Difference between revisions of "Lithography Recipes"
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==General Information== | ==General Information== | ||
− | This page contains information and links to recipes/datasheets spin-coated materials used in the facility. | + | This page contains information and links to recipes/datasheets spin-coated materials used in the facility. |
− | *'''[[#PositivePR |Photoresists]]''' | + | {| class="wikitable" |
− | **[[#Photolithography_Recipes |Photo Lithography Recipe section]] | + | |+ |
− | **[[#PositivePR |Stocked Lithography Chemical + Datasheets]] | + | !Table of Contents |
− | *'''[[#EBLPR |E-beam Lithography Resists]]''' | + | |- |
− | *'''[[#NanoImprinting |Nanoimprinting Resists]]''' | + | | |
+ | *'''[[#PositivePR |Photoresists]]''' | ||
+ | **[[#Photolithography_Recipes |Photo Lithography Recipe section]] | ||
+ | ***''Has links to starting recipes (spin, bake, exposure, develop etc.).'' | ||
+ | ***''Substrate, surface materials, pattern size can often affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.'' | ||
+ | **[[#PositivePR |Stocked Lithography Chemical + Datasheets]] | ||
+ | ***''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.'' | ||
+ | *'''[[#EBLPR |E-beam Lithography Resists]]''' | ||
+ | **[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]] | ||
+ | ***''Has links to starting recipes. Substrates and patterns play a large role in process parameters.'' | ||
+ | **[[#EBLPR |EBL Photoresist Datasheets]] | ||
+ | ***''Provided for reference, also showing starting recipes and usage info.'' | ||
+ | *'''[[#NanoImprinting |Nanoimprinting Resists]]''' | ||
+ | **''Datasheets are provided with starting recipes and usage info.'' | ||
+ | **''Recipes provided are for use in the [[Nano-Imprint_(Nanonex_NX2000) |Nano-Imprint (Nanonex NX2000)]] system only.'' | ||
− | *'''[[#Underlayers |Underlayers]]''' | + | *'''[[#Underlayers |Underlayers]]''' |
− | *'''Holography''' | + | **''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.'' |
− | *'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''': Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes. | + | **''Datasheets are provided.'' |
− | *'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]''' | + | *[[#Lift-Off_Techniques |'''Lift-Off Techniques''']] |
− | *'''[[#AdhesionPromoters |Adhesion Promoters]]''' | + | **''Verified Recipes for lift-off using various photolith. tools'' |
+ | **''General educational description of this technique and it's limitations/considerations.'' | ||
+ | *'''[[Lithography Recipes#Holography Recipes|Holography]]''' | ||
+ | **''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.'' | ||
+ | **''Recipes for silicon substrates are provided, and have been translated to other substrates by users.'' | ||
+ | *'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''': | ||
+ | **[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials. | ||
+ | **''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.'' | ||
+ | **''Datasheets are provided for reference on use of the materials.'' | ||
+ | *'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]''' | ||
+ | **[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials. | ||
+ | **''Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.'' | ||
+ | **''Datasheets provided with usage info.'' | ||
+ | *'''[[#AdhesionPromoters |Adhesion Promoters]]''' | ||
+ | **''These are used to improve wetting of photoresists to your substrate.'' | ||
+ | **''Datasheets are provided on use of these materials.'' | ||
− | *'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]''' | + | *'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]''' |
− | *'''[[#Developers |Developers and Removers]]''' | + | **[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]] |
+ | ***''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.'' | ||
+ | **[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]] | ||
+ | ***''Recipes for usage of some spin-on dielectrics.'' | ||
+ | *'''[[#Developers |Developers and Removers]]''' | ||
+ | **''Datasheets provided for reference.'' | ||
+ | **''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.'' | ||
+ | |} | ||
==Photolithography Recipes== | ==Photolithography Recipes== | ||
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|- bgcolor="#D0E7FF" | |- bgcolor="#D0E7FF" | ||
|<!-- INTENTIONALLY LEFT BLANK --><br> | |<!-- INTENTIONALLY LEFT BLANK --><br> | ||
− | ! colspan="2" bgcolor="#D0E7FF" align="center" |'''[[Contact Alignment Recipes|Contact | + | ! colspan="2" bgcolor="#D0E7FF" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]''' |
− | ! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Stepper Recipes|Steppers]]''' | + | ! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Stepper Recipes|<big>Steppers Recipes</big>]]''' |
