Difference between revisions of "Lithography Recipes"
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− | === |
+ | ==='''<big>Photolithography Processes</big>'''=== |
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#'''UV Optical Lithography''' |
#'''UV Optical Lithography''' |
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− | #*[[# |
+ | #*[[#PositivePR |'''Stocked Lithography Chemical + Datasheets''']] |
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− | #*[[#PositivePR |Stocked Lithography Chemical + Datasheets]] |
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#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.'' |
#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.'' |
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+ | #*[[#Photolithography_Recipes |'''Photo Lithography Recipe section''']] |
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+ | #**[[Contact Alignment Recipes|<u>Contact Aligner Recipes</u>]] |
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+ | #***[[Contact Alignment Recipes#Suss Aligners .28SUSS MJB-3.29|Suss MJB Aligners]] |
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+ | #***[[Contact Alignment Recipes#Contact Aligner .28SUSS MA-6.29|Suss MA6]] |
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+ | #**[[Stepper Recipes|<u>Stepper Recipes</u>]] |
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+ | #***[[Stepper Recipes#Stepper 1 .28GCA 6300.29|Stepper #1: GCA 6300]] (I-Line) |
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+ | #***[[Stepper Recipes#Stepper 2 .28AutoStep 200.29|Stepper #2: GCA Autostep 200]] (I-Line) |
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+ | #***[[Stepper Recipes#Stepper 3 .28ASML DUV.29|Stepper #3: ASML PAS 5500/300]] (DUV) |
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+ | #**[[Direct-Write Lithography Recipes|<u>Direct-Write Recipes</u>]] |
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+ | #***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29|Heidelberg MLA150]] |
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+ | #***[[Lithography Recipes#E-Beam Lithography Recipes|JEOL JBX-6300FS EBL]] |
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+ | #***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29|Raith Velion FIB]] |
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+ | #[[Lithography Recipes#General Photolithography Techniques|'''General Photolithography Techniques''']] |
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+ | #*''Techniques for improving litho. or solving common photolith. problems.'' |
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#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]''' |
#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]''' |
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#*''Verified Recipes for lift-off using various photolith. tools'' |
#*''Verified Recipes for lift-off using various photolith. tools'' |
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#**''Provided for reference, also showing starting recipes and usage info.'' |
#**''Provided for reference, also showing starting recipes and usage info.'' |
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#'''[[Lithography Recipes#Holography Recipes|Holography]]''' |
#'''[[Lithography Recipes#Holography Recipes|Holography]]''' |
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− | #*''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.'' |
+ | #*''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.'' |
#*''Recipes for silicon substrates are provided, and have been translated to other substrates by users.'' |
#*''Recipes for silicon substrates are provided, and have been translated to other substrates by users.'' |
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− | #'''[[#NanoImprinting |Nanoimprinting Resists]]''' |
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− | #*''Recipes provided are for use in the [[Nano-Imprint_(Nanonex_NX2000) |Nano-Imprint (Nanonex NX2000)]] system only.'' |
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− | === |
+ | ==='''<big>Photolithography Chemicals/Materials</big>'''=== |
+ | |||
#'''[[#Underlayers |Underlayers]]''' |
#'''[[#Underlayers |Underlayers]]''' |
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− | #*''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.'' |
+ | #*''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.'' |
#*''Datasheets are provided.'' |
#*''Datasheets are provided.'' |
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#'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''': |
#'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''': |
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#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials. |
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials. |
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− | #*''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.'' |
+ | #*''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.'' |
#*''Datasheets are provided for reference on use of the materials.'' |
#*''Datasheets are provided for reference on use of the materials.'' |
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#'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]''' |
#'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]''' |
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#*''Datasheets provided with usage info.'' |
#*''Datasheets provided with usage info.'' |
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#'''[[#AdhesionPromoters |Adhesion Promoters]]''' |
#'''[[#AdhesionPromoters |Adhesion Promoters]]''' |
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− | #*''These are used to improve wetting of photoresists to your substrate.'' |
+ | #*''These are used to improve wetting of photoresists to your substrate.'' |
#*''Datasheets are provided on use of these materials.'' |
#*''Datasheets are provided on use of these materials.'' |
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#'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]''' |
#'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]''' |
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#*''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.'' |
#*''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.'' |
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+ | ==General Photolithography Techniques== |
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+ | |||
+ | *[[Photolithography - Improving Adhesion Photoresist Adhesion|HMDS Process for Improving Adhesion]] |
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+ | **''Use these procedures if you are finding poor adhesion PR lifting-off), or for chemicals (like BHF) that attack the PR adhesion interface strongly.'' |
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+ | *[[Photolithography - Manual Edge-Bead Removal Techniques|Manual Edge-Bead Removal Techniques]] |
