Difference between revisions of "Lithography Recipes"

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__NOTOC__
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== General Information ==
  
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{| class="wikitable"
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|+
  +
!Table of Contents
  +
|-
  +
|
  +
==='''<big>Photolithography Processes</big>'''===
   
  +
#'''UV Optical Lithography'''
−
This page contains information and links to recipes/datasheets spin-coated materials used in the facility. In general, the following information is provided for the following materials:
  
  +
#*[[#PositivePR |'''Stocked Lithography Chemical + Datasheets''']]
  +
#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.''
  +
#*[[#Photolithography_Recipes |'''Photo Lithography Recipe section''']]
  +
#**''Starting recipes (spin, bake, exposure, develop etc.) for all photolith. tools.''
  +
#**''Substrate/surface materials/pattern size can affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.''
  +
#**[[Contact Alignment Recipes|<u>Contact Aligner Recipes</u>]]
  +
#***[[Contact Alignment Recipes#Suss Aligners .28SUSS MJB-3.29|Suss MJB Aligners]]
  +
#***[[Contact Alignment Recipes#Contact Aligner .28SUSS MA-6.29|Suss MA6]]
  +
#**[[Stepper Recipes|<u>Stepper Recipes</u>]]
  +
#***[[Stepper Recipes#Stepper 1 .28GCA 6300.29|Stepper #1: GCA 6300]] (I-Line)
  +
#***[[Stepper Recipes#Stepper 2 .28AutoStep 200.29|Stepper #2: GCA Autostep 200]] (I-Line)
  +
#***[[Stepper Recipes#Stepper 3 .28ASML DUV.29|Stepper #3: ASML PAS 5500/300]] (DUV)
  +
#**[[Direct-Write Lithography Recipes|<u>Direct-Write Recipes</u>]]
  +
#***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29|Heidelberg MLA150]]
  +
#***[[Lithography Recipes#E-Beam Lithography Recipes|JEOL JBX-6300FS EBL]]
  +
#***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29|Raith Velion FIB]]
  +
#[[Lithography Recipes#General Photolithography Techniques|'''General Photolithography Techniques''']]
  +
#*''Techniques for improving litho. or solving common photolith. problems.''
  +
#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]'''
  +
#*''Verified Recipes for lift-off using various photolith. tools''
  +
#*''General educational description of this technique and it's limitations/considerations.''
  +
#'''E-beam Lithography'''
  +
#*[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]]
  +
#**''Has links to starting recipes. Substrates and patterns play a large role in process parameters.''
  +
#*[[#EBLPR |EBL Photoresist Datasheets]]
  +
#**''Provided for reference, also showing starting recipes and usage info.''
  +
#'''[[Lithography Recipes#Holography Recipes|Holography]]'''
  +
#*''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.''
  +
#*''Recipes for silicon substrates are provided, and have been translated to other substrates by users.''
  +
#*''Datasheets are provided with starting recipes and usage info.''
  +
|-
  +
|
   
  +
==='''<big>Photolithography Chemicals/Materials</big>'''===
−
* Photoresists: Links to nominal recipes to provide the user with starting points are found in the Photo Lithography Recipe section. Substrate, surface materials, pattern size can often affect process parameters. Datasheets provided for reference.
  
−
* E-beam Lithography Resists: Links to nominal recipes may be provided in the E-Beam Lithography Recipe Section. Substrates and patterns play a large role in process parameters. Datasheets provided for reference.
  
−
* Underlayers: These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist. Datasheets are provided and some recipes are found in the Lift-Off Techniques section.
  
−
* Nanoimprinting Resists: Datasheets are provided. Any recipes provided are for use in the Nanonex NX2000 system only and are found in the Nanoimprint section.
  
−
* Holography: For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square. Recipe on silicon provided in the holography section.
  
−
* Anti-Reflection Coatings: These are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes. Recipes using these materials are found within the photoresist recipes themselves. Datasheets are provided for reference on use of the materials.
  
−
* Contrast Enhancement Materials (CEM): Used for resolution enhancement. Not for use in contact aligners. Recipes using these materials are found within the photoresist recipes themselves. Datasheets also provided.
  
