (DMD)]  
+
**[https://en.wikipedia.org/wiki/Digital_micromirror_device Digital micromirror device (DMD)]
 
**Laser #1: 375nm
 
**Laser #1: 375nm
 
**Laser #2: 405nm
 
**Laser #2: 405nm
* Alignment Accuracy: ≤ 200nm
+
**Lens NA = 0.95
 +
*Alignment Accuracy: Global 500nm; Local ("Field") ≤ 250nm
 +
*Linewidth variation: ≤100nm (relevant to stitched exposure fields)
 +
*Minimum Features: ~0.40µm line/space demonstrated with 0.5µm-thick PR. Requires additional effort.  ≥1µm is relatively straightforward.
 +
*Write Grid (Address Unit):
 +
**High Quality Mode (std.): 40nm
 +
**Fast Mode: 100nm
  
 
*Additional manufacturer options:
 
*Additional manufacturer options:
 
**High-resolution option (Write Mode 1)
 
**High-resolution option (Write Mode 1)
 
**Extended Focus Range
 
**Extended Focus Range
** Variable Focal Depth
+
**Variable Focal Depth
** Optical (laser) Autofocus in addition to Pneumatic Autofocus
+
**Optical (laser) Autofocus in addition to std. Pneumatic Autofocus
 +
**Greyscale Mode
 +
**(No backside alignment)
 +
 
 
==Documentation==
 
==Documentation==
*[[MLA150 - Standard Operating Procedure]]
 
  
== Design Tools/Info ==
+
===Operating Procedures===
* [[MLA150 - Design Guidelines]]
+
 
* [[MLA150 - CAD Files and Templates]]
+
*[https://wiki.nanotech.ucsb.edu/w/images/c/c0/MLA150_SOP_Rev_K_%28LS%29.pdf MLA150 - Standard Operating Procedure] - updated Jan 5th 2022
 +
**''Includes File-upload procedure, CAD Conversion, Exposure and Alignment.''
 +
*[[MLA150 - Large Image GDS Generation|Large Image Patterning]] - one way to generate a GDS file out of an arbitrary image (eg. JPG, BMP, PNG etc.)
 +
 
 +
===[[MLA150 - Troubleshooting|<u>Troubleshooting & Known Bugs</u>]]===
 +
 
 +
*''See the above page for troubleshooting/recovery info and workarounds to known bugs.''
 +
*Double-side polished transparent substrates can sometimes produce difficulties, due to the exposure light reflecting from the wafer underside. Many users have found ways to make them work properly - contact [[Demis D. John|staff]] if you need help with this.
 +
 
 +
===Video Trainings===
 +
'''Important:''' You must be <u>authorized by a supervisor</u> to use the tool!  The video below is provided for reference only, and does not substitute training by NanoFab  staff. Contact [[Biljana Stamenic|the Supervisor]] for authorization.
 +
 
 +
*[https://gauchocast.hosted.panopto.com/Panopto/Pages/Viewer.aspx?id=5813cf18-37cb-48f1-aee6-acd50055c65e '''Heidelberg MLA150 Training Video (on GauchoSpace/Panopto)''']
 +
**''Bookmarks in the video can point you to specific solutions/procedures.''
 +
*'''<u>UPDATES to the Video Training</u>''': please review the addendums below:
 +
**[https://wiki.nanotech.ucsb.edu/w/images/4/48/MLA150_Substrate_Template_Rules.pdf Substrate Templates] have been updated, which are currently not reflected in the video.
 +
**Numerous solved issues have been added to the [[MLA150 - Troubleshooting|'''Troubleshooting page''']].
 +
 
 +
==Design Tools/Info==
 +
 
 +
*[[MLA150 - Design Guidelines|Design Guidelines + Tips]]
 +
*[[MLA150 - CAD Files and Templates|CAD Files and Templates]]
 +
*[https://wiki.nanotech.ucsb.edu/w/images/4/48/MLA150_Substrate_Template_Rules.pdf Substrate Template Guidelines]
 +
 
