Difference between revisions of "Lithography Recipes"

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__NOTOC__
==General Information==
 
 
This page contains information and links to recipes/datasheets spin-coated materials used in the facility.
 
 
 
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=== '''<big>Photolithography Processes</big>''' ===
*'''[[#PositivePR |Photoresists]]'''
 
**[[#Photolithography_Recipes |Photo Lithography Recipe section]]
+
#'''UV Optical Lithography'''
  +
#*[[#PositivePR |'''Stocked Lithography Chemical + Datasheets''']]
***''Has links to starting recipes (spin, bake, exposure, develop etc.).''
 
  +
#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.''
***''Substrate, surface materials, pattern size can often affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.''
 
**[[#PositivePR |Stocked Lithography Chemical + Datasheets]]
+
#*[[#Photolithography_Recipes |'''Photo Lithography Recipe section''']]
  +
#**''Starting recipes (spin, bake, exposure, develop etc.) for all photolith. tools.''
***''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.''
 
  +
#**''Substrate/surface materials/pattern size can affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.''
*'''[[#EBLPR |E-beam Lithography Resists]]'''
 
  +
#**[[Contact Alignment Recipes|<u>Contact Aligner Recipes</u>]]
**[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]]
 
  +
#***[[Contact Alignment Recipes#Suss Aligners .28SUSS MJB-3.29|Suss MJB Aligners]]
***''Has links to starting recipes. Substrates and patterns play a large role in process parameters.''
 
  +
#***[[Contact Alignment Recipes#Contact Aligner .28SUSS MA-6.29|Suss MA6]]
**[[#EBLPR |EBL Photoresist Datasheets]]
 
  +
#**[[Stepper Recipes|<u>Stepper Recipes</u>]]
***''Provided for reference, also showing starting recipes and usage info.''
 
  +
#***[[Stepper Recipes#Stepper 1 .28GCA 6300.29|Stepper #1: GCA 6300]] (I-Line)
*'''[[#NanoImprinting |Nanoimprinting Resists]]'''
 
  +
#***[[Stepper Recipes#Stepper 2 .28AutoStep 200.29|Stepper #2: GCA Autostep 200]] (I-Line)
**''Datasheets are provided with starting recipes and usage info.''
 
  +
#***[[Stepper Recipes#Stepper 3 .28ASML DUV.29|Stepper #3: ASML PAS 5500/300]] (DUV)
**''Recipes provided are for use in the [[Nano-Imprint_(Nanonex_NX2000) |Nano-Imprint (Nanonex NX2000)]] system only.''
 
  +
#**[[Direct-Write Lithography Recipes|<u>Direct-Write Recipes</u>]]
  +
#***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29|Heidelberg MLA150]]
  +
#***[[Lithography Recipes#E-Beam Lithography Recipes|JEOL JBX-6300FS EBL]]
  +
#***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29|Raith Velion FIB]]
  +
#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]'''
  +
#*''Verified Recipes for lift-off using various photolith. tools''
  +
#*''General educational description of this technique and it's limitations/considerations.''
  +
#'''E-beam Lithography'''
  +
#*[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]]
  +
#**''Has links to starting recipes. Substrates and patterns play a large role in process parameters.''
  +
#*[[#EBLPR |EBL Photoresist Datasheets]]
  +
#**''Provided for reference, also showing starting recipes and usage info.''
  +
#'''[[Lithography Recipes#Holography Recipes|Holography]]'''
  +
#*''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.''
  +
#*''Recipes for silicon substrates are provided, and have been translated to other substrates by users.''
  +
#*''Datasheets are provided with starting recipes and usage info.''
  +
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=== '''<big>Photolithography Chemicals/Materials</big>''' ===
*'''[[#Underlayers |Underlayers]]'''
 
  +
#'''[[#Underlayers |Underlayers]]'''
**''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.''
 
  +
#*''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.''
**''Datasheets are provided.''
 
  +
#*''Datasheets are provided.''
*[[#Lift-Off_Techniques |'''Lift-Off Techniques''']]
 
  +
#'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''':
**''Verified Recipes for lift-off using various photolith. tools''
 
  +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
**''General educational description of this technique and it's limitations/considerations.''
 