−
* Adhesion Promoters: Datasheets are provided on use of these materials.
 
−
* Low-K Spin-on Dielectrics: Datasheets are provided for BCB, Phoot-BCB, and SOG for reference on use. Some recipes are provided in the Low-K section.
  
−
* Developers and Removers: Datasheets provided for reference.
  
   
  +
#'''[[#Underlayers |Underlayers]]'''
−
== Lift-Off Techniques ==
  
  +
#*''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.''
  +
#*''Datasheets are provided.''
  +
#'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''':
  +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
  +
#*''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.''
  +
#*''Datasheets are provided for reference on use of the materials.''
  +
#'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]'''
  +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
  +
#*''Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.''
  +
#*''Datasheets provided with usage info.''
  +
#'''[[#AdhesionPromoters |Adhesion Promoters]]'''
  +
#*''These are used to improve wetting of photoresists to your substrate.''
  +
#*''Datasheets are provided on use of these materials.''
  +
#'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]'''
  +
#*[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]]
  +
#**''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.''
  +
#*[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]]
  +
#**''Recipes for usage of some spin-on dielectrics.''
  +
#'''[[#Developers |Developers and Removers]]'''
  +
#*''Datasheets provided for reference.''
  +
#*''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.''
  +
|}
   
  +
==General Photolithography Techniques==
−
*{{fl|Liftoff-Techniques.pdf|Description/Tutorial}}
 
−
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
  
   
  +
*[[Photolithography - Improving Adhesion Photoresist Adhesion|HMDS Process for Improving Adhesion]]
−
== Chemical Datasheets ==
  
  +
**''Use these procedures if you are finding poor adhesion PR lifting-off), or for chemicals (like BHF) that attack the PR adhesion interface strongly.''
  +
*[[Photolithography - Manual Edge-Bead Removal Techniques|Manual Edge-Bead Removal Techniques]]
  +
**''Removing the edge-bead from your substrate will help with contact litho resolution and alignment.''
   
  +
==Photolithography Recipes==
−
{|
  
−
|- valign="top"
  
−
| width="400" |
 
−
;Positive Photoresists
  
   
  +
* <small>'''R''': ''Recipe is available. Clicking this link will take you to the recipe.''</small>
−
*{{fl|AXP4000pb-Datasheet.pdf|AZP4000 (AZ4110, AZ4210, AZ4330)}}
 
  +
* <small>'''A''': ''Material is available for use, but no recipes are provided.''</small>
−
*{{fl|OCG825-Positive-Resist-Datasheet.pdf|OCG825}}
 
−
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
 
−
*{{fl|SPR950-Positive-Resist-Datasheet.pdf|SPR950-0.8}}
 
−
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
 
−
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.7}}
 
−
*{{fl|UV210-Positive-Resist-Datasheet.pdf|UV210-0.3}}
  
   
  +
''Click the tool title to go to recipes for that tool.''
−
;Negative Photoresists
  
   
  +
''Click the photoresist title to get the datasheet, also found in [[Lithography Recipes#Chemicals Stocked .2B Datasheets|Stocked Chemicals + Datasheets]].''
−
*{{fl|AZ5214-Negative-Resist-Datasheet.pdf|AZ5214}}
 
  +
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
−
*{{fl|AZnLOF5510-Negative-Resist-Datasheet.pdf|AZnLOF5510}}
 
  +
|-
−
*{{fl|AZnLOF2020-Negative-Resist-Datasheet.pdf|AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070)}}
 
  +
! colspan="7" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div>
−
*{{fl|UVN2300-Negative-Resist-Datasheet.pdf|UVN2300-0.5}}
  
