Difference between revisions of "Lithography Recipes"

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== Lift-Off Techniques ==
+
__NOTOC__
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{| class="wikitable"
 +
|+
 +
!Table of Contents
 +
|-
 +
|
 +
=== '''<big>Photolithography Processes</big>''' ===
 +
#'''UV Optical Lithography''' 
 +
#*[[#PositivePR  |'''Stocked Lithography Chemical + Datasheets''']]
 +
#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.''
 +
#*[[#Photolithography_Recipes |'''Photo Lithography Recipe section''']]
 +
#**''Starting recipes (spin, bake, exposure, develop etc.) for all photolith. tools.'' 
 +
#**''Substrate/surface materials/pattern size can affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.''
 +
#**[[Contact Alignment Recipes|<u>Contact Aligner Recipes</u>]]
 +
#***[[Contact Alignment Recipes#Suss Aligners .28SUSS MJB-3.29|Suss MJB Aligners]]
 +
#***[[Contact Alignment Recipes#Contact Aligner .28SUSS MA-6.29|Suss MA6]]
 +
#**[[Stepper Recipes|<u>Stepper Recipes</u>]]
 +
#***[[Stepper Recipes#Stepper 1 .28GCA 6300.29|Stepper #1: GCA 6300]] (I-Line)
 +
#***[[Stepper Recipes#Stepper 2 .28AutoStep 200.29|Stepper #2: GCA Autostep 200]] (I-Line)
 +
#***[[Stepper Recipes#Stepper 3 .28ASML DUV.29|Stepper #3: ASML PAS 5500/300]] (DUV)
 +
#**[[Direct-Write Lithography Recipes|<u>Direct-Write Recipes</u>]]
 +
#***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29|Heidelberg MLA150]]
 +
#***[[Lithography Recipes#E-Beam Lithography Recipes|JEOL JBX-6300FS EBL]]
 +
#***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29|Raith Velion FIB]]
 +
#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]'''
 +
#*''Verified Recipes for lift-off using various photolith. tools''
 +
#*''General educational description of this technique and it's limitations/considerations.''
 +
#'''E-beam Lithography'''
 +
#*[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]]
 +
#**''Has links to starting recipes.  Substrates and patterns play a large role in process parameters.''
 +
#*[[#EBLPR |EBL Photoresist Datasheets]]
 +
#**''Provided for reference, also showing starting recipes and usage info.''
 +
#'''[[Lithography Recipes#Holography Recipes|Holography]]'''
 +
#*''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.''
 +
#*''Recipes for silicon substrates are provided, and have been translated to other substrates by users.''
 +
#*''Datasheets are provided with starting recipes and usage info.''  
 +
|-
 +
|
  
*{{fl|Liftoff-Techniques.pdf|Description/Tutorial}}
+
=== '''<big>Photolithography Chemicals/Materials</big>''' ===
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
+
#'''[[#Underlayers  |Underlayers]]'''
 +
#*''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.'' 
 +
#*''Datasheets are provided.''
 +
#'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''': 
 +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
 +
#*''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.'' 
 +
#*''Datasheets are provided for reference on use of the materials.''
 +
#'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]'''
 +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
 +
#*''Used for resolution enhancement.  Not for use in contact aligners, typically used on I-Line Steppers.''
 +
#*''Datasheets provided with usage info.''
 +
#'''[[#AdhesionPromoters |Adhesion Promoters]]'''
 +
#*''These are used to improve wetting of photoresists to your substrate.''
 +
#*''Datasheets are provided on use of these materials.''
 +
#'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]''' 
 +
#*[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]]
 +
#**''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.''
 +
#*[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]]
 +
#**''Recipes for usage of some spin-on dielectrics.''
 +
#'''[[#Developers |Developers and Removers]]'''
 +
#*''Datasheets provided for reference.''
 +
#*''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.''
 +
|}
  
