Difference between revisions of "Lithography Recipes"

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== General Information ==
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__NOTOC__
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{| class="wikitable"
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!Table of Contents
 +
|-
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|
 +
==='''<big>Photolithography Processes</big>'''===
  
This page contains information and links to recipes/datasheets spin-coated materials used in the facility. In general, the following information is provided for the following materials:
+
#'''UV Optical Lithography'''  
 
+
#*[[#PositivePR |'''Stocked Lithography Chemical + Datasheets''']]
* Photoresists: Links to nominal recipes to provide the user with starting points are found in the Photo Lithography Recipe section.  Substrate, surface materials, pattern size can often affect process parameters.  Datasheets provided for reference.
+
#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.''
* E-beam Lithography Resists:  Links to nominal recipes may be provided in the E-Beam Lithography Recipe Section. Substrates and patterns play a large role in process parameters. Datasheets provided for reference.
+
#*[[#Photolithography_Recipes |'''Photo Lithography Recipe section''']]
* Underlayers:  These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.  Datasheets are provided and some recipes are found in the Lift-Off Techniques section.
+
#**''Starting recipes (spin, bake, exposure, develop etc.) for all photolith. tools.''
* Nanoimprinting Resists: Datasheets are provided.  Any recipes provided are for use in the Nanonex NX2000 system only and are found in the Nanoimprint section.
+
#**''Substrate/surface materials/pattern size can affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.''
* Holography:  For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square. Recipe on silicon provided in the holography section.
+
#**[[Contact Alignment Recipes|<u>Contact Aligner Recipes</u>]]
* Anti-Reflection Coatings:  These are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes. Recipes using these materials are found within the photoresist recipes themselves.  Datasheets are provided for reference on use of the materials.
+
#***[[Contact Alignment Recipes#Suss Aligners .28SUSS MJB-3.29|Suss MJB Aligners]]
* Contrast Enhancement Materials (CEM):  Used for resolution enhancement. Not for use in contact aligners.  Recipes using these materials are found within the photoresist recipes themselves.  Datasheets also provided.
+
#***[[Contact Alignment Recipes#Contact Aligner .28SUSS MA-6.29|Suss MA6]]
* Adhesion Promoters:  Datasheets are provided on use of these materials.  
+
#**[[Stepper Recipes|<u>Stepper Recipes</u>]]
* Low-K Spin-on Dielectrics:  Datasheets are provided for BCB, Phoot-BCB, and SOG for reference on use.  Some recipes are provided in the Low-K section.
+
#***[[Stepper Recipes#Stepper 1 .28GCA 6300.29|Stepper #1: GCA 6300]] (I-Line)
* Developers and Removers: Datasheets provided for reference.
+
#***[[Stepper Recipes#Stepper 2 .28AutoStep 200.29|Stepper #2: GCA Autostep 200]] (I-Line)
 
+
#***[[Stepper Recipes#Stepper 3 .28ASML DUV.29|Stepper #3: ASML PAS 5500/300]] (DUV)
== Lift-Off Techniques  ==
+
#**[[Direct-Write Lithography Recipes|<u>Direct-Write Recipes</u>]]
 
+
#***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29|Heidelberg MLA150]]
*{{fl|Liftoff-Techniques.pdf|Description/Tutorial}}
+
#***[[Lithography Recipes#E-Beam Lithography Recipes|JEOL JBX-6300FS EBL]]
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
+
#***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29|Raith Velion FIB]]
 
+
#**[[Lithography Recipes#Automated Coat.2FDevelop System Recipes .28S-Cubed Flexi.29|Automated Coater Recipes (S-Cubed Flexi)]]
== Chemical Datasheets  ==
+
#[[Lithography Recipes#General Photolithography Techniques|'''General Photolithography Techniques''']]
 
+
#*''Techniques for improving litho. or solving common photolith. problems.''
{|
+
#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]'''
|- valign="top"
+
#*''Verified Recipes for lift-off using various photolith. tools''
| width="400" |
+
#*''General educational description of this technique and it's limitations/considerations.''
;Positive Photoresists
+
#'''E-beam Lithography'''
 
+
#*[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]]
*{{fl|AXP4000pb-Datasheet.pdf|AZP4000 (AZ4110, AZ4210, AZ4330)}}
+
#**''Has links to starting recipes.  Substrates and patterns play a large role in process parameters.''
*{{fl|OCG825-Positive-Resist-Datasheet.pdf|OCG825}}
+
#*[[#EBLPR |EBL Photoresist Datasheets]]
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
+
#**''Provided for reference, also showing starting recipes and usage info.''
*{{fl|SPR950-Positive-Resist-Datasheet.pdf|SPR950-0.8}}
+
#'''[[Lithography Recipes#Holography Recipes|Holography]]'''
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
+
#*''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.''
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.7}}
+
#*''Recipes for silicon substrates are provided, and have been translated to other substrates by users.''
*{{fl|UV210-Positive-Resist-Datasheet.pdf|UV210-0.3}}
+
#*''Datasheets are provided with starting recipes and usage info.''
 
+
#[[Lithography Recipes#Edge-Bead Removal|'''Edge-Bead Removal''']]
;Negative Photoresists
+
#*''Edge photoresist removal methods needed for clamp-based etchers''
 
+
#*''Improves resolution for contact lithography''
*{{fl|AZ5214-Negative-Resist-Datasheet.pdf|AZ5214}}
+
|-
*{{fl|AZnLOF5510-Negative-Resist-Datasheet.pdf|AZnLOF5510}}
 
*{{fl|AZnLOF2020-Negative-Resist-Datasheet.pdf|AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070)}}
 
*{{fl|UVN2300-Negative-Resist-Datasheet.pdf|UVN2300-0.5}}
 
*{{fl|SU-8-2015-revA.pdf|SU-8-2015}}
 
*{{fl|SU-8-2075-revA.pdf|SU-8-2075}}
 
 
 
;Underlayers
 
 
 