−
*{{fl|SU-8-2015-revA.pdf|SU-8-2015}}
  
−
*{{fl|SU-8-2075-revA.pdf|SU-8-2075}}
  
   
  +
|-
−
;Underlayers
  
  +
| bgcolor="#EAECF0" |<!-- INTENTIONALLY BLANK -->
  +
! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]'''
  +
! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]'''
  +
! align="center" |[[Direct-Write Lithography Recipes|Direct-Write Litho. Recipes]]
  +
|-
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! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''
  +
{{LithRecipe Table}}
  +
|- bgcolor="EEFFFF"<!-- This is the Row color: lightblue -->
  +
| bgcolor="#D0E7FF" align="center" |[[:File:AXP4000pb-Datasheet.pdf|AZ4110]]
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|A
  +
|A
  +
|
  +
|{{rl|MLA_Recipes|Positive Resist (MLA 150)}}
  +
|-<!-- This is a White row color -->
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4210]
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|A
  +
|A
  +
|
  +
|A
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4330RS]
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|A
  +
|A
  +
|
  +
|{{rl|MLA_Recipes|Positive Resist (MLA 150)}}
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/a2/Az_p4620_photoresist_data_package.pdf AZ4620]
  +
|A
  +
|A
  +
|A
  +
|A
  +
|
  +
|A
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/8/8b/OCG825-Positive-Resist-Datasheet.pdf OCG 825-35CS]
  +
|A
  +
|A
  +
|A
  +
|A
  +
|
  +
|A
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-0.9]
  +
|A
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
  +
|
  +
|{{rl|MLA Recipes|Positive Resist (MLA 150)}}
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-1.8]
  +
|A
  +
|A
  +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
  +
|
  +
|A
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0]
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
  +
|
  +
|{{rl|MLA Recipes|Positive Resist (MLA 150)}}
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-7.0]
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
  +
|
  +
|A
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/b/be/3600_D%2C_D2v_Spin_Speed_Curve.pdf THMR-IP3600 HP D]
  +
|
  +
|
  +
|A
  +
|A
  +
|
  +
|{{rl|MLA Recipes|Positive Resist (MLA 150)}}
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/38/UV6-Positive-Resist-Datasheet.pdf UV6-0.8]
  +
|
  +
|
  +
|
  +
|
  +
|{{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
  +
|
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/ff/UV210-Positive-Resist-Datasheet.pdf UV210-0.3]
  +
|
  +
|
  +
|
  +
|
  +
|{{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
  +
|
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/UV26-Positive-Resist-Datasheet.pdf UV26-2.5]
  +
|
  +
|
  +
|
  +
|
  +
|A
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|
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|- bgcolor="EEFFFF"
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! bgcolor="#D0E7FF" align="center" |'''Negative Resists'''
  +
{{LithRecipe Table}}
  +
|-
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/b/b0/AZ5214-Negative-Resist-Datasheet.pdf AZ5214-EIR]
  +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
  +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
  +
|
  +
|{{rl|MLA Recipes|Negative Resist (MLA 150)}}
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2020]
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
  +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
  +
|
  +
|{{rl|MLA Recipes|Negative Resist (MLA 150)}}
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |A
  +
| bgcolor="EEFFFF" |
  +
| bgcolor="EEFFFF" |A
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2070]
  +
|A
  +
|A
  +
|A
  +
|A
  +
|
  +
|A
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/8/82/AZnLOF5510-Negative-Resist-Datasheet.pdf AZnLOF 5510]
  +
|A
  +
|A
  +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
  +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
  +
|
  +
|A
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/c/c9/UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf UVN30-0.8]
  +
|
  +
|
  +
|
  +
|
  +
|{{rl|Stepper Recipes|Negative Resist (ASML DUV)}}
  +
|
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/7/78/SU-8-2015-revA.pdf SU-8 2005,2010,2015]
  +
|A
  +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
  +
|A
  +
|A
  +
|
  +
|A
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/2c/SU-8-2075-revA.pdf SU-8 2075]
  +
|A
  +
|A
  +
|A
  +
|A
  +
|
  +
|{{rl|MLA Recipes|Negative Resist (MLA 150)}}
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |NR9-[//wiki.nanotech.ucsb.edu/w/images/8/8f/NR9-1000PY-revA.pdf 1000],[//wiki.nanotech.ucsb.edu/w/images/7/71/NR9-3000PY-revA.pdf 3000],[//wiki.nanotech.ucsb.edu/w/images/f/f9/NR9-6000PY-revA.pdf 6000]PY
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  +
|A
  +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
  +
|
  +
|A
  +
|- bgcolor="EEFFFF"
  +
! bgcolor="#D0E7FF" align="center" |'''Anti-Reflection Coatings'''
  +
{{LithRecipe Table}}
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/33/XHRiC-Anti-Reflective-Coating.pdf XHRiC-11]
  +
|
  +
|
  +
|A
  +
|A
  +
|
  +
|A
  +
|- bgcolor="EEFFFF"
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/DUV42P-Anti-Reflective-Coating.pdf DUV42-P]
  +
|
  +
|
  +
|
  +
|
  +
|{{rl|Stepper Recipes|DUV-42P}}
  +
|
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/af/DS-K101-304-Anti-Reflective-Coating.pdf DS-K101-304]
  +
|
  +
|
  +
|
  +
|
  +
|{{rl|Stepper Recipes|DS-K101-304}}
  +
|
  +
|-
  +
! bgcolor="#D0E7FF" align="center" |
  +
{{LithRecipe Table}}
  +
|}
  +
<!-- end Litho Recipes table -->
   
