Difference between revisions of "Lithography Recipes"

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(→‎Lift-Off Techniques: added links to wiki version of lift-off tutorial + DUV lift-off page)
(→‎Chemicals Stocked + Datasheets: corrected part number for DUV42P (added "-6"))
(43 intermediate revisions by 5 users not shown)
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__NOTOC__
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==General Information==
  
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{| class="wikitable"
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!Table of Contents
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|-
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|
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=== '''<big>Photolithography Processes</big>''' ===
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#'''UV Optical Lithography'''
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#*[[#PositivePR |'''Stocked Lithography Chemical + Datasheets''']]
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#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.''
  +
#*[[#Photolithography_Recipes |'''Photo Lithography Recipe section''']]
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#**''Starting recipes (spin, bake, exposure, develop etc.) for all photolith. tools.''
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#**''Substrate/surface materials/pattern size can affect process parameters. Users may need to run Focus/Exposure Arrays/Matrix (FEA's/FEM's) with these processes to achieve high-resolution.''
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#**[[Contact Alignment Recipes|<u>Contact Aligner Recipes</u>]]
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#***[[Contact Alignment Recipes#Suss Aligners .28SUSS MJB-3.29|Suss MJB Aligners]]
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#***[[Contact Alignment Recipes#Contact Aligner .28SUSS MA-6.29|Suss MA6]]
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#**[[Stepper Recipes|<u>Stepper Recipes</u>]]
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#***[[Stepper Recipes#Stepper 1 .28GCA 6300.29|Stepper #1: GCA 6300]] (I-Line)
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#***[[Stepper Recipes#Stepper 2 .28AutoStep 200.29|Stepper #2: GCA Autostep 200]] (I-Line)
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#***[[Stepper Recipes#Stepper 3 .28ASML DUV.29|Stepper #3: ASML PAS 5500/300]] (DUV)
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#**[[Direct-Write Lithography Recipes|<u>Direct-Write Recipes</u>]]
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#***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29|Heidelberg MLA150]]
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#***[[Lithography Recipes#E-Beam Lithography Recipes|JEOL JBX-6300FS EBL]]
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#***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29|Raith Velion FIB]]
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#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]'''
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#*''Verified Recipes for lift-off using various photolith. tools''
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#*''General educational description of this technique and it's limitations/considerations.''
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#'''E-beam Lithography'''
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#*[[#E-Beam_Lithography_Recipes |E-Beam Lithography Recipes]]
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#**''Has links to starting recipes. Substrates and patterns play a large role in process parameters.''
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#*[[#EBLPR |EBL Photoresist Datasheets]]
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#**''Provided for reference, also showing starting recipes and usage info.''
  +
#'''[[Lithography Recipes#Holography Recipes|Holography]]'''
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#*''For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.''
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#*''Recipes for silicon substrates are provided, and have been translated to other substrates by users.''
  +
#*''Datasheets are provided with starting recipes and usage info.''
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|-
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|
   
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=== '''<big>Photolithography Chemicals/Materials</big>''' ===
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This page contains information and links to recipes/datasheets spin-coated materials used in the facility. In general, the following information is provided for the following materials:
  
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#'''[[#Underlayers |Underlayers]]'''
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#*''These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.''
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*'''[[#PositivePR |Photoresists]]''':
 
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#*''Datasheets are provided.''
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**[[#Photolithography_Recipes |Photo Lithography Recipe section]]: Has links to nominal recipes (spin, bake, exposure, develop etc.) to provide the user with starting points are found in the. Substrate, surface materials, pattern size can often affect process parameters.
  
  +
#'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''':
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**[[#PositivePR |Stocked Lithography Chemical + Datasheets]]: Lists all stocked photolith. chemicals, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.
  
  +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
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*'''[[#EBLPR |E-beam Lithography Resists]]''': Links to nominal recipes may be provided in the [[#E-Beam_Lithography_Recipes | E-Beam Lithography Recipe Section]]. Substrates and patterns play a large role in process parameters. [[#EBLPR | Datasheets]] provided for reference.
  