− | |||
|- | |- | ||
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists''' | ! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists''' | ||
{{LithRecipe Table}} | {{LithRecipe Table}} | ||
− | |||
− | |||
|- | |- | ||
| bgcolor="#D0E7FF" align="center" |AZ4110 | | bgcolor="#D0E7FF" align="center" |AZ4110 | ||
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| bgcolor="EEFFFF" | | | bgcolor="EEFFFF" | | ||
| bgcolor="EEFFFF" |A | | bgcolor="EEFFFF" |A | ||
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|- | |- | ||
! bgcolor="#D0E7FF" align="center" |'''Negative Resists''' | ! bgcolor="#D0E7FF" align="center" |'''Negative Resists''' | ||
{{LithRecipe Table}} | {{LithRecipe Table}} | ||
− | |||
|- bgcolor="EEFFFF" | |- bgcolor="EEFFFF" | ||
| bgcolor="#D0E7FF" align="center" |AZ5214-EIR | | bgcolor="#D0E7FF" align="center" |AZ5214-EIR | ||
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|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}} | |{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}} | ||
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|- | |- | ||
! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings''' | ! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings''' | ||
− | {{LithRecipe Table}} | + | {{LithRecipe Table}} |
− | |||
|- bgcolor="EEFFFF" | |- bgcolor="EEFFFF" | ||
| bgcolor="#D0E7FF" align="center" |DUV42-P | | bgcolor="#D0E7FF" align="center" |DUV42-P | ||
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− | ! bgcolor="#D0E7FF" align="center" | | + | ! bgcolor="#D0E7FF" align="center" | |
− | {{LithRecipe Table}} | + | {{LithRecipe Table}} |
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|} | |} | ||
<!-- end Litho Recipes table --> | <!-- end Litho Recipes table --> |
Revision as of 14:01, 17 June 2020
General Information
This page contains information and links to recipes/datasheets spin-coated materials used in the facility.
Table of Contents |
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|
Photolithography Recipes
- R = Recipe is available. Clicking this link will take you to the recipe.
- A = Material is available for use, but no recipes are provided.
Photolithography Recipes
| ||||||||
---|---|---|---|---|---|---|---|---|
Contact Aligner Recipes | Steppers Recipes | |||||||
Positive Resists | SUSS MJB-3 | SUSS MA-6 | Stepper 1 (GCA 6300) |
Stepper 2 (AutoStep 200) |
Stepper 3 (ASML DUV) |
MLA150 (Heidelberg) | ||
AZ4110 | R | R | A | A | ||||
AZ4210 | R | R | A | A | ||||
AZ4330RS | R | R | A | A | ||||
OCG 825-35CS | A | A | A | A | ||||
SPR 950-0.8 | A | A | A | A | ||||
SPR 955 CM-0.9 | A | R | R | R | ||||
SPR 955 CM-1.8 | A | A | R | R | ||||
SPR 220-3.0 | R | R | R | R | ||||
SPR 220-7.0 | R | R | R | R | ||||
THMR-IP3600 HP D | A | A | ||||||
UV6-0.8 | R | |||||||
UV210-0.3 | R | |||||||
UV26-2.5 | A | |||||||
Negative Resists | SUSS MJB-3 | SUSS MA-6 | Stepper 1 (GCA 6300) |
Stepper 2 (AutoStep 200) |
Stepper 3 (ASML DUV) |
MLA150 (Heidelberg) | ||
AZ5214-EIR | R | R | R | R | ||||
AZnLOF 2020 | R | R | R | R | ||||
AZnLOF 2035 | A | A | A | A | ||||
AZnLOF 2070 | A | A | A | A | ||||
AZnLOF 5510 | A | A | R | R | ||||
UVN30-0.8 | R | |||||||
SU-8 2005,2010, 2015 | A | R | A | A | ||||
SU-8 2075 | A | A | A | A | ||||
NR9-1000,3000,6000PY | R | R | A | R | ||||
Anti-Reflection Coatings | SUSS MJB-3 | SUSS MA-6 | Stepper 1 (GCA 6300) |
Stepper 2 (AutoStep 200) |
Stepper 3 (ASML DUV) |
MLA150 (Heidelberg) | ||
DUV42-P | R | |||||||
DS-K101-304 | R | |||||||
SUSS MJB-3 | SUSS MA-6 | Stepper 1 (GCA 6300) |
Stepper 2 (AutoStep 200) |
Stepper 3 (ASML DUV) |
MLA150 (Heidelberg) |
E-Beam Lithography Recipes
- Under Development.
Automated Coat/Develop System Recipes (S-Cubed Flexi)
Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.
To Be Added
Nanoimprinting Recipes
- Thermal Nanoimprint Process and Tutorial
- UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process
Holography Recipes
- Standard Holography Process - on SiO2 on Si
- Holography Process Variations - Set-up Angle - Etching into SiO2 and Si
- Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width
- Reduce SiO2 Nanowire Diameter - Thermal Oxidation - Vapor HF Etching
Low-K Spin-On Dielectric Recipes
Lift-Off Techniques
- Description/Tutorial
- Lift-Off Tutorial and Limits
- How it works, process limits and considerations for designing your process
- I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner
- DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer
Chemicals Stocked + Datasheets
The following is a list of the lithography chemicals we have available in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.