  +
==Lift-Off Recipes==
−
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF-11, PMGI SF-13, PMGI SF-15)}}
 
−
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
  
   
  +
*{{fl|Liftoff-Techniques.pdf|Lift-Off Description/Tutorial}}
−
;E-beam resists
  
  +
**How it works, process limits and considerations for designing your process
  +
*[[Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer|I-Line Lift-Off: Bi-Layer Process with LOL2000 Underlayer]]
  +
**''Single Expose/Develop process for simplicity''
  +
**''Up to ~130nm metal thickness & ≥500nm-1000nm gap between metal.''
  +
**''Can use any I-Line litho tool (GCA Stepper, Contact aligner, MLA)''
  +
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
  +
**''Multiple processes for Metal thicknesses ~800nm to ~2.5µm''
  +
**''Uses multiple DUV Flood exposure/develop cycles to create undercut.''
  +
**''Can be transferred to other I-Line litho tools (Stepper, MLA etc.)''
  +
*[[Lift-Off with DUV Imaging + PMGI Underlayer|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
  +
**''Single-expose/develop process''
  +
**''Up to ~65nm metal thickness & ~350nm gap between metal''
  +
**''Use thicker PMGI for thicker metals''
   
  +
==[[E-Beam Lithography System (JEOL JBX-6300FS)|E-Beam Lithography Recipes (JEOL JBX-6300FS)]]==
−
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
 
−
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
  
   
  +
*Under Development.
−
;Nanoimprinting
  
   
  +
==[[Focused Ion-Beam Lithography (Raith Velion)|FIB Lithography Recipes (Raith Velion)]]==
−
*{{fl|NX1020-Nanoimprinting-Datasheet.pdf|NX1020}}
 
  +
''To Be Added''
−
*{{fl|MRI-7020-Nanoimprinting-Datasheet.pdf|MRI-7020}}
  
−
|
  
−
;Contrast Enhancement Materials
  
   
  +
==[[Automated Coat/Develop System (S-Cubed Flexi)|Automated Coat/Develop System Recipes (S-Cubed Flexi)]]==
−
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
  
  +
Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.
   
  +
''To Be Added''
−
;Anti-Reflection Coatings
  
   
  +
==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]==
−
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC}}
 
  +
''The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.''
−
*{{fl|AR2-Anti-Reflective-Coating.pdf|AR2}}
 
−
*{{fl|DS-K101-Anti-Reflective-Coating.pdf|DS-K101 (developable BARC)}}
  
   
  +
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_%28ARC-11_%26_THMR-IP3600HP-D%29-updated-4-8-2021.pdf|Standard Holography Process - on SiO2 on Si}}
−
;Adhesion Promoters
  
  +
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
  +
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
  +
*{{fl|30-Redicing_Nanowire_Diameter_by_Thermal_Oxidation_and_Vapored_HF_Etch.pdf|Reduce SiO2 Nanowire Diameter - Thermal Oxidation - Vapor HF Etching}}
   