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#*''Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.''
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*'''[[#NanoImprinting |Nanoimprinting Resists]]''': Datasheets are provided. Any recipes provided are for use in the [[Nano-Imprint_(Nanonex_NX2000) | Nano-Imprint (Nanonex NX2000)]] system only and are found in the [[#Nanoimprinting_Recipes | Nanoimprinting Recipes section]].
  
  +
#*''Datasheets are provided for reference on use of the materials.''
−  
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#'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]'''
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*'''[[#Underlayers |Underlayers]]''': These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist. Datasheets are provided and some recipes are found in the [[#Lift-Off_Techniques | Lift-Off Techniques section]].
  
  +
#*[[#Photolithography_Recipes |The Photoresist Recipes]] section contains recipes using these materials.
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*'''Holography''': For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square. Recipes for silicon substrates are provided in the [[#Holography_Recipes |Holography section]].
  
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#*''Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.''
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*'''[[#AntiReflectionCoatings |Anti-Reflection Coatings]]''': Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes. Recipes using these materials are found within the [[#Photolithography_Recipes |photoresist recipes]] themselves. Datasheets are provided for reference on use of the materials.
  
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#*''Datasheets provided with usage info.''
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*'''[[#ContrastEnhancement |Contrast Enhancement Materials (CEM)]]''': Used for resolution enhancement. Not for use in contact aligners. Recipes using these materials are found within the [[#Photolithography_Recipes |photoresist recipes]] themselves. Datasheets also provided.
  
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*'''[[#AdhesionPromoters |Adhesion Promoters]]''': These are used to improve wetting of photoresists to your substrate. Datasheets are provided on use of these materials.
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#'''[[#AdhesionPromoters |Adhesion Promoters]]'''
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#*''These are used to improve wetting of photoresists to your substrate.''
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#*''Datasheets are provided on use of these materials.''
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*'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]''': Datasheets are provided for BCB, Photo-BCB, and SOG for reference on use. Some recipes are provided in the [[#Low-K_Spin-On_Dielectric_Recipes | Low-K Spin-On Dielectric Recipes section]].
  
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#'''[[#SpinOnDielectrics |Low-K Spin-on Dielectrics]]'''
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*'''[[#Developers |Developers and Removers]]''': Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching. Datasheets provided for reference.
  
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#*[[Lithography Recipes#SpinOnDielectrics|Spin-On Dielectrics]]
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#**''Datasheets for BCB, Photo-BCB, and SOG (spin-on-glass) for reference on use.''
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#*[[#Low-K_Spin-On_Dielectric_Recipes |Low-K Spin-On Dielectric Recipes]]
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#**''Recipes for usage of some spin-on dielectrics.''
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#'''[[#Developers |Developers and Removers]]'''
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#*''Datasheets provided for reference.''
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#*''Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.''
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|}
   
 
==Photolithography Recipes==
  
==Photolithography Recipes==
   
 
{{Recipe Table Explanation}}
 
{{Recipe Table Explanation}}
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''Click the tool title to go to recipes for that tool.''
   
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''Click the photoresist title to get the datasheet, also found in [[Lithography Recipes#Chemicals Stocked .2B Datasheets|Stocked Chemicals + Datasheets]].''
 
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
  
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;" border="1"
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! colspan="9" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div>
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! colspan="7" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div>
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|- bgcolor="#D0E7FF"
  
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|<!-- INTENTIONALLY LEFT BLANK --><br>
  
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! colspan="2" bgcolor="#D0E7FF" align="center" |'''[[Contact Alignment Recipes|Contact Aligners]]'''
  
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! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Stepper Recipes|Steppers]]'''
  
   
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|-
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| bgcolor="#EAECF0" | <!-- INTENTIONALLY BLANK -->
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! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]'''
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! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]'''
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! align="center" |[[Direct-Write Lithography Recipes|Direct-Write Litho. Recipes]]
 
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! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''
 
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists'''
 
{{LithRecipe Table}}
  
{{LithRecipe Table}}
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! bgcolor="#D0E7FF" align="center" |'''Negative Resists'''
 
! bgcolor="#D0E7FF" align="center" |'''Negative Resists'''
 
