Difference between revisions of "Lithography Recipes"

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(reorder - recipes at top)
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* '''[[#SpinOnDielectrics | Low-K Spin-on Dielectrics]]''':  Datasheets are provided for BCB, Photo-BCB, and SOG for reference on use.  Some recipes are provided in the [[#Low-K_Spin-On_Dielectric_Recipes | Low-K Spin-On Dielectric Recipes section]].
 
* '''[[#SpinOnDielectrics | Low-K Spin-on Dielectrics]]''':  Datasheets are provided for BCB, Photo-BCB, and SOG for reference on use.  Some recipes are provided in the [[#Low-K_Spin-On_Dielectric_Recipes | Low-K Spin-On Dielectric Recipes section]].
 
* '''[[#Developers | Developers and Removers]]''': Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching. Datasheets provided for reference.
 
* '''[[#Developers | Developers and Removers]]''': Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching. Datasheets provided for reference.
 
== Lift-Off Techniques  ==
 
 
*{{fl|Liftoff-Techniques.pdf|Description/Tutorial}}
 
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
 
 
== Chemical Datasheets  ==
 
''The following is a list of the lithography chemicals we have available in the lab, with links to the datasheets for each.  The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.''
 
{|
 
|- valign="top"
 
| width="400" |
 
;<div id="PositivePR"><big>Positive Photoresists</big></div>
 
'''''i-line and broadband'''''
 
*{{fl|AXP4000pb-Datasheet.pdf|AZP4000 (AZ4110, AZ4210, AZ4330)}}
 
*{{fl|OCG825-Positive-Resist-Datasheet.pdf|OCG825}}
 
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
 
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
 
*{{fl|THMR_iP_3500_iP3600.pdf|THMR-3600HP-1 (thin i-line and Holography)}}
 
*{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|THMR-3600HP-2 (thin i-line and Holography)}}
 
*{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|THMR-3600HP-3 (thin i-line and Holography)}}
 
'''''DUV-248nm'''''
 
*{{fl|UV210-Positive-Resist-Datasheet.pdf|UV210-0.3}}
 
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
 
*{{fl|UV26-Positive-Resist-Datasheet.pdf|UV26-2.5}}
 
 
 
;<div id="NegativePR"><big>Negative Photoresists</big></div>
 
'''''i-line and broadband'''''
 
*{{fl|AZ5214-Negative-Resist-Datasheet.pdf|AZ5214}}
 
*{{fl|AZnLOF5510-Negative-Resist-Datasheet.pdf|AZnLOF5510}}
 
*{{fl|AZnLOF2020-Negative-Resist-Datasheet.pdf|AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070)}}
 
*{{fl|NR9-1000PY-revA.pdf|Futurrex NR9-1000PY(use AZ300MIF dev)}}
 
*{{fl|NR9-3000PY-revA.pdf|Futurrex NR9-3000PY(use AZ300MIF dev)}}
 
*{{fl|NR9-6000PY-revA.pdf|Futurrex NR9-6000PY(use AZ300MIF dev)}}
 
*{{fl|SU-8-2015-revA.pdf|SU-8-2005,2010, 2015}}
 
*{{fl|SU-8-2075-revA.pdf|SU-8-2075}}
 
'''''DUV-248nm'''''
 
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30-0.8}}
 
 
 
;<div id="Underlayers"><big>Underlayers</big></div>
 
 
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
 
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
 
 
 
;<div id="EBLPR"><big>E-beam resists</big></div>
 
 
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
 
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
 
 
 
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
 
 
*{{fl|NX1020-Nanoimprinting-Datasheet.pdf|NX1020}}
 
*{{fl|MRI-7020-Nanoimprinting-Datasheet.pdf|MRI-7020}}
 
*{{fl|Mr-UVCur21.pdf|MR-UVCur21}}
 
*{{fl|OrmoStamp-NIL-Lithography-UV-Soft-RevA.pdf|Ormostamp}}
 
 
|
 
;<div id="ContrastEnhancement"><big>Contrast Enhancement Materials</big></div>
 
 
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
 
 
 
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
 
 
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC (i-line)}}
 
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P (DUV) (For AR2 replacement)}}
 
*{{fl|DS-K101-Anti-Reflective-Coating.pdf|DS-K101 (DUV developable BARC)}}
 
 
 
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
 
 
*HMDS
 
*AP3000 BCB Adhesion Promoter
 
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
 
*{{fl|OrmoPrime-NIL-Adhesion-RevA.pdf|Ormoprime08-Ormostsmp Adhesion Promoter}}
 
 
 
;<div id="SpinOnDielectrics"><big>Spin-On Dielectrics</big></div>
 
 
''Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass''
 