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF-11, PMGI SF-13, PMGI SF-15)}}
 
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
 
 
 
;E-beam resists
 
 
 
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
 
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
 
 
 
;Nanoimprinting
 
 
 
*{{fl|NX1020-Nanoimprinting-Datasheet.pdf|NX1020}}
 
*{{fl|MRI-7020-Nanoimprinting-Datasheet.pdf|MRI-7020}}
 
 
|
 
|
;Contrast Enhancement Materials
 
  
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
+
==='''<big>Photolithography Chemicals/Materials</big>'''===
  
;Anti-Reflection Coatings
+
#'''[[#Underlayers  |Underlayers]]'''
 +
#*''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.''
 +
#*''Datasheets are provided.''
 +
#'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''': 
 +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
 +
#*''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.''
 +
#*''Datasheets are provided for reference on use of the materials.''
 +
#'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]'''
 +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
 +
#*''Used for resolution enhancement.  Not for use in contact aligners, typically used on I-Line Steppers.''
 +
#*''Datasheets provided with usage info.''
 +
#'''[[#AdhesionPromoters |Adhesion Promoters]]'''
 +
#*''These are used to improve wetting of photoresists to your substrate.''
 +
#*''Datasheets are provided on use of these materials.''
 +
#'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]''' 
 +
#*[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]]
 +
#**''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.''
 +
#*[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]]
 +
#**''Recipes for usage of some spin-on dielectrics.''
 +
#'''[[#Developers |Developers and Removers]]'''
 +
#*''Datasheets provided for reference.''
 +
#*''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.''
 +
|}
  
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC}}
+
==General Photolithography Techniques==
*{{fl|AR2-Anti-Reflective-Coating.pdf|AR2}}
 
*{{fl|DS-K101-Anti-Reflective-Coating.pdf|DS-K101 (developable BARC)}}
 
  
;Adhesion Promoters
+
*[[Photolithography - Improving Adhesion Photoresist Adhesion|'''HMDS Process for Improving Adhesion''']]
 +
**''Use these procedures if you are finding poor adhesion PR lifting-off), or for chemicals (like BHF) that attack the PR adhesion interface strongly.''
 +
*[[Photolithography - Manual Edge-Bead Removal Techniques|'''Edge-Bead Removal Techniques''']]
 +
**''These techniques are required for loading full-wafers into etchers that use top-side clamps, to prevent photoresist from sticking to the clamp (and potentially destroying your wafer).''
 +
**''For contact lithography, this improves the proximity of the mask plate and sample, improving resolution. For some projection systems, such as the [[Maskless Aligner (Heidelberg MLA150)|Maskless Aligner]], EBR can help with autofocus issues.''
 +
*[https://www.microchemicals.com/technical_information/reflow_photoresist.pdf '''Photoresist reflow (MicroChem)'''], to create slanted sidewalls or curved surfaces.
  
*HMDS
+
==Photolithography Recipes==
*AP3000 BCB Adhesion Promoter
 
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
 
  
;BCB and SOG
+
*<small>'''R''': ''Recipe is available. Clicking this link will take you to the recipe.''</small>
 +
*<small>'''A''': ''Material is available for use, but no recipes are provided.''</small>
  
*{{fl|BCB-cyclotene-3000-revA.pdf|BCB, Cyclotene 3022-46(Not Photosensitive)}}
+
''Click the tool title to go to recipes for that tool.''
*{{fl|BCB-cyclotene-4000-revA.pdf|PhotoBCB, Cyclotene 4022-40(Negative Polarity)}}
 
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
 
  
;Developers
+
''Click the photoresist title to get the datasheet, also found in [[Lithography Recipes#Chemicals Stocked .2B Datasheets|Stocked Chemicals + Datasheets]].''
 
+
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
*{{fl|AZ400K-Developer-Datasheet.pdf|AZ400K (AZ400K, AZ400K1:4)}}
+
|-  
*{{fl|AZ300MIF-Developer-Datasheet.pdf|AZ300MIF}}
+
! colspan="7" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div>
*DS2100 BCB Developer
 
*SU-8 Developer
 
*101A Developer (for DUV Flood Exposed PMGI)
 
 
 
;Photoresist Removers
 
 
 
*{{fl|1165-Resist-Remover.pdf|1165}}
 
*{{fl|AZ300T-Resist-Remover.pdf|AZ300T}}
 
*{{fl|PRX-127-Resist-Remover.pdf|PRX-127}}
 
*{{fl|RemoverPG-revA.pdf|Remover PG, SU-8 stripper}}
 
 
 
|}
 
 
 
== Photolithography Recipes  ==
 
 
 
{{Recipe Table Explanation}}
 
 
 
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" class="wikitable"
 
|- bgcolor="#D0E7FF"
 
! height="45" colspan="9" | <div style="font-size: 150%;">Photolithography Recipes</div>
 
|- bgcolor="#D0E7FF"
 
| <!-- INTENTIONALLY LEFT BLANK --> <br>
 
! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[Contact Alignment Recipes|Contact Aligners]]'''
 
! bgcolor="#D0E7FF" align="center" colspan="3" | '''[[Stepper Recipes|Steppers]]'''
 
  
 +
|-
 +
| bgcolor="#EAECF0" |<!-- INTENTIONALLY BLANK -->
 +
! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]'''
 +
! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]'''
 +
! align="center" |[[Direct-Write Lithography Recipes|Direct-Write Litho. Recipes]]
 
|-
 
|-
! width="150" bgcolor="#D0E7FF" align="center" | '''Positive Resists'''  
+
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''  
{{LithRecipe Table}}  
+
{{LithRecipe Table}}
 
