Difference between revisions of "Lithography Recipes"

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==General Information==
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__NOTOC__
 
 
This page contains information and links to recipes/datasheets spin-coated materials used in the facility.
 
 
 
 
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*'''[[#PositivePR |Photoresists]]'''
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==='''<big>Photolithography Processes</big>'''===
**[[#Photolithography_Recipes |Photo Lithography Recipe section]]
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***''Has links to starting recipes (spin, bake, exposure, develop etc.).''
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#'''UV Optical Lithography'''
***''Substrate, surface materials, pattern size can often affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.''
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#*[[#PositivePR |'''Stocked Lithography Chemical + Datasheets''']]
**[[#PositivePR  |Stocked Lithography Chemical + Datasheets]]
+
#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.''
***''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.''
+
#*[[#Photolithography_Recipes |'''Photo Lithography Recipe section''']]
*'''[[#EBLPR |E-beam Lithography Resists]]'''
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#**''Starting recipes (spin, bake, exposure, develop etc.) for all photolith. tools.''
**[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]]
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#**''Substrate/surface materials/pattern size can affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.''
***''Has links to starting recipes.  Substrates and patterns play a large role in process parameters.''
+
#**[[Contact Alignment Recipes|<u>Contact Aligner Recipes</u>]]
**[[#EBLPR |EBL Photoresist Datasheets]]
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#***[[Contact Alignment Recipes#Suss Aligners .28SUSS MJB-3.29|Suss MJB Aligners]]
***''Provided for reference, also showing starting recipes and usage info.''
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#***[[Contact Alignment Recipes#Contact Aligner .28SUSS MA-6.29|Suss MA6]]
*'''[[#NanoImprinting |Nanoimprinting Resists]]'''
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#**[[Stepper Recipes|<u>Stepper Recipes</u>]]
**''Datasheets are provided with starting recipes and usage info.''
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#***[[Stepper Recipes#Stepper 1 .28GCA 6300.29|Stepper #1: GCA 6300]] (I-Line)
**''Recipes provided are for use in the [[Nano-Imprint_(Nanonex_NX2000) |Nano-Imprint (Nanonex NX2000)]] system only.''
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#***[[Stepper Recipes#Stepper 2 .28AutoStep 200.29|Stepper #2: GCA Autostep 200]] (I-Line)
 +
#***[[Stepper Recipes#Stepper 3 .28ASML DUV.29|Stepper #3: ASML PAS 5500/300]] (DUV)
 +
#**[[Direct-Write Lithography Recipes|<u>Direct-Write Recipes</u>]]
 +
#***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29|Heidelberg MLA150]]
 +
#***[[Lithography Recipes#E-Beam Lithography Recipes|JEOL JBX-6300FS EBL]]
 +
#***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29|Raith Velion FIB]]
 +
#[[Lithography Recipes#General Photolithography Techniques|'''General Photolithography Techniques''']]
 +
#*''Techniques for improving litho. or solving common photolith. problems.''
 +
#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]'''
 +
#*''Verified Recipes for lift-off using various photolith. tools''
 +
#*''General educational description of this technique and it's limitations/considerations.''
 +
#'''E-beam Lithography'''
 +
#*[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]]
 +
#**''Has links to starting recipes.  Substrates and patterns play a large role in process parameters.''
 +
#*[[#EBLPR |EBL Photoresist Datasheets]]
 +
#**''Provided for reference, also showing starting recipes and usage info.''
 +
#'''[[Lithography Recipes#Holography Recipes|Holography]]'''
 +
#*''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.''
 +
#*''Recipes for silicon substrates are provided, and have been translated to other substrates by users.''
 +
#*''Datasheets are provided with starting recipes and usage info.''
 +
|-
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*'''[[#Underlayers  |Underlayers]]'''
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==='''<big>Photolithography Chemicals/Materials</big>'''===
**''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.'' 
 