== Chemical Datasheets  ==
+
==Photolithography Recipes==
  
 +
{{Recipe Table Explanation}}
 +
''Click the tool title to go to recipes for that tool.''
 +
 +
''Click the photoresist title to get the datasheet, also found in [[Lithography Recipes#Chemicals Stocked .2B Datasheets|Stocked Chemicals + Datasheets]].''
 +
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
 +
|-
 +
! colspan="7" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div>
 +
 +
|-
 +
| bgcolor="#EAECF0" | <!-- INTENTIONALLY BLANK -->
 +
! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]'''
 +
! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]'''
 +
! align="center" |[[Direct-Write Lithography Recipes|Direct-Write Litho. Recipes]]
 +
|-
 +
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''
 +
{{LithRecipe Table}}
 +
|- bgcolor="EEFFFF"<!-- This is the Row color: lightblue -->
 +
| bgcolor="#D0E7FF" align="center" |[[:File:AXP4000pb-Datasheet.pdf|AZ4110]]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|A
 +
|A
 +
|
 +
|{{rl|MLA_Recipes|Positive Resist (MLA 150)}}
 +
|-<!-- This is a White row color -->
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4210]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|A
 +
|A
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4330RS]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|A
 +
|A
 +
|
 +
|{{rl|MLA_Recipes|Positive Resist (MLA 150)}}
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/a2/Az_p4620_photoresist_data_package.pdf AZ4620]
 +
|A
 +
|A
 +
|A
 +
|A
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/8/8b/OCG825-Positive-Resist-Datasheet.pdf OCG 825-35CS]
 +
| A
 +
| A
 +
| A
 +
| A
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-0.9]
 +
|A
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 +
|
 +
|{{rl|MLA Recipes|Positive Resist (MLA 150)}}
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-1.8]
 +
|A
 +
|A
 +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 +
|
 +
|{{rl|MLA Recipes|Positive Resist (MLA 150)}}
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-7.0]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/b/be/3600_D%2C_D2v_Spin_Speed_Curve.pdf THMR-IP3600 HP D]
 +
|
 +
|
 +
|A
 +
|A
 +
|
 +
|{{rl|MLA Recipes|Positive Resist (MLA 150)}}
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/38/UV6-Positive-Resist-Datasheet.pdf UV6-0.8]
 +
|
 +
|
 +
|
 +
|
 +
|{{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 +
|
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/ff/UV210-Positive-Resist-Datasheet.pdf UV210-0.3]
 +
|
 +
|
 +
|
 +
|
 +
|{{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 +
|
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/UV26-Positive-Resist-Datasheet.pdf UV26-2.5]
 +
|
 +
|
 +
|
 +
|
 +
|A
 +
|
 +
|- bgcolor="EEFFFF"
 +
! bgcolor="#D0E7FF" align="center" |'''Negative Resists'''
 +
{{LithRecipe Table}}
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/b/b0/AZ5214-Negative-Resist-Datasheet.pdf AZ5214-EIR]
 +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 +
|
 +
|{{rl|MLA Recipes|Negative Resist (MLA 150)}}
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2020]
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 +
|
 +
|{{rl|MLA Recipes|Negative Resist (MLA 150)}}
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2035]
 +
| bgcolor="EEFFFF" |A
 +
| bgcolor="EEFFFF" |A
 +
| bgcolor="EEFFFF" |A
 +
| bgcolor="EEFFFF" |A
 +
| bgcolor="EEFFFF" |
 +
| bgcolor="EEFFFF" |A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2070]
 +
|A
 +
|A
 +
|A
 +
|A
 +
|
 +
|A
