Difference between revisions of "Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick"
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(draft recipe) |
(pasted miguel's procedure) |
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| + | Contributed by Miguel Daal, Mazin Group -- 2018-04-24 |
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| − | Draft only - in progress. -- Demis 2019-01-28 |
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| + | Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer. |
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| − | * Heat up lower substrate on hotplate at 135°C |
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| + | * Place 4" polished handle wafer on hotplate set to 120°C |
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| − | * Apply XYZ grams of crystalbond wax, with stick, to the surface. Spread so that enough wax is present so that entire underside of upper substrate will be in contact with wax. Remove from hotplate and cool. If wax got on the underside, can spin face-down on POLOS spinner @ 2000rpm with ACE squirt bottle to remove. |
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| + | * Apply approximately 1" diameter size puddle of crystal bond wax from the stick. Then remove from hotplate. and cool. |
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| − | * Place carrier wafer on Logitech bonder surface, wax face-up. |
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| + | * Align work wafer on top of handle wafer placed on the glass plate of the Logitech bonder. Align the two wafers' flats. Place 6" piece of filter paper on top of work wafer. |
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| − | * Place sample to be bonded on top |
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| + | * Turn on Logitech bonder (bottom right of machine chassis) |
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| − | * Place 110mm chemical filter paper on top |
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| − | * Close |
+ | * Close and lock Logitech bonder hatch. |
| + | * On front panel of Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi. |
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| − | * Run recipe: |
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| + | * Enter the process settings: |
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| − | ** XYZ °C |
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| + | ** [setup] -> [Temp] |
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| − | ** XYZ seconds |
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| + | ** Bonding: 120°C Endpoint: 65°C |
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| − | ** Vacuum etc.? |
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| + | ** Offset: 20°C Units: C |
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| + | ** [setup] -> [Vac Thres] |
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| + | ** Proceed if Below: 2.4E+01 mBar |
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| + | ** Abort if Below: 3.2E+01 mBar |
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| + | ** [setup] -> [Process Control] |
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| + | ** Process: Heat + Outgas |
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| + | ** Soak: 5min O.G. Limit: 20min |
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| + | ** Bond: 15min P.P. del: 1min |
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| + | ** [Setup] -> [Heads] |
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| + | ** Head 1 On |
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| + | * Start Process: [Process] -> [Start] |
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| + | * Process takes about 45min |
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| + | * Turn off Logitech bonder (bottom right of machine chassis) |
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Revision as of 08:51, 21 July 2019
Contributed by Miguel Daal, Mazin Group -- 2018-04-24
Procedure for wax-mounting a 100mm Silicon wafer to another 100mm silicon carrier wafer.
- Place 4" polished handle wafer on hotplate set to 120°C
- Apply approximately 1" diameter size puddle of crystal bond wax from the stick. Then remove from hotplate. and cool.
- Align work wafer on top of handle wafer placed on the glass plate of the Logitech bonder. Align the two wafers' flats. Place 6" piece of filter paper on top of work wafer.
- Turn on Logitech bonder (bottom right of machine chassis)
- Close and lock Logitech bonder hatch.
- On front panel of Logitech bonder, confirm that Applied Pressure gauge is set to 5 psi.
- Enter the process settings:
- [setup] -> [Temp]
- Bonding: 120°C Endpoint: 65°C
- Offset: 20°C Units: C
- [setup] -> [Vac Thres]
- Proceed if Below: 2.4E+01 mBar
- Abort if Below: 3.2E+01 mBar
- [setup] -> [Process Control]
- Process: Heat + Outgas
- Soak: 5min O.G. Limit: 20min
- Bond: 15min P.P. del: 1min
- [Setup] -> [Heads]
- Head 1 On
- Start Process: [Process] -> [Start]
- Process takes about 45min
- Turn off Logitech bonder (bottom right of machine chassis)