Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick

Contributed by Miguel Daal, Mazin Group  -- 2018-04-24

Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer.

Place 4" polished handle wafer on hotplate set to 120°C
Apply approximately 1" diameter size puddle of crystal bond wax from the stick. Then remove from hotplate. and cool.
Align work wafer on top of handle wafer placed on the glass plate of the Logitech bonder. Align the two wafers' flats. Place 6" piece of filter paper on top of work wafer.
Turn on Logitech bonder (bottom right of machine chassis)
Close and lock Logitech bonder hatch.
On front panel of Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi.
Enter the process settings:
- [setup] -> [Temp]
  - Bonding: 120°C
  - Endpoint: 65°C
  - Offset: 20°C
  - Units: C
- [setup] -> [Vac Thres]
  - Proceed if Below: 2.4E+01 mBar
  - Abort if Below: 3.2E+01 mBar
- [setup] -> [Process Control]
  - Process: Heat + Outgas
  - Soak: 5min
  - Bond: 15min
  - O.G. Limit: 20min
  - P.P. del: 1min
- [Setup] -> [Heads]
  - Head 1 On
Start Process: [Process] -> [Start]
Process takes about 45min
- Unload when it displays Status: Ready
Turn off Logitech bonder (bottom right of machine chassis)

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