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/8/82/AZnLOF5510-Negative-Resist-Datasheet.pdf AZnLOF 5510]
 +
|A
 +
|A
 +
|{{rl|Stepper Recipes|Negative Resist (GCA 6300)}}
 +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/c/c9/UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf UVN30-0.8]
 +
|
 +
|
 +
|
 +
|
 +
|{{rl|Stepper Recipes|Negative Resist (ASML DUV)}}
 +
|
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/7/78/SU-8-2015-revA.pdf SU-8 2005,2010,2015]
 +
| A
 +
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 +
| A
 +
| A
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/2c/SU-8-2075-revA.pdf SU-8 2075]
 +
|A
 +
|A
 +
|A
 +
|A
 +
|
 +
|{{rl|MLA Recipes|Negative Resist (MLA 150)}}
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |NR9-[//wiki.nanotech.ucsb.edu/w/images/8/8f/NR9-1000PY-revA.pdf 1000],[//wiki.nanotech.ucsb.edu/w/images/7/71/NR9-3000PY-revA.pdf 3000],[//wiki.nanotech.ucsb.edu/w/images/f/f9/NR9-6000PY-revA.pdf 6000]PY
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 +
|A
 +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings'''
 +
{{LithRecipe Table}}
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/33/XHRiC-Anti-Reflective-Coating.pdf XHRiC-11]
 +
|
 +
|
 +
|A
 +
|A
 +
|
 +
|A
 +
|- bgcolor="EEFFFF"
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/DUV42P-Anti-Reflective-Coating.pdf DUV42-P]
 +
|
 +
|
 +
|
 +
|
 +
|{{rl|Stepper Recipes|DUV-42P}}
 +
|
 +
|-
 +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/af/DS-K101-304-Anti-Reflective-Coating.pdf DS-K101-304]
 +
|
 +
|
 +
|
 +
|
 +
|{{rl|Stepper Recipes|DS-K101-304}}
 +
|
 +
|-
 +
! bgcolor="#D0E7FF" align="center" |
 +
{{LithRecipe Table}}
 +
|}
 +
<!-- end Litho Recipes table -->
 +
 +
==Lift-Off Recipes==
 +
 +
*{{fl|Liftoff-Techniques.pdf|Lift-Off Description/Tutorial}}
 +
**How it works, process limits and considerations for designing your process
 +
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
 +
*[[Lift-Off with DUV Imaging + PMGI Underlayer|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
 +
 +
==[[E-Beam Lithography System (JEOL JBX-6300FS)|E-Beam Lithography Recipes (JEOL JBX-6300FS)]]==
 +
 +
*Under Development.
 +
 +
== [[Focused Ion-Beam Lithography (Raith Velion)|FIB Lithography Recipes (Raith Velion)]] ==
 +
''To Be Added''
 +
 +
==[[Automated Coat/Develop System (S-Cubed Flexi)|Automated Coat/Develop System Recipes (S-Cubed Flexi)]]==
 +
Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.
 +
 +
''To Be Added''
 +
 +
==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]==
 +
''The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.''
 +
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_%28ARC-11_%26_THMR-IP3600HP-D%29-updated-4-8-2021.pdf|Standard Holography Process - on SiO2 on Si}}
 +
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
 +
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
 +
*{{fl|30-Redicing_Nanowire_Diameter_by_Thermal_Oxidation_and_Vapored_HF_Etch.pdf|Reduce SiO2 Nanowire Diameter - Thermal Oxidation - Vapor HF Etching}}
 +
 +
==Low-K Spin-On Dielectric Recipes==
 +
 +
*{{fl|Lithography-BCB-photo-lowk-dielectric-spinon-4024-40-revA.docx|Photo BCB (4024-40)}}
 +
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
 +
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
 +
 +
==Chemicals Stocked + Datasheets==
 +
''The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each.  The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.''
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
| width="400" |  
+
| width="400" |
;Positive Photoresists
+
;<div id="PositivePR"><big>Positive Photoresists</big></div>
 +
 
