Lithography Recipes

General Information

This page contains information and links to recipes/datasheets spin-coated materials used in the facility. In general, the following information is provided for the following materials:

• Photoresists: Links to nominal recipes to provide the user with starting points are found in the Photo Lithography Recipe section. Substrate, surface materials, pattern size can often affect process parameters. Datasheets provided for reference.
• E-beam Lithography Resists: Links to nominal recipes may be provided in the E-Beam Lithography Recipe Section. Substrates and patterns play a large role in process parameters. Datasheets provided for reference.
• Underlayers: These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist. Datasheets are provided and some recipes are found in the Lift-Off Techniques section.
• Nanoimprinting Resists: Datasheets are provided. Any recipes provided are for use in the Nanonex NX2000 system only and are found in the Nanoimprint section.
• Anti-Reflection Coatings: These are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes. Recipes using these materials are found within the photoresist recipes themselves. Datasheets are provided for reference on use of the materials.
• Contrast Enhancement Materials (CEM): Used for resolution enhancement. Not for use in contact aligners. Recipes using these materials are found within the photoresist recipes themselves. Datasheets also provided.
• Adhesion Promoters: Datasheets are provided on use of these materials.
• Low-K Spin-on Dielectrics: Datasheets are provided for BCB, Phoot-BCB, and SOG for reference on use. Some recipes are provided in the Low-K section.
• Developers and Removers: Datasheets provided for reference.

Lift-Off Techniques

• Description/Tutorial
• Bi-Layer Process with PMGI Underlayer and Contact Aligner

Chemical Datasheets

Positive Photoresists AZP4000 (AZ4110, AZ4210, AZ4330) OCG825 SPR220 (SPR220-3, SPR220-7) SPR950-0.8 SPR955CM (SPR955CM-0.9, SPR955CM-1.8) UV6-0.7 UV210-0.3 Negative Photoresists AZ5214 AZnLOF5510 AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070) UVN2300-0.5 SU-8-2015 SU-8-2075 Underlayers PMGI (PMGI SF-11, PMGI SF-13, PMGI SF-15) Shipley LOL2000 E-beam resists PMMA (PMMA, P(MMA-MAA) copolymer) maN 2403 Nanoimprinting NX1020 MRI-7020

Contrast Enhancement Materials CEM365iS Anti-Reflection Coatings XHRiC AR2 DS-K101 (developable BARC) Adhesion Promoters HMDS AP3000 BCB Adhesion Promoter Omnicoat, SU-8 Adhesion Promoter BCB and SOG BCB, Cyclotene 3022-46(Not Photosensitive) PhotoBCB, Cyclotene 4022-40(Negative Polarity) Spin-on-Glass, Honeywell 512B (Not Photosensitive) Honeywell 512B Apps Data Developers AZ400K (AZ400K, AZ400K1:4) AZ300MIF DS2100 BCB Developer SU-8 Developer 101A Developer (for DUV Flood Exposed PMGI) Photoresist Removers 1165 AZ300T PRX-127 Remover PG, SU-8 stripper

Photolithography Recipes

• R = Recipe is available. Clicking this link will take you to the recipe.
• A = Material is available for use, but no recipes are provided.

Photolithography Recipes
	Contact Aligners		Steppers
Positive Resists	SUSS MJB-3	SUSS MA-6	Stepper 1 (GCA 6300)	Stepper 2 (AutoStep 200)	Stepper 3 (ASML DUV)	MLA150 (Heidelberg)
AZ4110	R	R	A	A
AZ4210	R	R	A	A
AZ4330RS	R	R	A	A
OCG 825-35CS	A	A	A	A
SPR 950-0.8	A	A	A	A
SPR 955 CM-0.9	A	A	R	R
SPR 955 CM-1.8	A	A	R	R
SPR 220-3.0	R	R	R	R
SPR 220-7.0	R	R	R	R
THMR-IP3600 HP D			A	A
UV6-0.7					R
UV210-0.3					R
Negative Resists	SUSS MJB-3	SUSS MA-6	Stepper 1 (GCA 6300)	Stepper 2 (AutoStep 200)	Stepper 3 (ASML DUV)	MLA150 (Heidelberg)
AZ5214-EIR	R	R	R	R
AZnLOF 2020	R	R	R	R
AZnLOF 2035	A	A	A	A
AZnLOF 2070	A	A	A	A
AZnLOF 5510	A	A	R	R
UVN2300-0.5					R
SU-8 2015	A	A	A	A
	SUSS MJB-3	SUSS MA-6	Stepper 1 (GCA 6300)	Stepper 2 (AutoStep 200)	Stepper 3 (ASML DUV)	MLA150 (Heidelberg)

E-Beam Lithography Recipes

• R = Recipe is available. Clicking this link will take you to the recipe.
• A = Material is available for use, but no recipes are provided.

E-Beam Lithography Recipes
	Contact Aligners		Steppers			Flood Expose	E-Beam Lithography
Positive Resists	SUSS MJB-3	SUSS MA-6	Stepper 1 (GCA 6300)	Stepper 2 (AutoStep 200)	Stepper 3 (ASML DUV)	MLA150 (Heidelberg)
AZ4110	R	R	A	A
AZ4210	R	R	A	A
AZ4330RS	R	R	A	A
OCG 825-35CS	A	A	A	A
SPR 950-0.8	A	A	A	A
SPR 955 CM-0.9	A	A	R	R
SPR 955 CM-1.8	A	A	R	R
SPR 220-3.0	R	R	R	R
SPR 220-7.0	R	R	R	R
THMR-IP3600 HP D			A	A
UV6-0.7					R
UV210-0.3					R
Negative Resists	SUSS MJB-3	SUSS MA-6	Stepper 1 (GCA 6300)	Stepper 2 (AutoStep 200)	Stepper 3 (ASML DUV)	MLA150 (Heidelberg)
AZ5214-EIR	R	R	R	R
AZnLOF 2020	R	R	R	R
AZnLOF 2035	A	A	A	A
AZnLOF 2070	A	A	A	A
AZnLOF 5510	A	A	R	R
UVN2300-0.5					R
SU-8 2015	A	A	A	A
Underlayers	SUSS MJB-3	SUSS MA-6	Stepper 1 (GCA 6300)	Stepper 2 (AutoStep 200)	Stepper 3 (ASML DUV)	MLA150 (Heidelberg)
PMGI SF-11
PMGI SF-15
LOL 2000
XHRIC-11 (i-lineBARC)
AR-2 (DUV BARC)
DS-K101 (DUV BARC)
Overlayers	SUSS MJB-3	SUSS MA-6	Stepper 1 (GCA 6300)	Stepper 2 (AutoStep 200)	Stepper 3 (ASML DUV)	MLA150 (Heidelberg)
CEM-365 IS
E-Beam Resists	SUSS MJB-3	SUSS MA-6	Stepper 1 (GCA 6300)	Stepper 2 (AutoStep 200)	Stepper 3 (ASML DUV)	MLA150 (Heidelberg)
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Nanoimprint Resists	SUSS MJB-3	SUSS MA-6	Stepper 1 (GCA 6300)	Stepper 2 (AutoStep 200)	Stepper 3 (ASML DUV)	MLA150 (Heidelberg)
MR-I 7020
Nanonex NX-1020
	SUSS MJB-3	SUSS MA-6	Stepper 1 (GCA 6300)	Stepper 2 (AutoStep 200)	Stepper 3 (ASML DUV)	MLA150 (Heidelberg)