+
|- bgcolor="EEFFFF"<!-- This is the Row color: lightblue -->
 +
| bgcolor="#D0E7FF" align="center" |[[:File:AXP4000pb-Datasheet.pdf|AZ4110]]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|A
 +
|A
 +
|
 +
|{{rl|MLA_Recipes|Positive Resist (MLA 150)}}
 +
|-<!-- This is a White row color -->
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4210]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|A
 +
|A
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4330RS]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|A
 +
|A
 +
|
 +
|{{rl|MLA_Recipes|Positive Resist (MLA 150)}}
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | AZ4110
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/a2/Az_p4620_photoresist_data_package.pdf AZ4620]
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
+
|A
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}  
+
|A
| bgcolor="EEFFFF" | A
+
|A
| bgcolor="EEFFFF" | A
+
|A
| bgcolor="EEFFFF" |  
+
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/8/8b/OCG825-Positive-Resist-Datasheet.pdf OCG 825-35CS]
 +
|A
 +
|A
 +
|A
 +
|A
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-0.9]
 +
|A
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 +
|
 +
|{{rl|MLA Recipes|Positive Resist (MLA 150)}}
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | AZ4210
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-1.8]
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}  
+
|A
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}  
+
|A
| A
+
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
| A
+
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
| <br>
+
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 +
|
 +
|{{rl|MLA Recipes|Positive Resist (MLA 150)}}
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | AZ4330RS
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-7.0]
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}  
+
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}  
+
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
| bgcolor="EEFFFF" | A
+
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
| bgcolor="EEFFFF" | A  
+
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
| bgcolor="EEFFFF" |  
+
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/b/be/3600_D%2C_D2v_Spin_Speed_Curve.pdf THMR-IP3600 HP D]
 +
|
 +
|
 +
|A
 +
|A
 +
|
 +
|{{rl|MLA Recipes|Positive Resist (MLA 150)}}
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | OCG 825-35CS
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/38/UV6-Positive-Resist-Datasheet.pdf UV6-0.8]
| A
+
|
| A
+
|
| A
+
|
| A
+
|
| <br>
+
|{{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 +
|
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/ff/UV210-Positive-Resist-Datasheet.pdf UV210-0.3]
 +
|
 +
|
 +
|
 +
|
 +
|{{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 +
|
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | SPR 950-0.8
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/UV26-Positive-Resist-Datasheet.pdf UV26-2.5]
| bgcolor="EEFFFF" | A
+
|
| bgcolor="EEFFFF" | A  
+
|
| bgcolor="EEFFFF" | A
+
|
| bgcolor="EEFFFF" | A
+
|
| bgcolor="EEFFFF" |  
+
|A
 +
|
 +
|- bgcolor="EEFFFF"
 +
! bgcolor="#D0E7FF" align="center" |'''Negative Resists'''
 +
{{LithRecipe Table}}
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-0.9
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/b/b0/AZ5214-Negative-Resist-Datasheet.pdf AZ5214-EIR]
| A
+
|{{rl|Contact_Alignment_Recipes|Negative Resist (MJB-3)}}
| A
+
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}  
+
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}  
+
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
| <br>
+
|
 +
|{{rl|MLA Recipes|Negative Resist (MLA 150)}}
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2020]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 +
|
 +
|{{rl|MLA Recipes|Negative Resist (MLA 150)}}
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-1.8
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]
| bgcolor="EEFFFF" | A  
+
| bgcolor="EEFFFF" |A
| bgcolor="EEFFFF" | A  
+
| bgcolor="EEFFFF" |A
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}  
+
| bgcolor="EEFFFF" |A
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}  
+
| bgcolor="EEFFFF" |A
| bgcolor="EEFFFF" |  
+
| bgcolor="EEFFFF" |
 +
| bgcolor="EEFFFF" |A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2070]
 +
|A
 +
|A
 +
|A
 +
|A
 +
|
 +
|A
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/8/82/AZnLOF5510-Negative-Resist-Datasheet.pdf AZnLOF 5510]
 +
|A
 +
|A
 +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/c/c9/UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf UVN30-0.8]
 +
|
 +
|
 +
|
 +
|
 +
|{{rl|Stepper Recipes|Negative Resist (ASML DUV)}}
 +
|
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | SPR 220-3.0
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/7/78/SU-8-2015-revA.pdf SU-8 2005,2010,2015]
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
+
|A
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
+
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
+
|A
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
+
|A
| <br>
+
|
|-
+
|A
| bgcolor="#D0E7FF" align="center" | SPR 220-7.0
 
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}  
 
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
| bgcolor="EEFFFF" |
 
|-
 
| bgcolor="#D0E7FF" align="center" | THMR-IP3600 HP D
 
| <br>
 
| <br>
 
| A  
 
| A  
 
| <br>
 
|-
 
| bgcolor="#D0E7FF" align="center" | UV6-0.7
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 
|-
 
| bgcolor="#D0E7FF" align="center" | UV210-0.3
 
|
 
|
 
|
 
|
 
| {{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 
|-
 
! bgcolor="#D0E7FF" align="center" | '''Negative Resists'''
 
{{LithRecipe Table}}
 
 
 
 
|- bgcolor="EEFFFF"
 
|- bgcolor="EEFFFF"
| bgcolor="#D0E7FF" align="center" | AZ5214-EIR
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/2c/SU-8-2075-revA.pdf SU-8 2075]
| {{rl|Contact_Alignment_Recipes|Negative Resist (MJB-3)}}
+
|A
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
+
|A
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
+
|A
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}  
+
|A
|
+
|
|-
+
|{{rl|MLA Recipes|Negative Resist (MLA 150)}}
| bgcolor="#D0E7FF" align="center" | AZnLOF 2020
+
|-  
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}  
+
| bgcolor="#D0E7FF" align="center" |NR9-[//wiki.nanotech.ucsb.edu/w/images/8/8f/NR9-1000PY-revA.pdf 1000],[//wiki.nanotech.ucsb.edu/w/images/7/71/NR9-3000PY-revA.pdf 3000],[//wiki.nanotech.ucsb.edu/w/images/f/f9/NR9-6000PY-revA.pdf 6000]PY
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}  
+
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
+
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}  
+
|A
|  
+
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 +
|
 +
|A
 
|- bgcolor="EEFFFF"
 
