Difference between revisions of "Lithography Recipes"
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=== '''<big>Photolithography Processes</big>''' === |
=== '''<big>Photolithography Processes</big>''' === |
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#'''UV Optical Lithography''' |
#'''UV Optical Lithography''' |
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− | #*[[# |
+ | #*[[#PositivePR |'''Stocked Lithography Chemical + Datasheets''']] |
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− | #*[[#PositivePR |Stocked Lithography Chemical + Datasheets]] |
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#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.'' |
#**''Lists all stocked photolith. chemicals, PRs, strippers, developers, and links to the chemical's application notes/datasheet, which detail the spin curves and nominal processes.'' |
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+ | #*[[#Photolithography_Recipes |'''Photo Lithography Recipe section''']] |
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+ | #**[[Contact Alignment Recipes|<u>Contact Aligner Recipes</u>]] |
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+ | #***[[Contact Alignment Recipes#Suss Aligners .28SUSS MJB-3.29|Suss MJB Aligners]] |
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+ | #***[[Contact Alignment Recipes#Contact Aligner .28SUSS MA-6.29|Suss MA6]] |
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+ | #**[[Stepper Recipes|<u>Stepper Recipes</u>]] |
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+ | #***[[Stepper Recipes#Stepper 1 .28GCA 6300.29|Stepper #1: GCA 6300]] (I-Line) |
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+ | #***[[Stepper Recipes#Stepper 2 .28AutoStep 200.29|Stepper #2: GCA Autostep 200]] (I-Line) |
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+ | #***[[Stepper Recipes#Stepper 3 .28ASML DUV.29|Stepper #3: ASML PAS 5500/300]] (DUV) |
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+ | #**[[Direct-Write Lithography Recipes|<u>Direct-Write Recipes</u>]] |
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+ | #***[[Direct-Write Lithography Recipes#Maskless Aligner .28Heidelberg MLA150.29|Heidelberg MLA150]] |
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+ | #***[[Lithography Recipes#E-Beam Lithography Recipes|JEOL JBX-6300FS EBL]] |
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+ | #***[[Lithography Recipes#FIB Lithography Recipes .28Raith Velion.29|Raith Velion FIB]] |
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#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]''' |
#'''[[Lithography Recipes#Lift-Off Recipes|Lift-Off Recipes]]''' |
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#*''Verified Recipes for lift-off using various photolith. tools'' |
#*''Verified Recipes for lift-off using various photolith. tools'' |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4330RS] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/f/fc/AXP4000pb-Datasheet.pdf AZ4330RS] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-0.9] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/29/SPR955-Positive-Resist-Datasheet.pdf SPR 955 CM-0.9] |
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|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}} |
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}} |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/3f/SPR220-Positive-Resist-Datasheet.pdf SPR 220-3.0] |
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|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}} |
|{{rl|Stepper Recipes|Positive Resist (AutoStep 200)}} |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/b/be/3600_D%2C_D2v_Spin_Speed_Curve.pdf THMR-IP3600 HP D] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/b/be/3600_D%2C_D2v_Spin_Speed_Curve.pdf THMR-IP3600 HP D] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2070] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/5/5e/AZnLOF2020-Negative-Resist-Datasheet.pdf AZnLOF 2070] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/8/82/AZnLOF5510-Negative-Resist-Datasheet.pdf AZnLOF 5510] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/8/82/AZnLOF5510-Negative-Resist-Datasheet.pdf AZnLOF 5510] |
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|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}} |
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}} |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/c/c9/UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf UVN30-0.8] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/c/c9/UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf UVN30-0.8] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/2c/SU-8-2075-revA.pdf SU-8 2075] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/2/2c/SU-8-2075-revA.pdf SU-8 2075] |
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|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}} |
|{{rl|Stepper Recipes|Negative Resist (AutoStep 200)}} |
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! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings''' |
! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings''' |
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{{LithRecipe Table}} |
{{LithRecipe Table}} |
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+ | |bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/3/33/XHRiC-Anti-Reflective-Coating.pdf XHRiC-11] |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/DUV42P-Anti-Reflective-Coating.pdf DUV42-P] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/0/07/DUV42P-Anti-Reflective-Coating.pdf DUV42-P] |
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|{{rl|Stepper Recipes|DUV-42P}} |
|{{rl|Stepper Recipes|DUV-42P}} |
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| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/af/DS-K101-304-Anti-Reflective-Coating.pdf DS-K101-304] |
| bgcolor="#D0E7FF" align="center" |[//wiki.nanotech.ucsb.edu/w/images/a/af/DS-K101-304-Anti-Reflective-Coating.pdf DS-K101-304] |
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==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]== |
==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]== |
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+ | ''The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.'' |
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− | *{{fl|Holography_Process_for_1D-lines_and_2D-dots_ |
+ | *{{fl|Holography_Process_for_1D-lines_and_2D-dots_%28ARC-11_%26_THMR-IP3600HP-D%29-updated-4-8-2021.pdf|Standard Holography Process - on SiO2 on Si}} |
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}} |
*{{fl|Holography-Process-Variation-revA.pdf|Holography Process Variations - Set-up Angle - Etching into SiO2 and Si}} |
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*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}} |
*{{fl|05-SiO2_Nano-structure_Etch.pdf|Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width}} |
Revision as of 18:00, 8 April 2021
Table of Contents |
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Photolithography Processes
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Photolithography Chemicals/Materials
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Photolithography Recipes
- R = Recipe is available. Clicking this link will take you to the recipe.
- A = Material is available for use, but no recipes are provided.
Click the tool title to go to recipes for that tool.
Click the photoresist title to get the datasheet, also found in Stocked Chemicals + Datasheets.
Lift-Off Recipes
- Lift-Off Description/Tutorial
- How it works, process limits and considerations for designing your process
- I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner
- DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer
E-Beam Lithography Recipes (JEOL JBX-6300FS)
- Under Development.
FIB Lithography Recipes (Raith Velion)
To Be Added
Automated Coat/Develop System Recipes (S-Cubed Flexi)
Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.
To Be Added
Nanoimprinting Recipes
- Thermal Nanoimprint Process and Tutorial
- UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process
Holography Recipes
The Holography recipes here use the BARC layer XHRiC-11 & the high-res. I-Line photoresist THMR-IP3600HP-D.
- Standard Holography Process - on SiO2 on Si
- Holography Process Variations - Set-up Angle - Etching into SiO2 and Si
- Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width
- Reduce SiO2 Nanowire Diameter - Thermal Oxidation - Vapor HF Etching
Low-K Spin-On Dielectric Recipes
Chemicals Stocked + Datasheets
The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.