Difference between revisions of "MVD - Wafer Coating - Process Traveler"

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(added procedure from BrianT's PDF)
 
m (→‎Removal: of FDTS Coating: added PEii etch params)
 
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Use vapor coating in a clean-dry environment process as follows:
 
Use vapor coating in a clean-dry environment process as follows:
# Use [[Ashers (Technics PEII)|Technics PEII etcher]] for 2 minutes with O2 at 300mT/100W first to “activate” the silicon surface for reaction with the FDTS.   
+
# Use [[Ashers (Technics PEII)|Technics PEII etcher]] for 2 minutes with O2 at 0.300T/100W first to “activate” the silicon surface for reaction with the FDTS.   
 
# Use Standard FDTS program on the MVD tool for this.   
 
# Use Standard FDTS program on the MVD tool for this.   
 
# Hot plate bake at ~100C for 2 minutes following deposition.   
 
# Hot plate bake at ~100C for 2 minutes following deposition.   
## H2O Contact Angle ~ 110 Degrees (measured with [[Goniometer]])
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## H2O Contact Angle ~ 110 Degrees (measured with [[Goniometer (Rame-Hart A-100)|Goniometer]])
  
 
=== Removal: of FDTS Coating ===
 
=== Removal: of FDTS Coating ===
[[Ashers (Technics PEII)|Technics PEii O2 etching]] removes this coating effectively, eg. 2min.
+
[[Ashers (Technics PEII)|Technics PEii O2 etching]] removes this coating effectively, eg. 2min at the standard 0.300T/100W.

Latest revision as of 13:38, 26 July 2020

Non-stick FDTS coating on the MVD

Used to make the wafer surface hydrophobic, used in nanoimprinting for coating the imprint master.

Use vapor coating in a clean-dry environment process as follows:

  1. Use Technics PEII etcher for 2 minutes with O2 at 0.300T/100W first to “activate” the silicon surface for reaction with the FDTS.
  2. Use Standard FDTS program on the MVD tool for this.
  3. Hot plate bake at ~100C for 2 minutes following deposition.
    1. H2O Contact Angle ~ 110 Degrees (measured with Goniometer)

Removal: of FDTS Coating

Technics PEii O2 etching removes this coating effectively, eg. 2min at the standard 0.300T/100W.