 +
'''''i-line and broadband'''''
 +
 
 +
*{{fl|AXP4000pb-Datasheet.pdf|AZP4000 (AZ4110, AZ4210, AZ4330)}}
 +
*{{fl|OCG825-Positive-Resist-Datasheet.pdf|OCG825}}
 +
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
 +
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
 +
*THMR-3600HP (Thin I-Line & Holography)
 +
**{{fl|THMR_iP_3500_iP3600.pdf|Evaluation Results: THMR-3600HP}}
 +
**{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|Spin Curves for THMR-3600HP}}
 +
**{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|Safety Datasheet for THMR-3600HP}}
 +
 
 +
'''''DUV-248nm'''''
  
*{{fl|AXP4000pb-Datasheet.pdf|AZP4000 (AZ4110, AZ4210, AZ4330)}}
 
*{{fl|OCG825-Positive-Resist-Datasheet.pdf|OCG825}}
 
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
 
*{{fl|SPR950-Positive-Resist-Datasheet.pdf|SPR950-0.8}}
 
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
 
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.7}}
 
 
*{{fl|UV210-Positive-Resist-Datasheet.pdf|UV210-0.3}}
 
*{{fl|UV210-Positive-Resist-Datasheet.pdf|UV210-0.3}}
 +
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
 +
*{{fl|UV26-Positive-Resist-Datasheet.pdf|UV26-2.5}}
 +
 +
;<div id="NegativePR"><big>Negative Photoresists</big></div>
 +
 +
'''''i-line and broadband'''''
  
;Negative Photoresists
+
*{{fl|AZ5214-Negative-Resist-Datasheet.pdf|AZ5214}}
 +
*{{fl|AZnLOF5510-Negative-Resist-Datasheet.pdf|AZnLOF5510}}
 +
*{{fl|AZnLOF2020-Negative-Resist-Datasheet.pdf|AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070)}}
 +
*{{fl|NR9-1000PY-revA.pdf|Futurrex NR9-1000PY(use AZ300MIF dev)}}
 +
*{{fl|NR9-3000PY-revA.pdf|Futurrex NR9-3000PY(use AZ300MIF dev)}}
 +
*{{fl|NR9-6000PY-revA.pdf|Futurrex NR9-6000PY(use AZ300MIF dev)}}
 +
*{{fl|SU-8-2015-revA.pdf|SU-8-2005,2010, 2015}}
 +
*{{fl|SU-8-2075-revA.pdf|SU-8-2075}}
  
*{{fl|AZ5214-Negative-Resist-Datasheet.pdf|AZ5214}}
+
'''''DUV-248nm'''''
*{{fl|AZnLOF5510-Negative-Resist-Datasheet.pdf|AZnLOF5510}}
 
*{{fl|AZnLOF2020-Negative-Resist-Datasheet.pdf|AZnLOF2000 (AZnLOF2020, AZnLOF2035, AZnLOF2070)}}
 
*{{fl|UVN2300-Negative-Resist-Datasheet.pdf|UVN2300-0.5}}
 
  
;Underlayers
+
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30-0.8}}
  
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF-11, PMGI SF-13, PMGI SF-15)}}  
+
;<div id="Underlayers"><big>Underlayers</big></div>
 +
 
 +
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
 
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
 
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
  
;E-beam resists
+
;<div id="EBLPR"><big>E-beam resists</big></div>
  
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}  
+
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
 
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
 
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
  
|
+
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
;Nanoimprinting
 
  
*{{fl|NX1020-Nanoimprinting-Datasheet.pdf|NX1020}}  
+
*{{fl|NX1020-Nanoimprinting-Datasheet.pdf|NX1020}}
 
*{{fl|MRI-7020-Nanoimprinting-Datasheet.pdf|MRI-7020}}
 
*{{fl|MRI-7020-Nanoimprinting-Datasheet.pdf|MRI-7020}}
 +
*{{fl|Mr-UVCur21.pdf|MR-UVCur21}}
 +
*{{fl|OrmoStamp-NIL-Lithography-UV-Soft-RevA.pdf|Ormostamp}}
  
;Contrast Enhancement Materials
+
|
 +
;<div id="ContrastEnhancement"><big>Contrast Enhancement Materials</big></div>
  