  +
#*''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.''
*'''[[Lithography Recipes#Holography Recipes|Holography]]'''
 
  +
#*''Datasheets are provided for reference on use of the materials.''
**''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.''
 
  +
#'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]'''
**''Recipes for silicon substrates are provided, and have been translated to other substrates by users.''
 
  +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
*'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''':
 
  +
#*''Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.''
**[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
 
  +
#*''Datasheets provided with usage info.''
**''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.''
 
  +
#'''[[#AdhesionPromoters |Adhesion Promoters]]'''
**''Datasheets are provided for reference on use of the materials.''
 
  +
#*''These are used to improve wetting of photoresists to your substrate.''
*'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]'''
 
**[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
+
#*''Datasheets are provided on use of these materials.''
  +
#'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]'''
**''Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.''
 
  +
#*[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]]
**''Datasheets provided with usage info.''
 
  +
#**''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.''
*'''[[#AdhesionPromoters |Adhesion Promoters]]'''
 
  +
#*[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]]
**''These are used to improve wetting of photoresists to your substrate.''
 
**''Datasheets are provided on use of these materials.''
+
#**''Recipes for usage of some spin-on dielectrics.''
  +
#'''[[#Developers |Developers and Removers]]'''
 
  +
#*''Datasheets provided for reference.''
*'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]'''
 
  +
#*''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.''
**[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]]
 
***''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.''
 
**[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]]
 
***''Recipes for usage of some spin-on dielectrics.''
 
*'''[[#Developers |Developers and Removers]]'''
 
**''Datasheets provided for reference.''
 
**''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.''
 
 
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{{Recipe Table Explanation}}
 
{{Recipe Table Explanation}}
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''Click the tool title to go to recipes for that tool.''
   
  +
''Click the photoresist title to get the datasheet, also found in [[Lithography Recipes#Chemicals Stocked .2B Datasheets|Stocked Chemicals + Datasheets]].''
 
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
 
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
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|-
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! colspan="9" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div>
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! colspan="7" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div>
 
|- bgcolor="#D0E7FF"
 
|<!-- INTENTIONALLY LEFT BLANK --><br>
 
! colspan="2" bgcolor="#D0E7FF" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]'''
 
! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Stepper Recipes|<big>Steppers Recipes</big>]]'''
 
   
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|-
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| bgcolor="#EAECF0" | <!-- INTENTIONALLY BLANK -->
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! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]'''
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! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]'''
  +
! align="center" |[[Direct-Write Lithography Recipes|Direct-Write Litho. Recipes]]
 
|-
 
|-
 
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''
 
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''
 
{{LithRecipe Table}}
 
{{LithRecipe Table}}
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| bgcolor="#D0E7FF" align="center" |AZ4110
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| bgcolor="#D0E7FF" align="center" |[[:File:AXP4000pb-Datasheet.pdf|AZ4110]]
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4210]
| bgcolor="EEFFFF" |{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
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| bgcolor="EEFFFF" |
 
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| bgcolor="EEFFFF" |{{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 
 
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|{{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
 
|{{rl|Stepper Recipes|Positive Resist (ASML DUV)}}
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| bgcolor="#D0E7FF" align="center" |UV26-2.5
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! bgcolor="#D0E7FF" align="center" |'''Negative Resists'''
 
! bgcolor="#D0E7FF" align="center" |'''Negative Resists'''
 
{{LithRecipe Table}}
 
{{LithRecipe Table}}
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  +
| bgcolor="#D0E7FF" align="center" |NR9-[//wiki.nanotech.ucsb.edu/w/images/8/8f/NR9-1000PY-revA.pdf 1000],[//wiki.nanotech.ucsb.edu/w/images/7/71/NR9-3000PY-revA.pdf 3000],[//wiki.nanotech.ucsb.edu/w/images/f/f9/NR9-6000PY-revA.pdf 6000]PY
| bgcolor="#D0E7FF" align="center" |SU-8 2075
 
|A
 
|A
 
|A
 
|A
 
|
 
 
|- bgcolor="EEFFFF"
 
| bgcolor="#D0E7FF" align="center" |NR9-1000,3000,6000PY
 
 
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
 
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
Line 248: Line 259:
 