**''Datasheets are provided.''
 
*[[#Lift-Off_Techniques |'''Lift-Off Techniques''']]
 
**''Verified Recipes for lift-off using various photolith. tools''
 
**''General educational description of this technique and it's limitations/considerations.''
 
*'''[[Lithography Recipes#Holography Recipes|Holography]]'''
 
**''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.''
 
**''Recipes for silicon substrates are provided, and have been translated to other substrates by users.''
 
*'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''': 
 
**[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
 
**''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.'' 
 
**''Datasheets are provided for reference on use of the materials.''
 
*'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]'''
 
**[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
 
**''Used for resolution enhancement.  Not for use in contact aligners, typically used on I-Line Steppers.''
 
**''Datasheets provided with usage info.''
 
*'''[[#AdhesionPromoters |Adhesion Promoters]]'''
 
**''These are used to improve wetting of photoresists to your substrate.''
 
**''Datasheets are provided on use of these materials.''
 
  
*'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]'''   
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#'''[[#Underlayers  |Underlayers]]'''
**[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]]  
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#*''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.''
***''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.''
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#*''Datasheets are provided.''
**[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]]
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#'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''': 
***''Recipes for usage of some spin-on dielectrics.''
+
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
*'''[[#Developers |Developers and Removers]]'''
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#*''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.''
**''Datasheets provided for reference.''
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#*''Datasheets are provided for reference on use of the materials.''
**''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.''
+
#'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]'''
 +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
 +
#*''Used for resolution enhancement.  Not for use in contact aligners, typically used on I-Line Steppers.''
 +
#*''Datasheets provided with usage info.''
 +
#'''[[#AdhesionPromoters |Adhesion Promoters]]'''
 +
#*''These are used to improve wetting of photoresists to your substrate.''
 +
#*''Datasheets are provided on use of these materials.''
 +
#'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]'''   
 +
#*[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]]  
 +
#**''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.''
 +
#*[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]]
 +
#**''Recipes for usage of some spin-on dielectrics.''
 +
#'''[[#Developers |Developers and Removers]]'''
 +
#*''Datasheets provided for reference.''
 +
#*''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.''
 
|}
 
|}
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==General Photolithography Techniques==
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 +
*[[Photolithography - Improving Adhesion Photoresist Adhesion|HMDS Process for Improving Adhesion]]
 +
**''Use these procedures if you are finding poor adhesion PR lifting-off), or for chemicals (like BHF) that attack the PR adhesion interface strongly.''
 +
*[[Photolithography - Manual Edge-Bead Removal Techniques|Manual Edge-Bead Removal Techniques]]
 +
**''Removing the edge-bead from your substrate will help with contact litho resolution and alignment.''
  
 
==Photolithography Recipes==
 
==Photolithography Recipes==
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{{Recipe Table Explanation}}  
 
{{Recipe Table Explanation}}  
  
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''Click the tool title to go to recipes for that tool.''
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''Click the photoresist title to get the datasheet, also found in [[Lithography Recipes#Chemicals Stocked .2B Datasheets|Stocked Chemicals + Datasheets]].''
 
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
 
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! colspan="7" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div>
 
! colspan="7" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div>
  
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|-  
|<!-- INTENTIONALLY BLANK --><br>
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| bgcolor="#EAECF0" |<!-- INTENTIONALLY BLANK -->
! colspan="2" bgcolor="#D0E7FF" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]'''
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! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]'''
! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]'''
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! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]'''
! bgcolor="#D0E7FF" align="center" |Other
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! align="center" |[[Direct-Write Lithography Recipes|Direct-Write Litho. Recipes]]
 
|-
 
|-
 
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''  
 
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''  
 
{{LithRecipe Table}}
 
{{LithRecipe Table}}
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| bgcolor="#D0E7FF" align="center" |[[:File:AXP4000pb-Datasheet.pdf|AZ4110]]
| bgcolor="EEFFFF" |{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
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! bgcolor="#D0E7FF" align="center" |'''Negative Resists'''  
 