{{LithRecipe Table}}
  
{{LithRecipe Table}}
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|
  
|
  +
|{{rl|MLA Recipes|Negative Resist (MLA 150)}}
 
|-
 
|-
  +
| bgcolor="#D0E7FF" align="center" |NR9-[//wiki.nanotech.ucsb.edu/w/images/8/8f/NR9-1000PY-revA.pdf 1000],[//wiki.nanotech.ucsb.edu/w/images/7/71/NR9-3000PY-revA.pdf 3000],[//wiki.nanotech.ucsb.edu/w/images/f/f9/NR9-6000PY-revA.pdf 6000]PY
−
| bgcolor="#D0E7FF" align="center" |SU-8 2075
  
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  +
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
 
|A
  
|A
  +
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
  +
|
 
|A
  
|A
  +
|- bgcolor="EEFFFF"
  +
! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings'''
  +
{{LithRecipe Table}}
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/33/XHRiC-Anti-Reflective-Coating.pdf XHRiC-11]
  +
|
  +
|
 
|A
  
|A
 
|A
  
|A
 
|
  
|
−
|- bgcolor="EEFFFF"
  
−
| bgcolor="#D0E7FF" align="center" |NR9-1000,3000,6000PY
  
−
|{{rl|Contact_Alignment_Recipes|Positive Resist (MJB-3)}}
  
−
|{{rl|Contact_Alignment_Recipes|Positive Resist (MA-6)}}
  
 
|A
  
|A
  +
|- bgcolor="EEFFFF"
−
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}}
  
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/DUV42P-Anti-Reflective-Coating.pdf DUV42-P]
 
|
  
|
−
|-
+
|
  +
|
  +
|
  +
|{{rl|Stepper Recipes|DUV-42P}}
  +
|
  +
|-
  +
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/af/DS-K101-304-Anti-Reflective-Coating.pdf DS-K101-304]
  +
|
  +
|
  +
|
  +
|
  +
|{{rl|Stepper Recipes|DS-K101-304}}
  +
|
  +
|-
  +
! bgcolor="#D0E7FF" align="center" |
  +
{{LithRecipe Table}}
  +
|}
  +
<!-- end Litho Recipes table -->
   
  +
==Lift-Off Recipes==
−
! bgcolor="#D0E7FF" align="center" |
  
−
{{LithRecipe Table}}
  
−
 
   
  +
*{{fl|Liftoff-Techniques.pdf|Lift-Off Description/Tutorial}}
−
|}
  
  +
**How it works, process limits and considerations for designing your process
  +
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
  +
*[[Lift-Off with DUV Imaging + PMGI Underlayer|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
   
−
==E-Beam Lithography Recipes==
 +
==[[E-Beam Lithography System (JEOL JBX-6300FS)|E-Beam Lithography Recipes (JEOL JBX-6300FS)]]==
   
 
*Under Development.
  
*Under Development.
   
  +
== [[Focused Ion-Beam Lithography (Raith Velion)|FIB Lithography Recipes (Raith Velion)]] ==
−
==Nanoimprinting Recipes==
  
  +
''To Be Added''
   
  +
==[[Automated Coat/Develop System (S-Cubed Flexi)|Automated Coat/Develop System Recipes (S-Cubed Flexi)]]==
−
*{{fl|Thermal-Nanoimprint-Process-Tutorial-revA.pdf|Thermal Nanoimprint Process and Tutorial}}
  
  +
Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.
−
*{{fl|Nanoinprint-Lithopgraphy-UV-Low-Pressure-Temperature-Ormostamp-PDMS-RevA.docx|UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process}}
  
   
  +
''To Be Added''
−
==Holography Recipes==
  
   
  +
==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]==
−
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_(ARC-11_%26_THMR-IP3600HP-D)-updated-8-13-2018-A.pdf|Standard Holography Process - on SiO2 on Si}}
  
  +
''The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.''
  +
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_%28ARC-11_%26_THMR-IP3600HP-D%29-updated-4-8-2021.pdf|Standard Holography Process - on SiO2 on Si}}
 
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
  
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}}
 
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
  
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}}
Line 223: Line 324:
 