 
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
 
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
  
;Anti-Reflection Coatings
+
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
 
 
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC}}
 
*{{fl|AR2-Anti-Reflective-Coating.pdf|AR2}}
 
*{{fl|DS-K101-Anti-Reflective-Coating.pdf|DS-K101 (developable BARC)}}
 
  
;Developers
+
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC-11 (i-line)}}
 +
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P-6 (DUV) (For AR2 replacement)}}
 +
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
  
*{{fl|AZ400K-Developer-Datasheet.pdf|AZ400K (AZ400K, AZ400K1:4)}}
+
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
*{{fl|AZ300MIF-Developer-Datasheet.pdf|AZ300MIF}}
 
  
;Photoresist Removers
+
*HMDS
 +
*AP3000 BCB Adhesion Promoter
 +
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
 +
*{{fl|OrmoPrime-NIL-Adhesion-RevA.pdf|Ormoprime08-Ormostsmp Adhesion Promoter}}
  
*{{fl|1165-Resist-Remover.pdf|1165}}
+
;<div id="SpinOnDielectrics"><big>Spin-On Dielectrics</big></div>
*{{fl|AZ300T-Resist-Remover.pdf|AZ300T}}
 
*{{fl|PRX-127-Resist-Remover.pdf|PRX-127}}
 
  
|}
+
''Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass''
  
== Recipes  ==
+
*{{fl|BCB-cyclotene-3000-revA.pdf|BCB, Cyclotene 3022-46(Not Photosensitive)}}
 +
*{{fl|BCB-cyclotene-4000-revA.pdf|PhotoBCB, Cyclotene 4022-40(Negative Polarity)}}
 +
*{{fl|BCB-adhesion.pdf|BCB Adhesion Notes from Vendor}}
 +
*{{fl|BCB-rework.pdf|BCB rework Notes from Vendor}}
 +
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
 +
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
  
{{Recipe Table Explanation}}
+
;<div id="Developers"><big>Developers</big></div>
  
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" class="wikitable"
+
*{{fl|AZ400K-Developer-Datasheet.pdf|AZ400K (AZ400K, AZ400K1:4)}}
|- bgcolor="#D0E7FF"
+
*{{fl|AZ300MIF-Developer-Datasheet.pdf|AZ300MIF}}
! height="45" colspan="9" | <div style="font-size: 150%;">Lithography Recipes</div>
+
*DS2100 BCB Developer
|- bgcolor="#D0E7FF"
+
*SU-8 Developer
| <!-- INTENTIONALLY LEFT BLANK --> <br>
+
*101A Developer (for DUV Flood Exposed PMGI)
! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[Contact Alignment Recipes|Contact Aligners]]'''
 
! bgcolor="#D0E7FF" align="center" colspan="3" | '''[[Stepper Recipes|Steppers]]'''
 
! width="30" bgcolor="#D0E7FF" align="center" | '''[[Flood Exposure Recipes|Flood Expose]]'''
 
! bgcolor="#D0E7FF" align="center" colspan="2" | '''[[E-Beam Lithography Recipes|E-Beam Lithography]]'''
 
|-
 
! width="150" bgcolor="#D0E7FF" align="center" | '''Positive Resists'''
 
{{LithRecipe Table}}
 
  
|-
+
;<div id="PRRemovers"><big>Photoresist Removers</big></div>
| bgcolor="#D0E7FF" align="center" | AZ4110
 
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
|-
 
| bgcolor="#D0E7FF" align="center" | AZ4210
 
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
| A
 
| A
 
| <br>
 
| <br>
 
| <br>
 
| <br>
 
|-
 
| bgcolor="#D0E7FF" align="center" | AZ4330RS
 
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
|-
 
| bgcolor="#D0E7FF" align="center" | OCG 825-35CS
 
| A
 
| A
 
| A
 
| A
 
| <br>
 
| <br>
 
| <br>
 
| <br>
 
|-
 
| bgcolor="#D0E7FF" align="center" | SPR 950-0.8
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
|-
 