  +
==Low-K Spin-On Dielectric Recipes==
−
*HMDS
 
−
*AP3000 BCB Adhesion Promoter
  
−
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
  
   
  +
*{{fl|Lithography-BCB-photo-lowk-dielectric-spinon-4024-40-revA.docx|Photo BCB (4024-40)}}
−
;BCB and SOG
  
  +
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
  +
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
   
  +
==Chemicals Stocked + Datasheets==
−
*{{fl|BCB-cyclotene-3000-revA.pdf|BCB, Cyclotene 3022-46(Not Photosensitive)}}
 
  +
''The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.''
−
*{{fl|BCB-cyclotene-4000-revA.pdf|PhotoBCB, Cyclotene 4022-40(Negative Polarity)}}
  
  +
{|
−
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
  
  +
|- valign="top"
−
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
  
  +
| width="400" |
  +
;<div id="PositivePR"><big>Positive Photoresists</big></div>
   
  +
'''''i-line and broadband'''''
−
;Developers
  
   
−
*{{fl|AZ400K-Developer-Datasheet.pdf|AZ400K (AZ400K, AZ400K1:4)}}
+
*{{fl|AXP4000pb-Datasheet.pdf|AZP4000 (AZ4110, AZ4210, AZ4330)}}
−
*{{fl|AZ300MIF-Developer-Datasheet.pdf|AZ300MIF}}
 +
*{{fl|OCG825-Positive-Resist-Datasheet.pdf|OCG825}}
  +
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
−
*DS2100 BCB Developer
  
  +
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
−
*SU-8 Developer
  
  +
*THMR-3600HP (Thin I-Line & Holography)
−
*101A Developer (for DUV Flood Exposed PMGI)
  
  +
**{{fl|THMR_iP_3500_iP3600.pdf|Evaluation Results: THMR-3600HP}}
  +
**{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|Spin Curves for THMR-3600HP}}
  +
**{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|Safety Datasheet for THMR-3600HP}}
   
  +
'''''DUV-248nm'''''
−
;Photoresist Removers
  
   
−
*{{fl|1165-Resist-Remover.pdf|1165}}
+
*{{fl|UV210-Positive-Resist-Datasheet.pdf|UV210-0.3}}
−
*{{fl|AZ300T-Resist-Remover.pdf|AZ300T}}
+
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
−
*{{fl|PRX-127-Resist-Remover.pdf|PRX-127}}
 +
*{{fl|UV26-Positive-Resist-Datasheet.pdf|UV26-2.5}}
−
*{{fl|RemoverPG-revA.pdf|Remover PG, SU-8 stripper}}
  
   
  +
;<div id="NegativePR"><big>Negative Photoresists</big></div>
−
|}
  
   
  +
'''''i-line and broadband'''''
−
== Photolithography Recipes ==
  
   
  +
*{{fl|AZ5214-Negative-Resist-Datasheet.pdf|AZ5214}}
−
{{Recipe Table Explanation}}
 
  +
*{{fl|AZnLOF5510-Negative-Resist-Datasheet.pdf|AZnLOF5510}}
  +
*{{fl|AZnLOF2020-Negative-Resist-Datasheet.pdf|AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070)}}
  +
*{{fl|NR9-1000PY-revA.pdf|Futurrex NR9-1000PY(use AZ300MIF dev)}}
  +
*{{fl|NR9-3000PY-revA.pdf|Futurrex NR9-3000PY(use AZ300MIF dev)}}
  +
*{{fl|NR9-6000PY-revA.pdf|Futurrex NR9-6000PY(use AZ300MIF dev)}}
  +
*{{fl|SU-8-2015-revA.pdf|SU-8-2005,2010, 2015}}
  +
*{{fl|SU-8-2075-revA.pdf|SU-8-2075}}
   
  +
'''''DUV-248nm'''''
−
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" class="wikitable"
  
−
|- bgcolor="#D0E7FF"
  