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
 
|
 
|
  +
|A
 
  +
|- bgcolor="EEFFFF"
|-
 
 
! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings'''
 
! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings'''
 
{{LithRecipe Table}}
 
{{LithRecipe Table}}
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/33/XHRiC-Anti-Reflective-Coating.pdf XHRiC-11]
  +
|
  +
|
  +
|A
  +
|A
  +
|
  +
|A
 
|- bgcolor="EEFFFF"
 
|- bgcolor="EEFFFF"
| bgcolor="#D0E7FF" align="center" |DUV42-P
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/DUV42P-Anti-Reflective-Coating.pdf DUV42-P]
 
|
 
|
 
|
 
|
Line 259: Line 278:
 
|
 
|
 
|{{rl|Stepper Recipes|DUV-42P}}
 
|{{rl|Stepper Recipes|DUV-42P}}
  +
|
 
 
|-
 
|-
| bgcolor="#D0E7FF" align="center" |DS-K101-304
+
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/af/DS-K101-304-Anti-Reflective-Coating.pdf DS-K101-304]
 
|
 
|
 
|
 
|
Line 267: Line 286:
 
|
 
|
 
|{{rl|Stepper Recipes|DS-K101-304}}
 
|{{rl|Stepper Recipes|DS-K101-304}}
  +
|
 
 
|-
 
|-
 
! bgcolor="#D0E7FF" align="center" |
 
! bgcolor="#D0E7FF" align="center" |
Line 274: Line 293:
 
<!-- end Litho Recipes table -->
 
<!-- end Litho Recipes table -->
   
==E-Beam Lithography Recipes==
+
==Lift-Off Recipes==
  +
  +
*{{fl|Liftoff-Techniques.pdf|Lift-Off Description/Tutorial}}
  +
**How it works, process limits and considerations for designing your process
  +
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
  +
*[[Lift-Off with DUV Imaging + PMGI Underlayer|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
  +
  +
==[[E-Beam Lithography System (JEOL JBX-6300FS)|E-Beam Lithography Recipes (JEOL JBX-6300FS)]]==
   
 
*Under Development.
 
*Under Development.
  +
  +
== [[Focused Ion-Beam Lithography (Raith Velion)|FIB Lithography Recipes (Raith Velion)]] ==
  +
''To Be Added''
   
 
==[[Automated Coat/Develop System (S-Cubed Flexi)|Automated Coat/Develop System Recipes (S-Cubed Flexi)]]==
 
==[[Automated Coat/Develop System (S-Cubed Flexi)|Automated Coat/Develop System Recipes (S-Cubed Flexi)]]==
Line 283: Line 312:
 
''To Be Added''
 
''To Be Added''
   
  +
==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]==
==Nanoimprinting Recipes==
 
  +
''The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.''
 
  +
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_%28ARC-11_%26_THMR-IP3600HP-D%29-updated-4-8-2021.pdf|Standard Holography Process - on SiO2 on Si}}
*{{fl|Thermal-Nanoimprint-Process-Tutorial-revA.pdf|Thermal Nanoimprint Process and Tutorial}}
 
*{{fl|Nanoinprint-Lithopgraphy-UV-Low-Pressure-Temperature-Ormostamp-PDMS-RevA.docx|UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process}}
 
 
==Holography Recipes==
 
 
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_(ARC-11_%26_THMR-IP3600HP-D)-updated-8-13-2018-A.pdf|Standard Holography Process - on SiO2 on Si}}
 
 
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
 
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
 
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
 
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
Line 300: Line 324:
 
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
 
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
 
==Lift-Off Techniques==
 
 
*{{fl|Liftoff-Techniques.pdf|Lift-Off Description/Tutorial}}
 
**How it works, process limits and considerations for designing your process
 
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
 
*[[Lift-Off with DUV Imaging + PMGI Underlayer|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
 
   
 
==Chemicals Stocked + Datasheets==
 
==Chemicals Stocked + Datasheets==
Line 321: Line 338:
 
