Difference between revisions of "MLA Recipes"
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Photolithography Recipes for the [[Maskless Aligner (Heidelberg MLA150)|Heidelberg MLA150]]. ''Description of litho params- different lasers available, greyscale etc.'' |
Photolithography Recipes for the [[Maskless Aligner (Heidelberg MLA150)|Heidelberg MLA150]]. ''Description of litho params- different lasers available, greyscale etc.'' |
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===Positive Resist (MLA150)=== |
===Positive Resist (MLA150)=== |
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| − | ''General notes: Hotplates used, filters, laser wavelengths, etc.'' |
+ | ''General notes: Hotplates used, filters, laser wavelengths, etc. “Soft Bake” is right after spin, “PEB” is post-exposure bake - right after exposure'' |
{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" |
{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" |
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|- bgcolor="#D0E7FF" |
|- bgcolor="#D0E7FF" |
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! width="100" |Resist |
! width="100" |Resist |
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! width="100" |Spin Cond. |
! width="100" |Spin Cond. |
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| − | ! width="75" |Bake |
+ | ! width="75" |Soft Bake |
! width="75" |Thickness |
! width="75" |Thickness |
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!Laser (nm) |
!Laser (nm) |
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! width="125" |Exposure Dose (mJ/cm<sup>2</sup>) |
! width="125" |Exposure Dose (mJ/cm<sup>2</sup>) |
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! width="100" |DeFocus |
! width="100" |DeFocus |
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| − | ! width="75" | |
+ | ! width="75" |Post-Exposure Bake |
! width="100" |Developer |
! width="100" |Developer |
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! width="125" |Developer Time |
! width="125" |Developer Time |
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===Negative Resist (MLA150)=== |
===Negative Resist (MLA150)=== |
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| − | ''General notes: Hotplates used, filters, laser wavelengths, etc.'' |
+ | ''General notes: Hotplates used, filters, laser wavelengths, etc. “Soft Bake” is right after spin, “PEB” is post-exposure bake - right after exposure. “Flood exposure” is only for AZ5214 for image reversal, after PEB.'' |
{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" |
{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" |
||
|- bgcolor="#D0E7FF" |
|- bgcolor="#D0E7FF" |
||
! width="100" |Resist |
! width="100" |Resist |
||
! width="100" |Spin Cond. |
! width="100" |Spin Cond. |
||
| − | ! width="75" |Bake |
+ | ! width="75" |Soft Bake |
! width="75" |Thickness |
! width="75" |Thickness |
||
!Laser (nm) |
!Laser (nm) |
||
Latest revision as of 21:24, 26 May 2022
Maskless Aligner (Heidelberg MLA150)
Photolithography Recipes for the Heidelberg MLA150. Description of litho params- different lasers available, greyscale etc.
Positive Resist (MLA150)
General notes: Hotplates used, filters, laser wavelengths, etc. “Soft Bake” is right after spin, “PEB” is post-exposure bake - right after exposure
| Resist | Spin Cond. | Soft Bake | Thickness | Laser (nm) | Exposure Dose (mJ/cm2) | DeFocus | Post-Exposure Bake | Developer | Developer Time | Comments |
|---|---|---|---|---|---|---|---|---|---|---|
| AZ4110 | 4 krpm/30s | 95°C/60s | ~ 1.1 µm | 405 | 240 | 5 | none | AZ400K:DI 1:4 | 50s | Used MLA design (good for isolated lines 0.8-1um) |
| AZ4330 | 4 krpm/30s | 95°C/60s | ~ 3.3 µm | 405 | 320 | 6 | none | AZ400K:DI 1:4 | 90s | Used MLA design |
| AZ4620 | ||||||||||
| SPR 220-3.0 | 2.5 krpm/30s | 115°C/90” | ~ 2.7 µm | 405 | 325 | - 4 | 115°C/90s | AZ300MIF | 60s | Used MLA design |
| SPR 955-CM0.9 | 3 krpm/30s | 95°C/90” | ~ 0.9 µm | 405 | 250 | - 7 | 110°C/90s | AZ300MIF | 60s | Used MLA design |
| THMR-3600HP | 1.5 krpm/45s250 rpm/s | 100°C/60s | 0.430µm | 405 | 180–220 | -4 | 100°C/60s | AZ300MiF | 20s | line/space:
low dose for clear-field, high does for dark-field |
Negative Resist (MLA150)
General notes: Hotplates used, filters, laser wavelengths, etc. “Soft Bake” is right after spin, “PEB” is post-exposure bake - right after exposure. “Flood exposure” is only for AZ5214 for image reversal, after PEB.
| Resist | Spin Cond. | Soft Bake | Thickness | Laser (nm) | Exposure Dose (mJ/cm2) | DeFocus | PEB | Flood | Developer | Developer Time | Comments |
|---|---|---|---|---|---|---|---|---|---|---|---|
| AZ5214 | 6 krpm/30s | 95°C/60s | ~ 1.0 µm | 375 | 35 | - 5 | 110°C/60s | 60" | AZ300MIF | 60s | Used UCSB design. Good for up to ~1.3um open line space. |
| AZnLOF2020 | 4 krpm/30s | 110°C/60s | ~ 2.1µm | 375 | 340 | - 3 | 110°C/60s | none | AZ300MIF | 90s | Used UCSB design. Good for 2um open line space. |
| SU-8 2075 | ~70µm | 375 | Extremely viscous. Pour into a wide-mouthed bottle, dispense directly from bottle. Replace napkin at end. |
Greyscale Lithography (MLA150)
Description...
| Resist | Spin Cond. | Bake | Thickness | Exposure Dose (mJ/cm2) | Focus Offset | PEB | Flood | Developer | Developer Time | Comments |
|---|---|---|---|---|---|---|---|---|---|---|
| AZ4620 | – krpm/30” | 95°C/60” | 60" | AZ300MIF | 60" |
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