|- bgcolor="EEFFFF"
| bgcolor="#D0E7FF" align="center" | AZnLOF 2035
+
! bgcolor="#D0E7FF" align="center" |'''Anti-Reflection Coatings'''
| A
+
{{LithRecipe Table}}
| A
 
| A
 
| A
 
|
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | AZnLOF 2070
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/33/XHRiC-Anti-Reflective-Coating.pdf XHRiC-11]
| A
+
|
| A  
+
|
| A  
+
|A
| A
+
|A
|  
+
|
 +
|A
 
|- bgcolor="EEFFFF"
 
|- bgcolor="EEFFFF"
| bgcolor="#D0E7FF" align="center" | AZnLOF 5510
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/DUV42P-Anti-Reflective-Coating.pdf DUV42-P]
| A
+
|
| A
+
|
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
+
|
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}  
+
|
|  
+
|{{rl|Stepper Recipes|DUV-42P-6}}
 +
|
 +
|
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | UVN2300-0.5
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/af/DS-K101-304-Anti-Reflective-Coating.pdf DS-K101-304]
|  
+
|
|  
+
|
|  
+
|
|  
+
|
| {{rl|Stepper Recipes|Negative Resist (ASML DUV)}}  
+
|{{rl|Stepper Recipes|DS-K101-304}}
|- bgcolor="EEFFFF"
+
|
| bgcolor="#D0E7FF" align="center" | SU-8 2015
 
| A
 
| A
 
| A
 
| A
 
|
 
|-
 
| bgcolor="#D0E7FF" align="center" | SU-8 2075
 
| A
 
| A
 
| A
 
| A
 
|  
 
 
|-
 
|-
 
 
! bgcolor="#D0E7FF" align="center" |  
 
! bgcolor="#D0E7FF" align="center" |  
 
{{LithRecipe Table}}  
 
{{LithRecipe Table}}  
 +
|}
 +
<!-- end Litho Recipes table -->
  
|}
+
==Lift-Off Recipes==
  
== E-Beam Lithography Recipes  ==
+
*{{fl|Liftoff-Techniques.pdf|Lift-Off Description/Tutorial}}
*Under Development
+
**How it works, process limits and considerations for designing your process
 +
*[[Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer|I-Line Lift-Off: Bi-Layer Process with LOL2000 Underlayer]]
 +
**''Single Expose/Develop process for simplicity''
 +
**''Up to ~130nm metal thickness & ≥500nm-1000nm gap between metal.''
 +
**''Can use any I-Line litho tool (GCA Stepper, Contact aligner, MLA)''
 +
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
 +
**''Multiple processes for Metal thicknesses ~800nm to ~2.5µm''
 +
**''Uses multiple DUV Flood exposure/develop cycles to create undercut.''
 +
**''Can be transferred to other I-Line litho tools (Stepper, MLA etc.)''
 +
*[[Lift-Off with DUV Imaging + PMGI Underlayer|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
 +
**''Single-expose/develop process''
 +
**''Up to ~65nm metal thickness & ~350nm gap between metal''
 +
**''Use thicker PMGI for thicker metals''
  
== Nanoimprinting  ==
+
==[[E-Beam Lithography System (JEOL JBX-6300FS)|E-Beam Lithography Recipes (JEOL JBX-6300FS)]]==
*{{fl|Thermal-Nanoimprint-Process-Tutorial-revA.pdf|Thermal Nanoimprint Process and Tutorial}}
 
*UV-Cure Imprinting
 
  
== Low-K Dielectric  ==
+
*Under Development.
*BCB
 
*SOG
 
  
== Legacy Table ==
+
==[[Focused Ion-Beam Lithography (Raith Velion)|FIB Lithography Recipes (Raith Velion)]]==
{{Recipe Table Explanation}}
+
''To Be Added''
  
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" class="wikitable"
+
==[[Automated Coat/Develop System (S-Cubed Flexi)|Automated Coat/Develop System Recipes (S-Cubed Flexi)]]==
|- bgcolor="#D0E7FF"
+
Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.
! height="45" colspan="9" | <div style="font-size: 150%;">E-Beam Lithography Recipes</div>
+
{| class="wikitable"
|- bgcolor="#D0E7FF"
+
|+''Ask [[Tony Bosch|Staff]] if you need a new recipe.''
| <!-- INTENTIONALLY LEFT BLANK --> <br>  
+
|'''''<u>Coating Material</u>'''''
! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[Contact Alignment Recipes|Contact Aligners]]'''  
+
|'''''<u>Route/Chain</u>'''''
! bgcolor="#D0E7FF" align="center" colspan="3" | '''[[Stepper Recipes|Steppers]]'''  
+
|'''''<u>Name</u>''': User: "UCSB Users"''
! width="30" bgcolor="#D0E7FF" align="center" | '''[[Flood Exposure Recipes|Flood Expose]]'''  
+
|'''''<u>Spin Speed (krpm)</u>'''''
! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[E-Beam Lithography Recipes|E-Beam Lithography]]'''
+
|'''''<u>Bake Temp</u>'''''
 +
|'''''<u>Notes</u>'''''
 
|-
 
|-
! width="150" bgcolor="#D0E7FF" align="center" | '''Positive Resists'''
+
|'''''DS-K101'''''
{{LithRecipe Table v2}}
+
|''Route''
 +
| colspan="4" |''DSK101's Develop Rate depends on Bake temp - you can use this to control undercut.''
  
