Difference between revisions of "Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick"
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− | Contributed by Miguel Daal, Mazin Group -- 2018-04-24 |
+ | ''Contributed by Miguel Daal, Mazin Group -- 2018-04-24'' |
− | Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer. |
+ | ''Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer, using the [[Wafer Bonder (Logitech WBS7)|'''Logitech WBS7 Wafer Bonder''']].'' |
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+ | *Cover Hotplate surface with tinfoil, heat hotplate to 120°C. (Keep flammable solvents away!) |
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− | * Align work wafer on top of handle wafer placed on the glass plate of the Logitech bonder. Align the two wafers' flats. Place 6" piece of filter paper on top of work wafer. |
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+ | **For mounting a 4-inch wafer, you need a good amount of wax to ensure coverage to wafer edges, eg.<u>2-3mm thick</u>. |
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+ | **Then remove wafer from hotplate. and cool. |
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+ | *Open Logitech Bonder chamber: |
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+ | **Unscrew clamp until higher than clamp arm, |
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+ | **Swing front of clamp arm to the left (Difficult to disengage), |
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+ | **Lift bonder lid (also takes some force to open - ignore vacuum reading on digital display) |
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− | *** Endpoint: 65°C |
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+ | *On the glass plate of the Logitech bonder: |
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+ | **Align work wafer on top of handle wafer placed. |
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− | *** Units: C |
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+ | **Align the two wafers' flats. |
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+ | *Place 6" piece of filter paper on top of work wafer. |
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+ | *Turn on Logitech bonder power (bottom right of machine chassis) |
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− | ** [setup] -> [Process Control] |
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− | *** |
+ | ***Endpoint: 65°C |
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− | *** |
+ | ***Units: C |
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+ | **[setup] -> [Vac Thres] |
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+ | ***P.P. del: 1min |
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+ | ***Head 1 On |
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+ | *Start Process: [Process] -> [Start] |
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+ | *If wax leaked onto the glass plate: remove glass plate and clean with Acetone+Wipe. |
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+ | **Close lid and clamp |
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+ | *Clean excess wax off your wafer using the [[Wet Benches#Automated Wet-processing Spinners .28POLOS.29|POLOS Spinners]], and an Acetone squirt bottle, followed by ISO & N2 dry (run both sides of the wafer). |
Revision as of 14:35, 15 November 2021
Contributed by Miguel Daal, Mazin Group -- 2018-04-24
Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer, using the Logitech WBS7 Wafer Bonder.
- Cover Hotplate surface with tinfoil, heat hotplate to 120°C. (Keep flammable solvents away!)
- Place 4" polished handle wafer on hotplate.
- Apply wax to center of wafer only, approximately 2-inch diameter size puddle of crystal bond wax directly from the crystalbond stick.
- For mounting a 4-inch wafer, you need a good amount of wax to ensure coverage to wafer edges, eg.2-3mm thick.
- Then remove wafer from hotplate. and cool.
- Open Logitech Bonder chamber:
- Unscrew clamp until higher than clamp arm,
- Swing front of clamp arm to the left (Difficult to disengage),
- Lift bonder lid (also takes some force to open - ignore vacuum reading on digital display)
- On the glass plate of the Logitech bonder:
- Align work wafer on top of handle wafer placed.
- Align the two wafers' flats.
- Place 6" piece of filter paper on top of work wafer.
- Turn on Logitech bonder power (bottom right of machine chassis)
- Close and lock Logitech bonder hatch.
- On front panel of Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi.
- Enter the process settings:
- [setup] -> [Temp]
- Bonding: 120°C
- Endpoint: 65°C
- Offset: 20°C
- Units: C
- [setup] -> [Vac Thres]
- Proceed if Below: 2.4E+01 mBar
- Abort if Below: 3.2E+01 mBar
- [setup] -> [Process Control]
- Process: Heat + Outgas
- Soak: 5min
- Bond: 15min
- O.G. Limit: 20min
- P.P. del: 1min
- [Setup] -> [Heads]
- Head 1 On
- [setup] -> [Temp]
- Start Process: [Process] -> [Start]
- Process takes about 45min
- Unload when it displays Status: Ready
- If wax leaked onto the glass plate: remove glass plate and clean with Acetone+Wipe.
- Turn off Logitech bonder (bottom right of machine chassis)
- Close lid and clamp
- Clean excess wax off your wafer using the POLOS Spinners, and an Acetone squirt bottle, followed by ISO & N2 dry (run both sides of the wafer).