News from the U.C. Santa Barbara Nanofabrication Facility.
Oxford PlasmaPro ICP Etcher installed
We have a new ICP etcher in Bay 2:
Oxford_ICP_Etcher_(PlasmaPro_100_Cobra)
The tool has been qualified for InP Ridge and InGaAsP Grating etches, and is intended for III-V etching in general (GaAs, GaN, GaSb etc.)
In addition, the tool is capable of Atomic Layer Etching on various materials. Contact the supervisor for training.
// John d 11:27, 29 September 2021 (PDT)
8 SiO2 etching, High-Aspect Ratio
Dr. Bill Mitchell recently published an article detailing high-aspect ratio SiO2 etching (JVST-A, May 2021) in the Plasma-Therm Fluorine ICP etcher, using a novel Ruthenium Hard Mask.
Ruthenium can be deposited using the Oxford ALD or AJA Sputter and etched in one of the Panasonic ICP's.
You can find a full process flow at the FL-ICP's Recipe Page, in this case using a Sputtered Ru hard mask and I-line stepper lithography.
// John d 08:05, 27 May 2021 (PDT)
9 Wafer Polisher available
We have added an Allied Wafer Polish tool to our equipment list. Contact Brian Lingg for more information. // John d 16:49, 10 May 2021 (PDT)
10 Digital Microscope: Olympus DSX-1000
You'll see a new digital microscope in Bay 4/Metrology, that's our new Olympus DSX-1000. We are currently developing procedures, keep an eye out for training emails.
// John d 13:49, 8 April 2021 (PDT)
11 Raith Velion: FIB/SEM Installation
We have installed a new state-of-the-art focused ion beam/electron beam tool in Bay 1.
The Raith Velion enables synchronized interferometric stage, Focused-ion Beam Lithography with ~10nm features or less, live SEM during writing, and Electron-Beam Lithography.
Learn more about the tool's capabilities at the Raith website:
Tool qualification is currently underway.
Dr. Dan Read is be the resident expert on this new tool.
// John d 06:53, 30 November 2020 (PST)