! bgcolor="#D0E7FF" align="center" |'''Negative Resists'''  
 
{{LithRecipe Table}}
 
{{LithRecipe Table}}
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| bgcolor="#D0E7FF" align="center" |NR9-1000,3000,6000PY
+
| bgcolor="#D0E7FF" align="center" |NR9-[//wiki.nanotech.ucsb.edu/w/images/8/8f/NR9-1000PY-revA.pdf 1000],[//wiki.nanotech.ucsb.edu/w/images/7/71/NR9-3000PY-revA.pdf 3000],[//wiki.nanotech.ucsb.edu/w/images/f/f9/NR9-6000PY-revA.pdf 6000]PY
 
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
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|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
|
 
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
! bgcolor="#D0E7FF" align="center" |'''Anti-Reflection Coatings'''
 +
{{LithRecipe Table}}
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/33/XHRiC-Anti-Reflective-Coating.pdf XHRiC-11]
 +
|
 +
|
 +
|A
 +
|A
 
|
 
|
|-
+
|A
! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings'''
 
{{LithRecipe Table}}
 
 
|- bgcolor="EEFFFF"
 
|- bgcolor="EEFFFF"
| bgcolor="#D0E7FF" align="center" |DUV42-P
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/DUV42P-Anti-Reflective-Coating.pdf DUV42-P]
 
|
 
|
 
|
 
|
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|
 
|
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" |DS-K101-304
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/af/DS-K101-304-Anti-Reflective-Coating.pdf DS-K101-304]
 
|
 
|
 
|
 
|
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|}
 
|}
 
<!-- end Litho Recipes table -->
 
<!-- end Litho Recipes table -->
 +
 +
==Lift-Off Recipes==
 +
 +
*{{fl|Liftoff-Techniques.pdf|Lift-Off Description/Tutorial}}
 +
**How it works, process limits and considerations for designing your process
 +
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
 +
*[[Lift-Off with DUV Imaging + PMGI Underlayer|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
  
 
==[[E-Beam Lithography System (JEOL JBX-6300FS)|E-Beam Lithography Recipes (JEOL JBX-6300FS)]]==
 
==[[E-Beam Lithography System (JEOL JBX-6300FS)|E-Beam Lithography Recipes (JEOL JBX-6300FS)]]==
Line 286: Line 316:
 
*Under Development.
 
*Under Development.
  
== [[Focused Ion-Beam Lithography (Raith Velion)|FIB Lithography Recipes (Raith Velion)]] ==
+
==[[Focused Ion-Beam Lithography (Raith Velion)|FIB Lithography Recipes (Raith Velion)]]==
 
''To Be Added''
 
''To Be Added''
  
Line 293: Line 323:
  
 
''To Be Added''
 
''To Be Added''
 
==[[Nano-Imprint (Nanonex NX2000)|Nanoimprinting Recipes]]==
 
 
*{{fl|Thermal-Nanoimprint-Process-Tutorial-revA.pdf|Thermal Nanoimprint Process and Tutorial}}
 
*{{fl|Nanoinprint-Lithopgraphy-UV-Low-Pressure-Temperature-Ormostamp-PDMS-RevA.docx|UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process}}
 
  
 
==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]==
 
==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]==
 +
''The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.''
  