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-0.9
 
| A
 
| A
 
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
| <br>  
 
| <br>  
 
| <br>  
 
| <br>
 
|-
 
| bgcolor="#D0E7FF" align="center" | SPR 955 CM-1.8
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
|-
 
| bgcolor="#D0E7FF" align="center" | SPR 220-3.0
 
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
| {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
| {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
| {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
| <br>
 
| <br>
 
| <br>
 
| <br>
 
|-
 
| bgcolor="#D0E7FF" align="center" | SPR 220-7.0
 
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
| bgcolor="EEFFFF" | {{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (GCA 6300)}}
 
| bgcolor="EEFFFF" | {{rl|Stepper Recipes|Positive Resist (AutoStep 200)}}
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
|-
 
| bgcolor="#D0E7FF" align="center" | THMR-IP3600 HP D
 
| <br>
 
| <br>
 
| A
 
| A
 
| <br>
 
| <br>
 
| <br>
 
| <br>
 
|-
 
| bgcolor="#D0E7FF" align="center" | UV6-0.7
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" | A
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
| bgcolor="EEFFFF" |
 
|-
 
! bgcolor="#D0E7FF" align="center" | '''Negative Resists'''
 
{{LithRecipe Table}}
 
  
|- bgcolor="EEFFFF"
+
*[http://www.microchemicals.com/products/remover_stripper/nmp.html AZ NMP]
| bgcolor="#D0E7FF" align="center" | AZ5214-EIR
+
**''This replaces {{fl|1165-Resist-Remover.pdf|1165}}''
| {{rl|Contact_Alignment_Recipes|Negative Resist (MJB-3)}}
+
*{{fl|AZ300T-Resist-Remover.pdf|AZ300T}}
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
+
*{{fl|RemoverPG-revA.pdf|Remover PG, SU-8 stripper}}
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}  
+
*AZ EBR ("Edge Bead Remover", PGMEA)
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
|
 
|
 
|
 
|
 
|-
 
| bgcolor="#D0E7FF" align="center" | AZnLOF 2020
 
| {{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
| {{rl|Contact_Alignment_Recipes|Negative Resist (MA-6)}}
 
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}  
 
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
|
 
|
 
|
 
|
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | AZnLOF 2035
 
| A
 
| A
 
| A
 
| A
 
|
 
|
 
|
 
|
 
|-
 
| bgcolor="#D0E7FF" align="center" | AZnLOF 2070
 
| A
 
| A
 
| A
 
| A
 
|
 
|
 
|
 
|
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | AZnLOF 5510
 
| A
 
| A
 
| {{rl|Stepper Recipes|Negative Resist (GCA 6300)}}  
 
| {{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
|
 
|
 
|
 
|
 
|-
 
| bgcolor="#D0E7FF" align="center" | UVN30-0.5
 
|
 
|
 
|
 
|
 
| A
 
|
 
|
 
|
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | SU-8 2015
 
| A
 
| A
 
| A
 
| A
 
|
 
|
 
|
 
|
 
|-
 
! bgcolor="#D0E7FF" align="center" | '''Underlayers'''
 
{{LithRecipe Table}}
 
  
|- bgcolor="EEFFFF"
+
|}
| bgcolor="#D0E7FF" align="center" | PMGI SF-11
 
| <br>
 
| <br>
 
| <br>
 
| <br>
 
| <br>
 
| <br>
 
| <br>
 
| <br>
 
|-
 
| bgcolor="#D0E7FF" align="center" | PMGI SF-15
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | LOL 2000
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|-
 
| bgcolor="#D0E7FF" align="center" | XHRIC-11 (BARC)
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | AR-2 (BARC)
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|-
 
| bgcolor="#D0E7FF" align="center" | DS-K 101-307 (BARC)
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|-
 
! bgcolor="#D0E7FF" align="center" | '''Overlayers'''
 
{{LithRecipe Table}}
 
 
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | CEM-365 IS
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|-
 