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
  
*{{fl|BCB-cyclotene-3000-revA.pdf|Standard BCB (3022-46)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
  
*{{fl|512B-Application-Data-Bake-revA.pdf|SOG (T512B)}}
−  
−
==Lift-Off Techniques==
  
−  
−
*{{fl|Liftoff-Techniques.pdf|Description/Tutorial}}
  
−
*[[Lift-Off Tutorial|Lift-Off Tutorial and Limits]]
  
−
**How it works, process limits and considerations for designing your process
  
−
*{{fl|Bi-LayerContactprocesswithPMGI.pdf|I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner}}
  
−
*[[Lift-Off with UV Imaging + PMGI Underlayer|DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer]]
  
   
 
==Chemicals Stocked + Datasheets==
  
==Chemicals Stocked + Datasheets==
−
''The following is a list of the lithography chemicals we have available in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.''
 +
''The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.''
 
{|
  
{|
 
|- valign="top"
  
|- valign="top"
Line 245: Line 338:
 
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
  
*{{fl|SPR220-Positive-Resist-Datasheet.pdf|SPR220 (SPR220-3, SPR220-7)}}
 
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
  
*{{fl|SPR955-Positive-Resist-Datasheet.pdf|SPR955CM (SPR955CM-0.9, SPR955CM-1.8)}}
−
*{{fl|THMR_iP_3500_iP3600.pdf|THMR-3600HP-1 (thin i-line and Holography)}}
 +
*THMR-3600HP (Thin I-Line & Holography)
−
*{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|THMR-3600HP-2 (thin i-line and Holography)}}
 +
**{{fl|THMR_iP_3500_iP3600.pdf|Evaluation Results: THMR-3600HP}}
−
*{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|THMR-3600HP-3 (thin i-line and Holography)}}
 +
**{{fl|3600_D,_D2v_Spin_Speed_Curve.pdf|Spin Curves for THMR-3600HP}}
  +
**{{fl|THMR-iP3600_HP_D_20140801_(B)_GHS_US.pdf|Safety Datasheet for THMR-3600HP}}
   
 
'''''DUV-248nm'''''
  
'''''DUV-248nm'''''
Line 254: Line 348:
 
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
  
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
 
*{{fl|UV26-Positive-Resist-Datasheet.pdf|UV26-2.5}}
  
*{{fl|UV26-Positive-Resist-Datasheet.pdf|UV26-2.5}}
−  
   
 
;<div id="NegativePR"><big>Negative Photoresists</big></div>
  
;<div id="NegativePR"><big>Negative Photoresists</big></div>
Line 272: Line 365:
   
 
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30-0.8}}
  
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30-0.8}}
−  
   
 
;<div id="Underlayers"><big>Underlayers</big></div>
  
;<div id="Underlayers"><big>Underlayers</big></div>
Line 278: Line 370:
 
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
  
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
 
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
  
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
−  
   
 
;<div id="EBLPR"><big>E-beam resists</big></div>
  
;<div id="EBLPR"><big>E-beam resists</big></div>
Line 284: Line 375:
 
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
  
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
 
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
  
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
−  
   
 
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
  
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
Line 297: Line 387:
   
 
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
  
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
−  
   
 
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
  
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
   
−
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC (i-line)}}
 +
*{{fl|XHRiC-Anti-Reflective-Coating.pdf|XHRiC-11 (i-line)}}
−
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P (DUV) (For AR2 replacement)}}
 +
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P-6 (DUV) (For AR2 replacement)}}
 
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
  
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
−  
   
 
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
  
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
Line 312: Line 400:
 
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
  
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
 
*{{fl|OrmoPrime-NIL-Adhesion-RevA.pdf|Ormoprime08-Ormostsmp Adhesion Promoter}}
  
*{{fl|OrmoPrime-NIL-Adhesion-RevA.pdf|Ormoprime08-Ormostsmp Adhesion Promoter}}
−  
   
 
;<div id="SpinOnDielectrics"><big>Spin-On Dielectrics</big></div>
  
;<div id="SpinOnDielectrics"><big>Spin-On Dielectrics</big></div>
Line 324: Line 411:
 