−
! height="45" colspan="9" | <div style="font-size: 150%;">Photolithography Recipes</div>
  
−
|- bgcolor="#D0E7FF"
  
−
| <!-- INTENTIONALLY LEFT BLANK --> <br>
 
−
! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[Contact Alignment Recipes|Contact Aligners]]'''
 
−
! bgcolor="#D0E7FF" align="center" colspan="3" | '''[[Stepper Recipes|Steppers]]'''
 
   
  +
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30-0.8}}
−
|-
  
−
! width="150" bgcolor="#D0E7FF" align="center" | '''Positive Resists'''
 
−
{{LithRecipe Table}}
 
   
  +
;<div id="Underlayers"><big>Underlayers</big></div>
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZ4110
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZ4210
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| A
 
−
| A
 
−
| <br>
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZ4330RS
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | OCG 825-35CS
 
−
| A
 
−
| A
 
−
| A
 
−
| A
 
−
| <br>
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 950-0.8
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-0.9
 
−
| A
 
−
| A
 
−
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| <br>
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-1.8
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 220-3.0
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| <br>
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 220-7.0
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | THMR-IP3600 HP D
 
−
| <br>
 
−
| <br>
 
−
| A
 
−
| A
 
−
| <br>
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | UV6-0.7
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | UV210-0.3
 
−
|
 
−
|
 
−
|
 
−
|
 
−
| {{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 
−
|-
  
−
! bgcolor="#D0E7FF" align="center" | '''Negative Resists'''
 
−
{{LithRecipe Table}}
 
   
  +
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
−
|- bgcolor="EEFFFF"
  
  +
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
−
| bgcolor="#D0E7FF" align="center" | AZ5214-EIR
 
−
| {{rl|Contact_Alignment_Recipes|Negative Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
−
|
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZnLOF 2020
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
−
|
 
−
|- bgcolor="EEFFFF"
  
−
| bgcolor="#D0E7FF" align="center" | AZnLOF 2035
 
−
| A
 
−
| A
 
−
| A
 
−
| A
 
−
|
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZnLOF 2070
 
−
| A
 
−
| A
 
−
| A
 
−
| A
 
−
|
 
−
|- bgcolor="EEFFFF"
  
−
| bgcolor="#D0E7FF" align="center" | AZnLOF 5510
 
−
| A
 
−
| A
 
−
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
−
|
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | UVN2300-0.5
 
−
|
 
−
|
 
−
|
 
−
|
 
−
| {{rl|Stepper Recipes|Negative Resist (ASML DUV)}}
 
−
|- bgcolor="EEFFFF"
  
−
| bgcolor="#D0E7FF" align="center" | SU-8 2015
 
−
| A
 
−
| A
 
−
| A
 
−
| A
 
−
|
 
−
|-
 
−
| bgcolor="#D0E7FF" align="center" | SU-8 2075
 
−
| A
 
−
| A
 
−
| A
 
−
| A
 
−
|
 
−
|-
  
   
  +
;<div id="EBLPR"><big>E-beam resists</big></div>
−
! bgcolor="#D0E7FF" align="center" |
 
−
{{LithRecipe Table}}
 
   
  +
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
−
|}
  
  +
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
   
  +
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
−
== E-Beam Lithography Recipes ==
  
−
*Under Development
  
   
−
== Nanoimprinting ==
 +
*{{fl|NX1020-Nanoimprinting-Datasheet.pdf|NX1020}}
  +
*{{fl|MRI-7020-Nanoimprinting-Datasheet.pdf|MRI-7020}}
−
*{{fl|Thermal-Nanoimprint-Process-Tutorial-revA.pdf|Thermal Nanoimprint Process and Tutorial}}
  
  +
*{{fl|Mr-UVCur21.pdf|MR-UVCur21}}
−
*UV-Cure Imprinting
  
  +
*{{fl|OrmoStamp-NIL-Lithography-UV-Soft-RevA.pdf|Ormostamp}}
   
  +
|
−
== Holography Recipes ==
  
  +
;<div id="ContrastEnhancement"><big>Contrast Enhancement Materials</big></div>
−
*{{fl|Holography-Process-Gratings-revA.pdf|Standard Holography Process}}
  