! bgcolor="#D0E7FF" align="center" | '''E-Beam Resists'''
 
{{LithRecipe Table}}  
 
  
|- bgcolor="EEFFFF"
+
[[Category: Processing]]
| bgcolor="#D0E7FF" align="center" | &nbsp;??????
+
[[category: Lithography]]
|
+
[[category: Recipes]]
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|-
 
| bgcolor="#D0E7FF" align="center" | &nbsp;???????
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|-
 
! bgcolor="#D0E7FF" align="center" | '''Nanoimprint Resists'''
 
{{LithRecipe Table}}
 
 
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" | MR-I 7020
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|-
 
| bgcolor="#D0E7FF" align="center" | Nanonex NX-1020
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|-
 
! bgcolor="#D0E7FF" align="center" |
 
{{LithRecipe Table}}
 
 
 
|}
 

Latest revision as of 12:52, 17 May 2021

Table of Contents

Photolithography Processes

  1. UV Optical Lithography
  2. Lift-Off Recipes
    • Verified Recipes for lift-off using various photolith. tools
    • General educational description of this technique and it's limitations/considerations.
  3. E-beam Lithography
  4. Holography
    • For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.
    • Recipes for silicon substrates are provided, and have been translated to other substrates by users.
    • Datasheets are provided with starting recipes and usage info.

Photolithography Chemicals/Materials

  1. Underlayers
    • These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.
    • Datasheets are provided.
  2. Anti-Reflection Coatings:
    • The Photoresist Recipes section contains recipes using these materials.
    • Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.
    • Datasheets are provided for reference on use of the materials.
  3. Contrast Enhancement Materials (CEM)
    • The Photoresist Recipes section contains recipes using these materials.
    • Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.
    • Datasheets provided with usage info.
  4. Adhesion Promoters
    • These are used to improve wetting of photoresists to your substrate.
    • Datasheets are provided on use of these materials.
  5. Low-K Spin-on Dielectrics
  6. Developers and Removers
    • Datasheets provided for reference.
    • Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.

Photolithography Recipes

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.

Click the tool title to go to recipes for that tool.

Click the photoresist title to get the datasheet, also found in Stocked Chemicals + Datasheets.

Photolithography Recipes
Contact Aligner Recipes Stepper Recipes Direct-Write Litho. Recipes
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ4110 R R A A R
AZ4210 R R A A A
AZ4330RS R R A A R
AZ4620 A A A A A
OCG 825-35CS A A A A A
SPR 955 CM-0.9 A R R R R
SPR 955 CM-1.8 A A R R A
SPR 220-3.0 R R R R R
SPR 220-7.0 R R R R A
THMR-IP3600 HP D A A R
UV6-0.8 R
UV210-0.3 R
UV26-2.5 A
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ5214-EIR R R R R R
AZnLOF 2020 R R R R R
AZnLOF 2035 A A A A A
AZnLOF 2070 A A A A A
AZnLOF 5510 A A R R A
UVN30-0.8 R
SU-8 2005,2010,2015 A R A A A
SU-8 2075 A A A A R
NR9-1000,3000,6000PY R R A R A
Anti-Reflection Coatings SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
XHRiC-11 A A A
DUV42-P R
DS-K101-304 R
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)

Lift-Off Recipes

E-Beam Lithography Recipes (JEOL JBX-6300FS)

  • Under Development.

FIB Lithography Recipes (Raith Velion)

To Be Added

Automated Coat/Develop System Recipes (S-Cubed Flexi)

Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.

To Be Added

Holography Recipes

The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.

Low-K Spin-On Dielectric Recipes

Chemicals Stocked + Datasheets

The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband

DUV-248nm

Negative Photoresists

i-line and broadband

DUV-248nm

Underlayers
E-beam resists
Nanoimprinting
Contrast Enhancement Materials
Anti-Reflection Coatings
Adhesion Promoters
Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass

Developers
Photoresist Removers