 +
''See: [[DS-K101-304 Bake Temp. versus Develop Rate|DSK Bake vs. Dev rate]]''
 +
|-
 +
|
 +
|
 +
|Coat-DSK101[5K]-220C
 +
|5.0
 +
|220°C
 +
|''Requires: HP4=220°C''
 +
|-
 +
|
 +
|
 +
|Coat-DSK101[5K]-210C
 +
|5.0
 +
|210°C
 +
|''Requires: HP4=210°C''
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | AZ4110
+
|
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
+
|
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
+
|Coat-DSK101[5K]-200C
| bgcolor="EEFFFF" | A
+
|5.0
| bgcolor="EEFFFF" | A
+
|200°C
| bgcolor="EEFFFF" |
+
|''Requires: HP4=200°C''
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | AZ4210
+
|
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
+
|
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
+
|Coat-DSK101[5K]-185C
| A
+
|5.0
| A
+
|185°C
| <br>
+
|''Requires: HP4=185°C''
| <br>
 
| <br>
 
| <br>
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | AZ4330RS
+
|'''''UV6-0.8'''''
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
+
|''Route''
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
+
|Coat-UV6[2K]-135C
| bgcolor="EEFFFF" | A
+
|2.0
| bgcolor="EEFFFF" | A
+
|135°C
| bgcolor="EEFFFF" |
+
|''Requires: HP1=135°C''
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | OCG 825-35CS
+
|
| A
+
|
| A
+
|Coat-UV6[2.5K]-135C
| A
+
|2.5
| A
+
|135°C
| <br>
+
|
| <br>
 
| <br>
 
| <br>
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | SPR 950-0.8
+
|
| bgcolor="EEFFFF" | A
+
|
| bgcolor="EEFFFF" | A
+
|Coat-UV6[3K]-135C
| bgcolor="EEFFFF" | A
+
|3.0
| bgcolor="EEFFFF" | A
+
|135°C
| bgcolor="EEFFFF" |
+
|
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |  
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-0.9
+
|
| A
+
|
| A
+
|Coat-UV6[3.5K]-135C
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
+
|3.5
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
+
|135°C
| <br>
+
|
| <br>
 
| <br>
 
| <br>
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-1.8
+
|
| bgcolor="EEFFFF" | A
+
|
| bgcolor="EEFFFF" | A
+
|Coat-UV6[4K]-135C
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
+
|4.0
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
+
|135°C
| bgcolor="EEFFFF" |
+
|
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |  
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | SPR 220-3.0
+
|
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
+
|
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
+
|Coat-UV6[5K]-135C
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
+
|5.0
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
+
|135°C
| <br>
+
|
| <br>
 
| <br>
 
| <br>
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | SPR 220-7.0
+
|
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
+
|
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
+
|Coat-UV6[6K]-135C
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
+
|6.0
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
+
|135°C
| bgcolor="EEFFFF" |
+
|
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |  
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | THMR-IP3600 HP D
+
|'''''DS-K101 @ 220°C'''''
| <br>
+
'''''+ UV6'''''
| <br>
+
|''Chain''
| A
+
|Coat-DSK101[5K]-220C-UV6[2K]-135C
| A
+
|''DSK: 5krpm''
| <br>
+
''UV6: 2.0krpm''
| <br>
+
|DSK: 220°C
| <br>
+
UV6: 135°C
| <br>
+
|''Requires:''
 +
''– HP4=220°C''
 +
 
 +
''– HP1=135°C''
 +
 
 +
''Plan for ~10-15 min per wafer.''
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | UV6-0.7
+
|
| bgcolor="EEFFFF" |  
+
|
| bgcolor="EEFFFF" |
+
|Coat-DSK101[5K]-220C-UV6[2.5K]-135C
| bgcolor="EEFFFF" |
+
|''DSK: 5krpm''
| bgcolor="EEFFFF" |
+
''UV6: 2.5krpm''
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
+
|''same as above''
| bgcolor="EEFFFF" |
+
|''same as above''
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | UV210-0.3
+
|
| bgcolor="EEFFFF" |  
+
|
| bgcolor="EEFFFF" |
+
|Coat-DSK101[5K]-220C-UV6[3K]-135C
| bgcolor="EEFFFF" |
+
|''DSK: 5krpm''
| bgcolor="EEFFFF" |
+
''UV6: 3.0krpm''
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
+
|''same as above''
| bgcolor="EEFFFF" |
+
|''same as above''
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | '''Negative Resists'''
+
|
{{LithRecipe Table v2}}
+
|
 
+
|Coat-DSK101[5K]-220C-UV6[3.5K]-135C
|- bgcolor="EEFFFF"
+
|''DSK: 5krpm''
| bgcolor="#D0E7FF" align="center" | AZ5214-EIR
+
''UV6: 3.5krpm''
| {{rl|Contact_Alignment_Recipes|Negative Resist (MJB-3)}}
+
|''same as above''
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
+
|''same as above''
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
|
 
|
 
|  
 
|  
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | AZnLOF 2020
+
|
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
+
|
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
+
|Coat-DSK101[5K]-220C-UV6[4K]-135C
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
+
|''DSK: 5krpm''
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
+
''UV6: 4.0krpm''
|
+
|''same as above''
|
+
|''same as above''
|
 
|
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | AZnLOF 2035
 
| A
 
| A
 
| A
 
| A
 
|
 
|
 
|  
 
|  
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | AZnLOF 2070
+
|
| A
+
|
| A
+
|Coat-DSK101[5K]-220C-UV6[5K]-135C
| A
+
|''DSK: 5krpm''
| A
+
''UV6: 5.0krpm''
|
+
|''same as above''
|
+
|''same as above''
|  
 
|  
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | AZnLOF 5510
 
| A
 
| A
 
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
|
 
|
 
|  
 
|  
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | UVN2300-0.5
+
|
|
+
|
|
+
|Coat-DSK101[5K]-220C-UV6[6K]-135C
|
+
|''DSK: 5krpm''
|
+
''UV6: 6.0krpm''
| {{rl|Stepper Recipes|Negative Resist (ASML DUV)}}
+
|''same as above''
|
+
|''same as above''
|  
 
|  
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | SU-8 2015
 
| A
 
| A
 
| A
 
| A
 
|
 
|
 
|  
 
|  
 
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | '''Underlayers'''  
+
|'''''DS-K101 @ 185°C'''''
{{LithRecipe Table v2}}
+
'''''+ UV6'''''
 +
|''Chain''
 +
|Coat-DSK101[5K]-185C-UV6[2K]-135C
 +
|''DSK: 5krpm''
 +
''UV6: 2.0krpm''
 +
|DSK: 185°C
 +
UV6: 135°C
 +
|''Requires:''
 +
''– HP4=185°C''
  