 +
==Recipes==
  
== Recipes ==
+
*'''Recipes > Lithography >''' '''<u>[[Maskless Aligner Recipes#Maskless Aligner .28Heidelberg MLA150.29|Maskless Aligner MLA150]]</u>'''
* '''Recipes > Lithography >''' '''<u>[[Maskless Aligner Recipes#Maskless Aligner .28Heidelberg MLA150.29|Maskless Aligner MLA150]]</u>'''
+
**''Starting recipes for various I-Line photoresists''
** ''Starting recipes for various I-Line photoresists''
 

Revision as of 12:31, 22 March 2022

Maskless Aligner (Heidelberg MLA150)
MLA150 Heidelberg Bay 6 Photo.jpg
Tool Type Lithography
Location Bay 6
Supervisor Biljana Stamenic
Supervisor Phone (805) 893-4002
Supervisor E-Mail biljana@ece.ucsb.edu
Description Direct-Write (Maskless) I-Line Photolithography
Manufacturer Heidelberg Instruments
Model MLA150
Materials I-Line Photoresists
Sign up for this tool


About

The MLA150 allows for arbitrary direct-write patterning of I-Line photoresists from an uploaded CAD drawing/file (GDS, DXF, CIF etc.). The system uses a digital micromirror device ("DMD", an array of MEMS mirrors) for patterning the exposure light-field, to programmatically expose digitized patterns directly onto the sample - no glass photomasks/reticles are required.

Depending on the exposure options and write area, the MLA is able to expose a 100mm wafer in about 30min, and achieves minimum features sizes around 0.5µm, with overlay/alignment accuracy better than 200nm.

The system has a continuous, automatic autofocus, using pneumatic and optical detection. This potentially enables lithography on non-planar or curved substrates.

The software allows for custom drawings and aligment marks to be exposed onto any feature located on the microscope.

Greyscale lithography allows for photoresist profiles with repeatable slanted or tapered structures, via an 8-bit greyscale bitmap or layer-structured DXF file.

The high-aspect ratio (variable/long focal length) option enables vertical sidewalls on very thick (~100µm) photoresists.

Schematic of spatial light modulator exposure technique.
Exposure method using a spatial light modulator, continuously moving stage and continuous autofocus. See HIMT for more info.

Detailed Specifications

  • Maximum Writeable Area: 150 x 150mm
  • Substrate size: 9-inch square or 200mm round down to 5-mm pieces
    • Contact staff for pieces < 5 mm.
  • Wafer / substrate thickness: Max. 9mm / Min. 0.1mm
  • Exposure optics:
  • Alignment Accuracy: Global ≤ 500nm; Local ("Field") ≤ 250nm
  • Linewidth variation: ≤100nm (relevant to stitched exposure fields)
  • Minimum Features: ~0.40µm line/space demonstrated with 0.5µm-thick PR. Requires additional effort. ≥1µm is relatively straightforward.
  • Write Grid (Address Unit):
    • High Quality Mode (std.): 40nm
    • Fast Mode: 100nm
  • Additional manufacturer options:
    • High-resolution option (Write Mode 1)
    • Extended Focus Range
    • Variable Focal Depth
    • Optical (laser) Autofocus in addition to std. Pneumatic Autofocus
    • Greyscale Mode
    • (No backside alignment)

Documentation

Operating Procedures

Troubleshooting & Known Bugs

  • See the above page for troubleshooting/recovery info and workarounds to known bugs.
  • Double-side polished transparent substrates can sometimes produce difficulties, due to the exposure light reflecting from the wafer underside. Many users have found ways to make them work properly - contact staff if you need help with this.

Video Trainings

Important: You must be authorized by a supervisor to use the tool!  The video below is provided for reference only, and does not substitute training by NanoFab  staff. Contact the Supervisor for authorization.

Design Tools/Info

Recipes