−
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
  
   
  +
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
−
== Low-K Dielectric ==
  
−
*BCB
  
−
*SOG
  
   
  +
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
−
== Legacy Table ==
  
−
{{Recipe Table Explanation}}
 
   
  +
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC-11 (i-line)}}
−
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" class="wikitable"
  
  +
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P-6 (DUV) (For AR2 replacement)}}
−
|- bgcolor="#D0E7FF"
  
  +
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
−
! height="45" colspan="9" | <div style="font-size: 150%;">E-Beam Lithography Recipes</div>
  
−
|- bgcolor="#D0E7FF"
  
−
| <!-- INTENTIONALLY LEFT BLANK --> <br>
 
−
! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[Contact Alignment Recipes|Contact Aligners]]'''
 
−
! bgcolor="#D0E7FF" align="center" colspan="3" | '''[[Stepper Recipes|Steppers]]'''
 
−
! width="30" bgcolor="#D0E7FF" align="center" | '''[[Flood Exposure Recipes|Flood Expose]]'''
 
−
! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[E-Beam Lithography Recipes|E-Beam Lithography]]'''
  
−
|-
  
−
! width="150" bgcolor="#D0E7FF" align="center" | '''Positive Resists'''
 
−
{{LithRecipe Table v2}}
 
   
  +
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZ4110
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZ4210
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| A
 
−
| A
 
−
| <br>
 
−
| <br>
 
−
| <br>
 
−
| <br>
  
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZ4330RS
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | OCG 825-35CS
 
−
| A
 
−
| A
 
−
| A
 
−
| A
 
−
| <br>
 
−
| <br>
 
−
| <br>
 
−
| <br>
  
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 950-0.8
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-0.9
 
−
| A
 
−
| A
 
−
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| <br>
 
−
| <br>
 
−
| <br>
 
−
| <br>
  
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-1.8
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | A
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 220-3.0
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| <br>
 
−
| <br>
 
−
| <br>
 
−
| <br>
  
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | SPR 220-7.0
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | THMR-IP3600 HP D
 
−
| <br>
 
−
| <br>
 
−
| A
 
−
| A
 
−
| <br>
 
−
| <br>
 
−
| <br>
 
−
| <br>
  
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | UV6-0.7
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | UV210-0.3
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
| bgcolor="EEFFFF" |
 
−
|-
  
−
! bgcolor="#D0E7FF" align="center" | '''Negative Resists'''
 
−
{{LithRecipe Table v2}}
 
   
  +
*HMDS
−
|- bgcolor="EEFFFF"
  
  +
*AP3000 BCB Adhesion Promoter
−
| bgcolor="#D0E7FF" align="center" | AZ5214-EIR
 
  +
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
−
| {{rl|Contact_Alignment_Recipes|Negative Resist (MJB-3)}}
 
  +
*{{fl|OrmoPrime-NIL-Adhesion-RevA.pdf|Ormoprime08-Ormostsmp Adhesion Promoter}}
−
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
−
|
 
−
|
 
−
|
 
−
|
 
−
|-
  
−
| bgcolor="#D0E7FF" align="center" | AZnLOF 2020
 
−
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
−
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 
−
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
−
|
 
−
|
 
−
|
 
−
|
 
−
|- bgcolor="EEFFFF"
  
−
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;<div id="SpinOnDielectrics"><big>Spin-On Dielectrics</big></div>
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! bgcolor="#D0E7FF" align="center" | '''Overlayers'''
 