|- bgcolor="EEFFFF"
+
''– HP1=135°C''
| bgcolor="#D0E7FF" align="center" | PMGI SF-11
+
 
| <br>
+
''Plan for ~10-15 min per wafer.''
| <br>
+
|-
| <br>
+
|
| <br>
+
|
| <br>
+
|Coat-DSK101[5K]-185C-UV6[2.5K]-135C
| <br>
+
|''DSK: 5krpm''
| <br>
+
''UV6: 2.5krpm''
| <br>
+
|''same as above''
 +
|''same as above''
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | PMGI SF-15
+
|
|
+
|
|
+
|Coat-DSK101[5K]-185C-UV6[3K]-135C
|
+
|''DSK: 5krpm''
|
+
''UV6: 3.0krpm''
|
+
|''same as above''
|
+
|''same as above''
|  
 
|  
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | LOL 2000
 
|
 
|  
 
|
 
|
 
|
 
|
 
|  
 
|  
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | XHRIC-11 (i-lineBARC)
+
|
|
+
|
|
+
|Coat-DSK101[5K]-185C-UV6[3.5K]-135C
|
+
|''DSK: 5krpm''
|
+
''UV6: 3.5krpm''
|
+
|''same as above''
|
+
|''same as above''
|  
 
|  
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | AR-2 (DUV BARC)
 
|
 
|  
 
|
 
|
 
|
 
|
 
|  
 
|  
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | DS-K101 (DUV BARC)
+
|
|  
+
|
|  
+
|Coat-DSK101[5K]-185C-UV6[4K]-135C
|  
+
|''DSK: 5krpm''
|
+
''UV6: 4.0krpm''
|
+
|''same as above''
|
+
|''same as above''
|  
 
|  
 
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | '''Overlayers'''
+
|
{{LithRecipe Table v2}}
+
|
 
+
|Coat-DSK101[5K]-185C-UV6[5K]-135C
|- bgcolor="EEFFFF"
+
|''DSK: 5krpm''
| bgcolor="#D0E7FF" align="center" | CEM-365 IS
+
''UV6: 5.0krpm''
|  
+
|''same as above''
|
+
|''same as above''
|
 
|
 
|
 
|
 
|  
 
|  
 
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | '''E-Beam Resists'''
+
|
{{LithRecipe Table v2}}
+
|
 
+
|Coat-DSK101[5K]-185C-UV6[6K]-135C
|- bgcolor="EEFFFF"
+
|''DSK: 5krpm''
| bgcolor="#D0E7FF" align="center" | &nbsp;??????
+
''UV6: 6.0krpm''
|
+
|''same as above''
|
+
|''same as above''
|
 
|
 
|
 
|
 
|  
 
|  
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | &nbsp;???????
+
|'''''Hotplate Set'''''
|
+
|''Route''
|
+
|''SET-HP4-220C''
|
+
|
|  
+
|220°C
|  
+
|''Hotplate 4 (top) between 218-222°C when done.''
|  
 
|  
 
|  
 
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | '''Nanoimprint Resists'''
+
|
{{LithRecipe Table v2}}
+
|
 
+
|''SET-HP4-210C''
|- bgcolor="EEFFFF"
+
|
| bgcolor="#D0E7FF" align="center" | MR-I 7020
+
|210°C
|
+
|
|
 
|
 
|
 
|
 
|  
 
|  
 
|  
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" | Nanonex NX-1020
+
|
|
+
|
|
+
|''SET-HP4-200C''
|  
+
|
|  
+
|200°C
|  
+
|
|  
 
|  
 
|  
 
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" |  
+
|
{{LithRecipe Table v2}}  
+
|
 +
|''SET-HP4-185C''
 +
|
 +
|185*C
 +
|
 +
|}
 +
==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]==
 +
''The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.''
 +
 
 +
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_%28ARC-11_%26_THMR-IP3600HP-D%29-updated-4-8-2021.pdf|Standard Holography Process - on SiO2 on Si}}
 +
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
 +
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
 +
*{{fl|30-Redicing_Nanowire_Diameter_by_Thermal_Oxidation_and_Vapored_HF_Etch.pdf|Reduce SiO2 Nanowire Diameter - Thermal Oxidation - Vapor HF Etching}}
 +
 
 +
==Low-K Spin-On Dielectric Recipes==
 +
 
 +
*{{fl|Lithography-BCB-photo-lowk-dielectric-spinon-4024-40-revA.docx|Photo BCB (4024-40)}}
 +
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
 +
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
 +
 
 +
==Chemicals Stocked + Datasheets==
 +
''The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each.  The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.''
 +
{|
 +
|- valign="top"
 +
| width="400" |
 +
;<div id="PositivePR"><big>Positive Photoresists</big></div>
 +
 
 +
'''''i-line and broadband'''''
 +
 
 +
*{{fl|AXP4000pb-Datasheet.pdf|AZP4000 (AZ4110, AZ4210, AZ4330)}}
 +
*{{Fl|Az_p4620_photoresist_data_package.pdf|AZ P4620}}
 +
*{{fl|OCG825-Positive-Resist-Datasheet.pdf|OCG825}}
 +
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
 +
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
 +
*THMR-3600HP (Thin I-Line & Holography)
 +
**{{fl|THMR_iP_3500_iP3600.pdf|Evaluation Results: THMR-3600HP}}
 +
**{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|Spin Curves for THMR-3600HP}}
 +
**{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|Safety Datasheet for THMR-3600HP}}
 +
 
 +
'''''DUV-248nm'''''
 +
 
 +
*{{fl|UV210-Positive-Resist-Datasheet.pdf|UV210-0.3}}
 +
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
 +
*{{fl|UV26-Positive-Resist-Datasheet.pdf|UV26-2.5}}
 +
 
