Difference between revisions of "Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick"

Revision as of 14:35, 15 November 2021

Contributed by Miguel Daal, Mazin Group  -- 2018-04-24

Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer, using the Logitech WBS7 Wafer Bonder.

Cover Hotplate surface with tinfoil, heat hotplate to 120°C. (Keep flammable solvents away!)
Place 4" polished handle wafer on hotplate.
Apply wax to center of wafer only, approximately 2-inch diameter size puddle of crystal bond wax directly from the crystalbond stick.
- For mounting a 4-inch wafer, you need a good amount of wax to ensure coverage to wafer edges, eg.2-3mm thick.
- Then remove wafer from hotplate. and cool.
Open Logitech Bonder chamber:
- Unscrew clamp until higher than clamp arm,
- Swing front of clamp arm to the left (Difficult to disengage),
- Lift bonder lid (also takes some force to open - ignore vacuum reading on digital display)
On the glass plate of the Logitech bonder:
- Align work wafer on top of handle wafer placed.
- Align the two wafers' flats.
Place 6" piece of filter paper on top of work wafer.
Turn on Logitech bonder power (bottom right of machine chassis)
Close and lock Logitech bonder hatch.
On front panel of Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi.
Enter the process settings:
- [setup] -> [Temp]
  - Bonding: 120°C
  - Endpoint: 65°C
  - Offset: 20°C
  - Units: C
- [setup] -> [Vac Thres]
  - Proceed if Below: 2.4E+01 mBar
  - Abort if Below: 3.2E+01 mBar
- [setup] -> [Process Control]
  - Process: Heat + Outgas
  - Soak: 5min
  - Bond: 15min
  - O.G. Limit: 20min
  - P.P. del: 1min
- [Setup] -> [Heads]
  - Head 1 On
Start Process: [Process] -> [Start]
Process takes about 45min
- Unload when it displays Status: Ready
If wax leaked onto the glass plate: remove glass plate and clean with Acetone+Wipe.
Turn off Logitech bonder (bottom right of machine chassis)
- Close lid and clamp
Clean excess wax off your wafer using the POLOS Spinners, and an Acetone squirt bottle, followed by ISO & N2 dry (run both sides of the wafer).

@@ Line 1: / Line 1: @@
- Contributed by Miguel Daal, Mazin Group  -- 2018-04-24
+ ''Contributed by Miguel Daal, Mazin Group  -- 2018-04-24''
-Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer.
+''Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer, using the [[Wafer Bonder (Logitech WBS7)|'''Logitech WBS7 Wafer Bonder''']].''
-* Place 4" polished handle wafer on hotplate set to 120°C
+*Cover Hotplate surface with tinfoil, heat hotplate to 120°C.  (Keep flammable solvents away!)
-* Apply approximately 1" diameter  size puddle of crystal bond wax from the stick. Then remove from hotplate. and cool.
+*Place 4" polished handle wafer on hotplate.
-* Align work wafer on top of handle wafer placed on the glass plate of the Logitech bonder. Align the two wafers' flats.   Place 6" piece of filter paper on top of work wafer.
+*Apply wax to center of wafer only, approximately <u>2-inch diameter</u> size puddle of crystal bond wax directly from the crystalbond stick.
-* Turn on Logitech bonder (bottom right of machine chassis)
+**For mounting a 4-inch wafer, you need a good amount of wax to ensure coverage to wafer edges, eg.<u>2-3mm thick</u>.
-* Close and lock Logitech bonder hatch.
+**Then remove wafer from hotplate. and cool.
-* On front panel of  Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi.
+*Open Logitech Bonder chamber:
-* Enter the process settings:
+**Unscrew clamp until higher than clamp arm,
-** [setup] -> [Temp]
+**Swing front of clamp arm to the left (Difficult to disengage),
-** Bonding: 120°C       Endpoint: 65°C
+**Lift bonder lid (also takes some force to open - ignore vacuum reading on digital display)
-** Offset: 20°C            Units: C
+*On the glass plate of the Logitech bonder:
-** [setup] -> [Vac Thres]
+**Align work wafer on top of handle wafer placed.
-** Proceed if Below: 2.4E+01 mBar
+**Align the two wafers' flats.
-** Abort if Below: 3.2E+01 mBar
+*Place 6" piece of filter paper on top of work wafer.
-** [setup] -> [Process Control]
+*Turn on Logitech bonder power (bottom right of machine chassis)
-** Process: Heat + Outgas
+*Close and lock Logitech bonder hatch.
-** Soak: 5min            O.G. Limit: 20min
+*On front panel of  Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi.
-** Bond: 15min          P.P. del: 1min
+*Enter the process settings:
-** [Setup] -> [Heads]
+**[setup] -> [Temp]
-** Head 1 On
+***Bonding: 120°C
-* Start Process: [Process] -> [Start]
+***Endpoint: 65°C
-* Process takes about 45min
+***Offset: 20°C
-* Turn off Logitech bonder (bottom right of machine chassis)
+***Units: C
+**[setup] -> [Vac Thres]
+***Proceed if Below: 2.4E+01 mBar
+***Abort if Below: 3.2E+01 mBar
+**[setup] -> [Process Control]
+***Process: Heat + Outgas
+***Soak: 5min
+***Bond: 15min
+***O.G. Limit: 20min
+***P.P. del: 1min
+**[Setup] -> [Heads]
+***Head 1 On
+*Start Process: [Process] -> [Start]
+*Process takes about 45min
+**Unload when it displays ''Status: Ready''
+*If wax leaked onto the glass plate: remove glass plate and clean with Acetone+Wipe.
+*Turn off Logitech bonder (bottom right of machine chassis)
+**Close lid and clamp
+*Clean excess wax off your wafer using the [[Wet Benches#Automated Wet-processing Spinners .28POLOS.29|POLOS Spinners]], and an Acetone squirt bottle, followed by ISO & N2 dry (run both sides of the wafer).

Difference between revisions of "Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick"

Revision as of 14:35, 15 November 2021

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