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''Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass''
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*{{fl|BCB-cyclotene-3000-revA.pdf|BCB, Cyclotene 3022-46(Not Photosensitive)}}
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*{{fl|BCB-cyclotene-4000-revA.pdf|PhotoBCB, Cyclotene 4022-40(Negative Polarity)}}
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*{{fl|BCB-adhesion.pdf|BCB Adhesion Notes from Vendor}}
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*{{fl|BCB-rework.pdf|BCB rework Notes from Vendor}}
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*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
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*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
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*{{fl|AZ400K-Developer-Datasheet.pdf|AZ400K (AZ400K, AZ400K1:4)}}
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*{{fl|AZ300MIF-Developer-Datasheet.pdf|AZ300MIF}}
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*[http://www.microchemicals.com/products/remover_stripper/nmp.html AZ NMP]
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*{{fl|AZ300T-Resist-Remover.pdf|AZ300T}}
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*{{fl|RemoverPG-revA.pdf|Remover PG, SU-8 stripper}}
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*AZ EBR ("Edge Bead Remover", PGMEA)
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  +
  +
[[Category: Processing]]
  +
[[category: Lithography]]
  +
[[category: Recipes]]

Revision as of 15:48, 7 July 2022

Table of Contents

Photolithography Processes

  1. UV Optical Lithography
  2. General Photolithography Techniques
    • Techniques for improving litho. or solving common photolith. problems.
  3. Lift-Off Recipes
    • Verified Recipes for lift-off using various photolith. tools
    • General educational description of this technique and it's limitations/considerations.
  4. E-beam Lithography
  5. Holography
    • For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.
    • Recipes for silicon substrates are provided, and have been translated to other substrates by users.
    • Datasheets are provided with starting recipes and usage info.

Photolithography Chemicals/Materials

  1. Underlayers
    • These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.
    • Datasheets are provided.
  2. Anti-Reflection Coatings:
    • The Photoresist Recipes section contains recipes using these materials.
    • Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.
    • Datasheets are provided for reference on use of the materials.
  3. Contrast Enhancement Materials (CEM)
    • The Photoresist Recipes section contains recipes using these materials.
    • Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.
    • Datasheets provided with usage info.
  4. Adhesion Promoters
    • These are used to improve wetting of photoresists to your substrate.
    • Datasheets are provided on use of these materials.
  5. Low-K Spin-on Dielectrics
  6. Developers and Removers
    • Datasheets provided for reference.
    • Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.

General Photolithography Techniques

Photolithography Recipes

  • R: Recipe is available. Clicking this link will take you to the recipe.
  • A: Material is available for use, but no recipes are provided.

Click the tool title to go to recipes for that tool.

Click the photoresist title to get the datasheet, also found in Stocked Chemicals + Datasheets.

Photolithography Recipes
Contact Aligner Recipes Stepper Recipes Direct-Write Litho. Recipes
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)
AZ4110 R R A A R
AZ4210 R R A A A
AZ4330RS R R A A R
AZ4620 A A A A A
OCG 825-35CS A A A A A
SPR 955 CM-0.9 A R R R R
SPR 955 CM-1.8 A A R R A
SPR 220-3.0 R R R R R
SPR 220-7.0 R R R R A
THMR-IP3600 HP D A A R
UV6-0.8 R
UV210-0.3 R
UV26-2.5 A
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)
AZ5214-EIR R R R R R
AZnLOF 2020 R R R R R
AZnLOF 2035 A A A A A
AZnLOF 2070 A A A A A
AZnLOF 5510 A A R R A
UVN30-0.8 R
SU-8 2005,2010,2015 A R A A A
SU-8 2075 A A A A R
NR9-1000,3000,6000PY R R A R A
Anti-Reflection Coatings SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)
XHRiC-11 A A A
DUV42-P R
DS-K101-304 R
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)

Lift-Off Recipes

E-Beam Lithography Recipes (JEOL JBX-6300FS)

  • Under Development.

FIB Lithography Recipes (Raith Velion)

To Be Added

Automated Coat/Develop System Recipes (S-Cubed Flexi)

Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.

To Be Added

Holography Recipes

The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.

Low-K Spin-On Dielectric Recipes

Chemicals Stocked + Datasheets

The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband

DUV-248nm

Negative Photoresists

i-line and broadband

DUV-248nm

Underlayers
E-beam resists
Nanoimprinting
Contrast Enhancement Materials
Anti-Reflection Coatings
Adhesion Promoters
Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass

Developers
Photoresist Removers
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Lithography_Recipes&oldid=160128"