 +
;<div id="NegativePR"><big>Negative Photoresists</big></div>
 +
 
 +
'''''i-line and broadband'''''
 +
 
 +
*{{fl|AZ5214-Negative-Resist-Datasheet.pdf|AZ5214}}
 +
*{{fl|AZnLOF5510-Negative-Resist-Datasheet.pdf|AZnLOF5510}}
 +
*{{fl|AZnLOF2020-Negative-Resist-Datasheet.pdf|AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070)}}
 +
*{{fl|NR9-1000PY-revA.pdf|Futurrex NR9-1000PY(use AZ300MIF dev)}}
 +
*{{fl|NR9-3000PY-revA.pdf|Futurrex NR9-3000PY(use AZ300MIF dev)}}
 +
*{{fl|NR9-6000PY-revA.pdf|Futurrex NR9-6000PY(use AZ300MIF dev)}}
 +
*{{fl|SU-8-2015-revA.pdf|SU-8-2005,2010, 2015}}
 +
*{{fl|SU-8-2075-revA.pdf|SU-8-2075}}
 +
 
 +
'''''DUV-248nm'''''
 +
 
 +
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30-0.8}}
 +
 
 +
;<div id="Underlayers"><big>Underlayers</big></div>
 +
 
 +
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
 +
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
 +
 
 +
;<div id="EBLPR"><big>E-beam resists</big></div>
 +
 
 +
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
 +
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
 +
 
 +
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
 +
 
 +
*{{fl|NX1020-Nanoimprinting-Datasheet.pdf|NX1020}}
 +
*{{fl|MRI-7020-Nanoimprinting-Datasheet.pdf|MRI-7020}}
 +
*{{fl|Mr-UVCur21.pdf|MR-UVCur21}}
 +
*{{fl|OrmoStamp-NIL-Lithography-UV-Soft-RevA.pdf|Ormostamp}}
 +
 
 +
|
 +
;<div id="ContrastEnhancement"><big>Contrast Enhancement Materials</big></div>
 +
 
 +
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
 +
 
 +
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
 +
 
 +
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC-11 (i-line)}}
 +
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P-6 (DUV) (For AR2 replacement)}}
 +
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
 +
 
 +
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
 +
 
 +
*HMDS
 +
*AP3000 BCB Adhesion Promoter
 +
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
 +
*{{fl|OrmoPrime-NIL-Adhesion-RevA.pdf|Ormoprime08-Ormostsmp Adhesion Promoter}}
 +
 
 +
;<div id="SpinOnDielectrics"><big>Spin-On Dielectrics</big></div>
 +
 
 +
''Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass''
 +
 
 +
*{{fl|BCB-cyclotene-3000-revA.pdf|BCB, Cyclotene 3022-46(Not Photosensitive)}}
 +
*{{fl|BCB-cyclotene-4000-revA.pdf|PhotoBCB, Cyclotene 4022-40(Negative Polarity)}}
 +
*{{fl|BCB-adhesion.pdf|BCB Adhesion Notes from Vendor}}
 +
*{{fl|BCB-rework.pdf|BCB rework Notes from Vendor}}
 +
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
 +
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
 +
 
 +
;<div id="Developers"><big>Developers</big></div>
 +
 
 +
*{{fl|AZ400K-Developer-Datasheet.pdf|AZ400K (AZ400K, AZ400K1:4)}}
 +
*{{fl|AZ300MIF-Developer-Datasheet.pdf|AZ300MIF}}
 +
*DS2100 BCB Developer
 +
*SU-8 Developer
 +
*101A Developer (for DUV Flood Exposed PMGI)
 +
 
 +
;<div id="PRRemovers"><big>Photoresist Removers</big></div>
 +
 
 +
*[http://www.microchemicals.com/products/remover_stripper/nmp.html AZ NMP]
 +
**''This replaces {{fl|1165-Resist-Remover.pdf|1165}}''
 +
*{{fl|AZ300T-Resist-Remover.pdf|AZ300T}}
 +
*{{fl|RemoverPG-revA.pdf|Remover PG, SU-8 stripper}}
 +
*AZ EBR ("Edge Bead Remover", PGMEA)
  
 
|}
 
|}
 +
 +
[[Category: Processing]]
 +
[[category: Lithography]]
 +
[[category: Recipes]]

Latest revision as of 13:38, 8 November 2022

Table of Contents

Photolithography Processes

  1. UV Optical Lithography
  2. General Photolithography Techniques
    • Techniques for improving litho. or solving common photolith. problems.
  3. Lift-Off Recipes
    • Verified Recipes for lift-off using various photolith. tools
    • General educational description of this technique and it's limitations/considerations.
  4. E-beam Lithography
  5. Holography
    • For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.
    • Recipes for silicon substrates are provided, and have been translated to other substrates by users.
    • Datasheets are provided with starting recipes and usage info.
  6. Edge-Bead Removal
    • Edge photoresist removal methods needed for clamp-based etchers
    • Improves resolution for contact lithography

Photolithography Chemicals/Materials

  1. Underlayers
    • These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.
    • Datasheets are provided.
  2. Anti-Reflection Coatings:
    • The Photoresist Recipes section contains recipes using these materials.
    • Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.
    • Datasheets are provided for reference on use of the materials.
  3. Contrast Enhancement Materials (CEM)
    • The Photoresist Recipes section contains recipes using these materials.
    • Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.
    • Datasheets provided with usage info.
  4. Adhesion Promoters
    • These are used to improve wetting of photoresists to your substrate.
    • Datasheets are provided on use of these materials.
  5. Low-K Spin-on Dielectrics
  6. Developers and Removers
    • Datasheets provided for reference.
    • Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.