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
  
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
  
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
−  
   
 
;<div id="Developers"><big>Developers</big></div>
  
;<div id="Developers"><big>Developers</big></div>
Line 333: Line 419:
 
*SU-8 Developer
  
*SU-8 Developer
 
*101A Developer (for DUV Flood Exposed PMGI)
  
*101A Developer (for DUV Flood Exposed PMGI)
−  
   
 
;<div id="PRRemovers"><big>Photoresist Removers</big></div>
  
;<div id="PRRemovers"><big>Photoresist Removers</big></div>
Line 345: Line 430:
 
|}
  
|}
   
−
[[Category:Processing]]
 +
[[Category: Processing]]
  +
[[category: Lithography]]
  +
[[category: Recipes]]

Revision as of 12:52, 17 May 2021

Table of Contents

Photolithography Processes

  1. UV Optical Lithography
  2. Lift-Off Recipes
    • Verified Recipes for lift-off using various photolith. tools
    • General educational description of this technique and it's limitations/considerations.
  3. E-beam Lithography
  4. Holography
    • For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.
    • Recipes for silicon substrates are provided, and have been translated to other substrates by users.
    • Datasheets are provided with starting recipes and usage info.

Photolithography Chemicals/Materials

  1. Underlayers
    • These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.
    • Datasheets are provided.
  2. Anti-Reflection Coatings:
    • The Photoresist Recipes section contains recipes using these materials.
    • Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.
    • Datasheets are provided for reference on use of the materials.
  3. Contrast Enhancement Materials (CEM)
    • The Photoresist Recipes section contains recipes using these materials.
    • Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.
    • Datasheets provided with usage info.
  4. Adhesion Promoters
    • These are used to improve wetting of photoresists to your substrate.
    • Datasheets are provided on use of these materials.
  5. Low-K Spin-on Dielectrics
  6. Developers and Removers
    • Datasheets provided for reference.
    • Remover and Photoresist Strippers are used to dissolve PR during lift-off or after etching.

Photolithography Recipes

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.

Click the tool title to go to recipes for that tool.

Click the photoresist title to get the datasheet, also found in Stocked Chemicals + Datasheets.

Photolithography Recipes
Contact Aligner Recipes Stepper Recipes Direct-Write Litho. Recipes
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)
AZ4110 R R A A R
AZ4210 R R A A A
AZ4330RS R R A A R
AZ4620 A A A A A
OCG 825-35CS A A A A A
SPR 955 CM-0.9 A R R R R
SPR 955 CM-1.8 A A R R A
SPR 220-3.0 R R R R R
SPR 220-7.0 R R R R A
THMR-IP3600 HP D A A R
UV6-0.8 R
UV210-0.3 R
UV26-2.5 A
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)
AZ5214-EIR R R R R R
AZnLOF 2020 R R R R R
AZnLOF 2035 A A A A A
AZnLOF 2070 A A A A A
AZnLOF 5510 A A R R A
UVN30-0.8 R
SU-8 2005,2010,2015 A R A A A
SU-8 2075 A A A A R
NR9-1000,3000,6000PY R R A R A
Anti-Reflection Coatings SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)
XHRiC-11 A A A
DUV42-P R
DS-K101-304 R
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300) 		Stepper 2
(AutoStep 200) 		Stepper 3
(ASML DUV) 		MLA150
(Heidelberg)

Lift-Off Recipes

E-Beam Lithography Recipes (JEOL JBX-6300FS)

  • Under Development.

FIB Lithography Recipes (Raith Velion)

To Be Added

Automated Coat/Develop System Recipes (S-Cubed Flexi)

Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.

To Be Added

Holography Recipes

The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.

Low-K Spin-On Dielectric Recipes

Chemicals Stocked + Datasheets

The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband

DUV-248nm

Negative Photoresists

i-line and broadband

DUV-248nm

Underlayers
E-beam resists
Nanoimprinting
Contrast Enhancement Materials
Anti-Reflection Coatings
Adhesion Promoters
Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass

Developers
Photoresist Removers
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