 
*{{fl|BCB-cyclotene-3000-revA.pdf|BCB, Cyclotene 3022-46(Not Photosensitive)}}
 
*{{fl|BCB-cyclotene-4000-revA.pdf|PhotoBCB, Cyclotene 4022-40(Negative Polarity)}}
 
*{{fl|BCB-adhesion.pdf|BCB Adhesion Notes from Vendor}}
 
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
 
 
 
;<div id="Developers"><big>Developers</big></div>
 
 
*{{fl|AZ400K-Developer-Datasheet.pdf|AZ400K (AZ400K, AZ400K1:4)}}
 
*{{fl|AZ300MIF-Developer-Datasheet.pdf|AZ300MIF}}
 
*DS2100 BCB Developer
 
*SU-8 Developer
 
*101A Developer (for DUV Flood Exposed PMGI)
 
 
 
;<div id="PRRemovers"><big>Photoresist Removers</big></div>
 
 
*[http://www.microchemicals.com/products/remover_stripper/nmp.html AZ NMP]
 
** ''This replaces {{fl|1165-Resist-Remover.pdf|1165}}''
 
*{{fl|AZ300T-Resist-Remover.pdf|AZ300T}}
 
*{{fl|RemoverPG-revA.pdf|Remover PG, SU-8 stripper}}
 
*AZ EBR ("Edge Bead Remover", PGMEA)
 
 
|}
 
  
 
== Photolithography Recipes  ==
 
== Photolithography Recipes  ==
Line 323: Line 214:
 
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
 
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
 +
 +
== Lift-Off Techniques  ==
 +
 +
*{{fl|Liftoff-Techniques.pdf|Description/Tutorial}}
 +
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
 +
 +
== Chemical Datasheets  ==
 +
''The following is a list of the lithography chemicals we have available in the lab, with links to the datasheets for each.  The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.''
 +
{|
 +
|- valign="top"
 +
| width="400" |
 +
;<div id="PositivePR"><big>Positive Photoresists</big></div>
 +
'''''i-line and broadband'''''
 +
*{{fl|AXP4000pb-Datasheet.pdf|AZP4000 (AZ4110, AZ4210, AZ4330)}}
 +
*{{fl|OCG825-Positive-Resist-Datasheet.pdf|OCG825}}
 +
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
 +
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
 +
*{{fl|THMR_iP_3500_iP3600.pdf|THMR-3600HP-1 (thin i-line and Holography)}}
 +
*{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|THMR-3600HP-2 (thin i-line and Holography)}}
 +
*{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|THMR-3600HP-3 (thin i-line and Holography)}}
 +
'''''DUV-248nm'''''
 +
*{{fl|UV210-Positive-Resist-Datasheet.pdf|UV210-0.3}}
 +
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
 +
*{{fl|UV26-Positive-Resist-Datasheet.pdf|UV26-2.5}}
 +
 +
 +
;<div id="NegativePR"><big>Negative Photoresists</big></div>
 +
'''''i-line and broadband'''''
 +
*{{fl|AZ5214-Negative-Resist-Datasheet.pdf|AZ5214}}
 +
*{{fl|AZnLOF5510-Negative-Resist-Datasheet.pdf|AZnLOF5510}}
 +
*{{fl|AZnLOF2020-Negative-Resist-Datasheet.pdf|AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070)}}
 +
*{{fl|NR9-1000PY-revA.pdf|Futurrex NR9-1000PY(use AZ300MIF dev)}}
 +
*{{fl|NR9-3000PY-revA.pdf|Futurrex NR9-3000PY(use AZ300MIF dev)}}
 +
*{{fl|NR9-6000PY-revA.pdf|Futurrex NR9-6000PY(use AZ300MIF dev)}}
 +
*{{fl|SU-8-2015-revA.pdf|SU-8-2005,2010, 2015}}
 +
*{{fl|SU-8-2075-revA.pdf|SU-8-2075}}
 +
'''''DUV-248nm'''''
 +
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30-0.8}}
 +
 +
 +
;<div id="Underlayers"><big>Underlayers</big></div>
 +
 +
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
 +
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
 +
 +
 +
;<div id="EBLPR"><big>E-beam resists</big></div>
 +
 +
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
 +
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
 +
 +
 +
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
 +
 +
*{{fl|NX1020-Nanoimprinting-Datasheet.pdf|NX1020}}
 +
*{{fl|MRI-7020-Nanoimprinting-Datasheet.pdf|MRI-7020}}
 +
*{{fl|Mr-UVCur21.pdf|MR-UVCur21}}
 +
*{{fl|OrmoStamp-NIL-Lithography-UV-Soft-RevA.pdf|Ormostamp}}
 +
 +
|
 +
;<div id="ContrastEnhancement"><big>Contrast Enhancement Materials</big></div>
 +
 +
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
 +
 +
 +
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
 +
 +
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC (i-line)}}
 +
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P (DUV) (For AR2 replacement)}}
 +
*{{fl|DS-K101-Anti-Reflective-Coating.pdf|DS-K101 (DUV developable BARC)}}
 +
 +
 +
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
 +
 +
*HMDS
 +
*AP3000 BCB Adhesion Promoter
 +
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
 +
*{{fl|OrmoPrime-NIL-Adhesion-RevA.pdf|Ormoprime08-Ormostsmp Adhesion Promoter}}
 +
 +
 +
;<div id="SpinOnDielectrics"><big>Spin-On Dielectrics</big></div>
 +
 +
''Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass''
 +
 +
*{{fl|BCB-cyclotene-3000-revA.pdf|BCB, Cyclotene 3022-46(Not Photosensitive)}}
 +
*{{fl|BCB-cyclotene-4000-revA.pdf|PhotoBCB, Cyclotene 4022-40(Negative Polarity)}}
 +
*{{fl|BCB-adhesion.pdf|BCB Adhesion Notes from Vendor}}
 +
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
 +
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
 +
 +
 +
;<div id="Developers"><big>Developers</big></div>
 +
 +
*{{fl|AZ400K-Developer-Datasheet.pdf|AZ400K (AZ400K, AZ400K1:4)}}
 +
*{{fl|AZ300MIF-Developer-Datasheet.pdf|AZ300MIF}}
 +
*DS2100 BCB Developer
 +
*SU-8 Developer
 +
*101A Developer (for DUV Flood Exposed PMGI)
 +
 +
 +
;<div id="PRRemovers"><big>Photoresist Removers</big></div>
 +
 +
*[http://www.microchemicals.com/products/remover_stripper/nmp.html AZ NMP]
 +
** ''This replaces {{fl|1165-Resist-Remover.pdf|1165}}''
 +
*{{fl|AZ300T-Resist-Remover.pdf|AZ300T}}
 +
*{{fl|RemoverPG-revA.pdf|Remover PG, SU-8 stripper}}
 +
*AZ EBR ("Edge Bead Remover", PGMEA)
 +
 +
|}
  