General Photolithography Techniques

  • HMDS Process for Improving Adhesion
    • Use these procedures if you are finding poor adhesion PR lifting-off), or for chemicals (like BHF) that attack the PR adhesion interface strongly.
  • Edge-Bead Removal Techniques
    • These techniques are required for loading full-wafers into etchers that use top-side clamps, to prevent photoresist from sticking to the clamp (and potentially destroying your wafer).
    • For contact lithography, this improves the proximity of the mask plate and sample, improving resolution. For some projection systems, such as the Maskless Aligner, EBR can help with autofocus issues.
  • Photoresist reflow (MicroChem), to create slanted sidewalls or curved surfaces.

Photolithography Recipes

  • R: Recipe is available. Clicking this link will take you to the recipe.
  • A: Material is available for use, but no recipes are provided.

Click the tool title to go to recipes for that tool.

Click the photoresist title to get the datasheet, also found in Stocked Chemicals + Datasheets.

Photolithography Recipes
Contact Aligner Recipes Stepper Recipes Direct-Write Litho. Recipes
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ4110 R R A A R
AZ4210 R R A A A
AZ4330RS R R A A R
AZ4620 A A A A A
OCG 825-35CS A A A A A
SPR 955 CM-0.9 A R R R R
SPR 955 CM-1.8 A A R R A
SPR 220-3.0 R R R R R
SPR 220-7.0 R R R R A
THMR-IP3600 HP D A A R
UV6-0.8 R
UV210-0.3 R
UV26-2.5 A
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ5214-EIR R R R R R
AZnLOF 2020 R R R R R
AZnLOF 2035 A A A A A
AZnLOF 2070 A A A A A
AZnLOF 5510 A A R R A
UVN30-0.8 R
SU-8 2005,2010,2015 A R A A A
SU-8 2075 A A A A R
NR9-1000,3000,6000PY R R A R A
Anti-Reflection Coatings SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
XHRiC-11 A A A
DUV42-P R
DS-K101-304 R
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)

Lift-Off Recipes

E-Beam Lithography Recipes (JEOL JBX-6300FS)

  • Under Development.

FIB Lithography Recipes (Raith Velion)

To Be Added

Automated Coat/Develop System Recipes (S-Cubed Flexi)

Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.

Ask Staff if you need a new recipe.
Coating Material Route/Chain Name: User: "UCSB Users" Spin Speed (krpm) Bake Temp Notes
DS-K101 Route DSK101's Develop Rate depends on Bake temp - you can use this to control undercut.

See: DSK Bake vs. Dev rate

Coat-DSK101[5K]-220C 5.0 220°C Requires: HP4=220°C
Coat-DSK101[5K]-210C 5.0 210°C Requires: HP4=210°C
Coat-DSK101[5K]-200C 5.0 200°C Requires: HP4=200°C
Coat-DSK101[5K]-185C 5.0 185°C Requires: HP4=185°C
UV6-0.8 Route Coat-UV6[2K]-135C 2.0 135°C Requires: HP1=135°C
Coat-UV6[2.5K]-135C 2.5 135°C
Coat-UV6[3K]-135C 3.0 135°C
Coat-UV6[3.5K]-135C 3.5 135°C
Coat-UV6[4K]-135C 4.0 135°C
Coat-UV6[5K]-135C 5.0 135°C
Coat-UV6[6K]-135C 6.0 135°C
DS-K101 @ 220°C

+ UV6

Chain Coat-DSK101[5K]-220C-UV6[2K]-135C DSK: 5krpm

UV6: 2.0krpm

DSK: 220°C

UV6: 135°C

Requires:

– HP4=220°C

– HP1=135°C

Plan for ~10-15 min per wafer.

Coat-DSK101[5K]-220C-UV6[2.5K]-135C DSK: 5krpm

UV6: 2.5krpm

same as above same as above
Coat-DSK101[5K]-220C-UV6[3K]-135C DSK: 5krpm

UV6: 3.0krpm

same as above same as above
Coat-DSK101[5K]-220C-UV6[3.5K]-135C DSK: 5krpm

UV6: 3.5krpm

same as above same as above
Coat-DSK101[5K]-220C-UV6[4K]-135C DSK: 5krpm

UV6: 4.0krpm

same as above same as above
Coat-DSK101[5K]-220C-UV6[5K]-135C DSK: 5krpm

UV6: 5.0krpm

same as above same as above
Coat-DSK101[5K]-220C-UV6[6K]-135C DSK: 5krpm

UV6: 6.0krpm

same as above same as above
DS-K101 @ 185°C

+ UV6

Chain Coat-DSK101[5K]-185C-UV6[2K]-135C DSK: 5krpm

UV6: 2.0krpm

DSK: 185°C

UV6: 135°C

Requires:

– HP4=185°C

– HP1=135°C

Plan for ~10-15 min per wafer.

Coat-DSK101[5K]-185C-UV6[2.5K]-135C DSK: 5krpm

UV6: 2.5krpm

same as above same as above
Coat-DSK101[5K]-185C-UV6[3K]-135C DSK: 5krpm

UV6: 3.0krpm

same as above same as above
Coat-DSK101[5K]-185C-UV6[3.5K]-135C DSK: 5krpm

UV6: 3.5krpm

same as above same as above
Coat-DSK101[5K]-185C-UV6[4K]-135C DSK: 5krpm

UV6: 4.0krpm

same as above same as above
Coat-DSK101[5K]-185C-UV6[5K]-135C DSK: 5krpm

UV6: 5.0krpm

same as above same as above
Coat-DSK101[5K]-185C-UV6[6K]-135C DSK: 5krpm

UV6: 6.0krpm

same as above same as above
Hotplate Set Route SET-HP4-220C 220°C Hotplate 4 (top) between 218-222°C when done.
SET-HP4-210C 210°C
SET-HP4-200C 200°C
SET-HP4-185C 185*C

Holography Recipes

The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.

Low-K Spin-On Dielectric Recipes

Chemicals Stocked + Datasheets

The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband

DUV-248nm

Negative Photoresists

i-line and broadband

DUV-248nm

Underlayers
E-beam resists
Nanoimprinting
Contrast Enhancement Materials
Anti-Reflection Coatings
Adhesion Promoters
Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass

Developers
Photoresist Removers