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
 
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
 
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
 
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
*{{fl|THMR_iP_3500_iP3600.pdf|THMR-3600HP-1 (thin i-line and Holography)}}
+
*THMR-3600HP (Thin I-Line & Holography)
*{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|THMR-3600HP-2 (thin i-line and Holography)}}
+
**{{fl|THMR_iP_3500_iP3600.pdf|Evaluation Results: THMR-3600HP}}
*{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|THMR-3600HP-3 (thin i-line and Holography)}}
+
**{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|Spin Curves for THMR-3600HP}}
  +
**{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|Safety Datasheet for THMR-3600HP}}
   
 
'''''DUV-248nm'''''
 
'''''DUV-248nm'''''
Line 372: Line 390:
 
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
 
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
   
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC (i-line)}}
+
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC-11 (i-line)}}
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P (DUV) (For AR2 replacement)}}
+
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P-6 (DUV) (For AR2 replacement)}}
 
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
 
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
   
Line 412: Line 430:
 
|}
 
|}
   
[[Category:Processing]]
+
[[Category: Processing]]
  +
[[category: Lithography]]
  +
[[category: Recipes]]

Latest revision as of 12:52, 17 May 2021

Table of Contents

Photolithography Processes

  1. UV Optical Lithography
  2. Lift-Off Recipes
    • Verified Recipes for lift-off using various photolith. tools
    • General educational description of this technique and it's limitations/considerations.
  3. E-beam Lithography
  4. Holography
    • For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.
    • Recipes for silicon substrates are provided, and have been translated to other substrates by users.
    • Datasheets are provided with starting recipes and usage info.

Photolithography Chemicals/Materials

  1. Underlayers
    • These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.
    • Datasheets are provided.
  2. Anti-Reflection Coatings:
    • The Photoresist Recipes section contains recipes using these materials.
    • Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.
    • Datasheets are provided for reference on use of the materials.
  3. Contrast Enhancement Materials (CEM)
    • The Photoresist Recipes section contains recipes using these materials.
    • Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.
    • Datasheets provided with usage info.
  4. Adhesion Promoters
    • These are used to improve wetting of photoresists to your substrate.
    • Datasheets are provided on use of these materials.
  5. Low-K Spin-on Dielectrics
  6. Developers and Removers
    • Datasheets provided for reference.
    • Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.

Photolithography Recipes

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.

Click the tool title to go to recipes for that tool.

Click the photoresist title to get the datasheet, also found in Stocked Chemicals + Datasheets.

Photolithography Recipes
Contact Aligner Recipes Stepper Recipes Direct-Write Litho. Recipes
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ4110 R R A A R
AZ4210 R R A A A
AZ4330RS R R A A R
AZ4620 A A A A A
OCG 825-35CS A A A A A
SPR 955 CM-0.9 A R R R R
SPR 955 CM-1.8 A A R R A
SPR 220-3.0 R R R R R
SPR 220-7.0 R R R R A
THMR-IP3600 HP D A A R
UV6-0.8 R
UV210-0.3 R
UV26-2.5 A
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ5214-EIR R R R R R
AZnLOF 2020 R R R R R
AZnLOF 2035 A A A A A
AZnLOF 2070 A A A A A
AZnLOF 5510 A A R R A
UVN30-0.8 R
SU-8 2005,2010,2015 A R A A A
SU-8 2075 A A A A R
NR9-1000,3000,6000PY R R A R A
Anti-Reflection Coatings SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
XHRiC-11 A A A
DUV42-P R
DS-K101-304 R
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)

Lift-Off Recipes

E-Beam Lithography Recipes (JEOL JBX-6300FS)

  • Under Development.

FIB Lithography Recipes (Raith Velion)

To Be Added

Automated Coat/Develop System Recipes (S-Cubed Flexi)

Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.

To Be Added

Holography Recipes

The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.

Low-K Spin-On Dielectric Recipes

Chemicals Stocked + Datasheets

The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband

DUV-248nm

Negative Photoresists

i-line and broadband

DUV-248nm

Underlayers
E-beam resists
Nanoimprinting
Contrast Enhancement Materials
Anti-Reflection Coatings
Adhesion Promoters
Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass

Developers
Photoresist Removers