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+ | **''Removing the edge-bead from your substrate will help with contact litho resolution and alignment.'' |
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==Photolithography Recipes== |
==Photolithography Recipes== |
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{{Recipe Table Explanation}} |
{{Recipe Table Explanation}} |
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''Click the tool title to go to recipes for that tool.'' |
''Click the tool title to go to recipes for that tool.'' |
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! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]''' |
! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]''' |
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! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]''' |
! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]''' |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4330RS] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4330RS] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/8/8b/OCG825-Positive-Resist-Datasheet.pdf OCG 825-35CS] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/8/8b/OCG825-Positive-Resist-Datasheet.pdf OCG 825-35CS] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-0.9] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-0.9] |
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|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}} |
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}} |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/b/be/3600_D%2C_D2v_Spin_Speed_Curve.pdf THMR-IP3600 HP D] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/b/be/3600_D%2C_D2v_Spin_Speed_Curve.pdf THMR-IP3600 HP D] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2070] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2070] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/c/c9/UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf UVN30-0.8] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/7/78/SU-8-2015-revA.pdf SU-8 2005,2010,2015] |
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+ | |{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}} |
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+ | ! bgcolor="#D0E7FF" align="center" |'''Anti-Reflection Coatings''' |
{{LithRecipe Table}} |
{{LithRecipe Table}} |
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+ | | bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/33/XHRiC-Anti-Reflective-Coating.pdf XHRiC-11] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/af/DS-K101-304-Anti-Reflective-Coating.pdf DS-K101-304] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/af/DS-K101-304-Anti-Reflective-Coating.pdf DS-K101-304] |
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*Under Development. |
*Under Development. |
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− | == |
+ | ==[[Focused Ion-Beam Lithography (Raith Velion)|FIB Lithography Recipes (Raith Velion)]]== |
''To Be Added'' |
''To Be Added'' |
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''To Be Added'' |
''To Be Added'' |
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− | ==[[Nano-Imprint (Nanonex NX2000)|Nanoimprinting Recipes]]== |
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− | *{{fl|Thermal-Nanoimprint-Process-Tutorial-revA.pdf|Thermal Nanoimprint Process and Tutorial}} |
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− | *{{fl|Nanoinprint-Lithopgraphy-UV-Low-Pressure-Temperature-Ormostamp-PDMS-RevA.docx|UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process}} |
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==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]== |
==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]== |
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''The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.'' |
''The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.'' |
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− | *{{fl|Holography_Process_for_1D-lines_and_2D-dots_ |
+ | *{{fl|Holography_Process_for_1D-lines_and_2D-dots_%28ARC-11_%26_THMR-IP3600HP-D%29-updated-4-8-2021.pdf|Standard Holography Process - on SiO2 on Si}} |
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}} |
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}} |
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*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}} |
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}} |
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*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC-11 (i-line)}} |
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC-11 (i-line)}} |
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− | *{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P (DUV) (For AR2 replacement)}} |
+ | *{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P-6 (DUV) (For AR2 replacement)}} |
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}} |
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}} |
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Revision as of 11:25, 24 November 2021
Table of Contents |
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Photolithography Processes
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Photolithography Chemicals/Materials
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General Photolithography Techniques
- HMDS Process for Improving Adhesion
- Use these procedures if you are finding poor adhesion PR lifting-off), or for chemicals (like BHF) that attack the PR adhesion interface strongly.
- Manual Edge-Bead Removal Techniques
- Removing the edge-bead from your substrate will help with contact litho resolution and alignment.
Photolithography Recipes
- R = Recipe is available. Clicking this link will take you to the recipe.
- A = Material is available for use, but no recipes are provided.
Click the tool title to go to recipes for that tool.
Click the photoresist title to get the datasheet, also found in Stocked Chemicals + Datasheets.
Lift-Off Recipes
- Lift-Off Description/Tutorial
- How it works, process limits and considerations for designing your process
- I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner
- DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer
E-Beam Lithography Recipes (JEOL JBX-6300FS)
- Under Development.
FIB Lithography Recipes (Raith Velion)
To Be Added
Automated Coat/Develop System Recipes (S-Cubed Flexi)
Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.
To Be Added
Holography Recipes
The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.
- Standard Holography Process - on SiO2 on Si
- Holography Process Variations - Set-up Angle - Etching into SiO2 and Si
- Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width
- Reduce SiO2 Nanowire Diameter - Thermal Oxidation - Vapor HF Etching
Low-K Spin-On Dielectric Recipes
Chemicals Stocked + Datasheets
The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.