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_(ARC-11_%26_THMR-IP3600HP-D)-updated-8-13-2018-A.pdf|Standard Holography Process - on SiO2 on Si}}
+
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_%28ARC-11_%26_THMR-IP3600HP-D%29-updated-4-8-2021.pdf|Standard Holography Process - on SiO2 on Si}}
 
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
 
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
 
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
 
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
Line 311: Line 337:
 
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
 
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
 
==Lift-Off Techniques==
 
 
*{{fl|Liftoff-Techniques.pdf|Lift-Off Description/Tutorial}}
 
**How it works, process limits and considerations for designing your process
 
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
 
*[[Lift-Off with DUV Imaging + PMGI Underlayer|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
 
  
 
==Chemicals Stocked + Datasheets==
 
==Chemicals Stocked + Datasheets==
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;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
 
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
  
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC (i-line)}}
+
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC-11 (i-line)}}
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P (DUV) (For AR2 replacement)}}
+
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P-6 (DUV) (For AR2 replacement)}}
 
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
 
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
  
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|}
 
|}
  
[[Category:Processing]]
+
[[Category: Processing]]
 +
[[category: Lithography]]
 +
[[category: Recipes]]

Latest revision as of 10:25, 24 November 2021

Table of Contents

Photolithography Processes

  1. UV Optical Lithography
  2. General Photolithography Techniques
    • Techniques for improving litho. or solving common photolith. problems.
  3. Lift-Off Recipes
    • Verified Recipes for lift-off using various photolith. tools
    • General educational description of this technique and it's limitations/considerations.
  4. E-beam Lithography
  5. Holography
    • For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.
    • Recipes for silicon substrates are provided, and have been translated to other substrates by users.
    • Datasheets are provided with starting recipes and usage info.

Photolithography Chemicals/Materials

  1. Underlayers
    • These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.
    • Datasheets are provided.
  2. Anti-Reflection Coatings:
    • The Photoresist Recipes section contains recipes using these materials.
    • Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.
    • Datasheets are provided for reference on use of the materials.
  3. Contrast Enhancement Materials (CEM)
    • The Photoresist Recipes section contains recipes using these materials.
    • Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.
    • Datasheets provided with usage info.
  4. Adhesion Promoters
    • These are used to improve wetting of photoresists to your substrate.
    • Datasheets are provided on use of these materials.
  5. Low-K Spin-on Dielectrics
  6. Developers and Removers
    • Datasheets provided for reference.
    • Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.

General Photolithography Techniques

Photolithography Recipes

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.

Click the tool title to go to recipes for that tool.

Click the photoresist title to get the datasheet, also found in Stocked Chemicals + Datasheets.

Photolithography Recipes
Contact Aligner Recipes Stepper Recipes Direct-Write Litho. Recipes
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ4110 R R A A R
AZ4210 R R A A A
AZ4330RS R R A A R
AZ4620 A A A A A
OCG 825-35CS A A A A A
SPR 955 CM-0.9 A R R R R
SPR 955 CM-1.8 A A R R A
SPR 220-3.0 R R R R R
SPR 220-7.0 R R R R A
THMR-IP3600 HP D A A R
UV6-0.8 R
UV210-0.3 R
UV26-2.5 A
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ5214-EIR R R R R R
AZnLOF 2020 R R R R R
AZnLOF 2035 A A A A A
AZnLOF 2070 A A A A A
AZnLOF 5510 A A R R A
UVN30-0.8 R
SU-8 2005,2010,2015 A R A A A
SU-8 2075 A A A A R
NR9-1000,3000,6000PY R R A R A
Anti-Reflection Coatings SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
XHRiC-11 A A A
DUV42-P R
DS-K101-304 R
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)

Lift-Off Recipes

E-Beam Lithography Recipes (JEOL JBX-6300FS)

  • Under Development.

FIB Lithography Recipes (Raith Velion)

To Be Added

Automated Coat/Develop System Recipes (S-Cubed Flexi)

Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.

To Be Added

Holography Recipes

The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.

Low-K Spin-On Dielectric Recipes

Chemicals Stocked + Datasheets

The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband

DUV-248nm

Negative Photoresists

i-line and broadband

DUV-248nm

Underlayers
E-beam resists
Nanoimprinting
Contrast Enhancement Materials
Anti-Reflection Coatings
Adhesion Promoters
Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass

Developers
Photoresist Removers