 
[[Category:Processing]]
 
[[Category:Processing]]

Revision as of 20:07, 5 May 2018

General Information

This page contains information and links to recipes/datasheets spin-coated materials used in the facility. In general, the following information is provided for the following materials:

  • Underlayers: These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist. Datasheets are provided and some recipes are found in the Lift-Off Techniques section.
  • Holography: For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square. Recipes for silicon substrates are provided in the Holography section.
  • Anti-Reflection Coatings: These are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes. Recipes using these materials are found within the photoresist recipes themselves. Datasheets are provided for reference on use of the materials.
  • Contrast Enhancement Materials (CEM): Used for resolution enhancement. Not for use in contact aligners. Recipes using these materials are found within the photoresist recipes themselves. Datasheets also provided.
  • Adhesion Promoters: These are used to improve wetting of photoresists to your substrate. Datasheets are provided on use of these materials.

Photolithography Recipes

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Photolithography Recipes

Contact Aligners Steppers
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)


AZ4110 R R A A
AZ4210 R R A A
AZ4330RS R R A A
OCG 825-35CS A A A A
SPR 950-0.8 A A A A
SPR 955 CM-0.9 A R R R
SPR 955 CM-1.8 A A R R
SPR 220-3.0 R R R R
SPR 220-7.0 R R R R
THMR-IP3600 HP D

A A
UV6-0.8 R
UV210-0.3 R
UV26-2.5 A
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)


AZ5214-EIR R R R R
AZnLOF 2020 R R R R
AZnLOF 2035 A A A A
AZnLOF 2070 A A A A
AZnLOF 5510 A A R R
UVN2300-0.5 R
SU-8 2005,2010, 2015 A R A A
SU-8 2075 A A A A
NR9-1000,3000,6000PY A A A R
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)


E-Beam Lithography Recipes

  • Under Development.

Nanoimprinting Recipes

Holography Recipes

Low-K Spin-On Dielectric Recipes

Lift-Off Techniques

Chemical Datasheets

The following is a list of the lithography chemicals we have available in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband

DUV-248nm


Negative Photoresists

i-line and broadband

DUV-248nm


Underlayers


E-beam resists


Nanoimprinting
Contrast Enhancement Materials


Anti-Reflection Coatings


Adhesion Promoters


Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass


Developers


Photoresist Removers