Difference between revisions of "Lithography Recipes"

From UCSB Nanofab Wiki
Jump to: navigation, search
m (Lift-Off Techniques: deleted redlink)
m (Chemicals Stocked + Datasheets: delete whitespace)
Line 330: Line 330:
 
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
 
*{{fl|UV6-Positive-Resist-Datasheet.pdf|UV6-0.8}}
 
*{{fl|UV26-Positive-Resist-Datasheet.pdf|UV26-2.5}}
 
*{{fl|UV26-Positive-Resist-Datasheet.pdf|UV26-2.5}}
 
   
 
;<div id="NegativePR"><big>Negative Photoresists</big></div>
 
;<div id="NegativePR"><big>Negative Photoresists</big></div>
Line 348: Line 347:
   
 
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30-0.8}}
 
*{{fl|UVN-30_-_Negative-Resist-Datasheet_-_Apr_2004.pdf|UVN-30-0.8}}
 
   
 
;<div id="Underlayers"><big>Underlayers</big></div>
 
;<div id="Underlayers"><big>Underlayers</big></div>
Line 354: Line 352:
 
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
 
*{{fl|PMGI-Underlayer-Datasheet.pdf|PMGI (PMGI SF3,5,8,11,15)}}
 
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
 
*{{fl|LOL2000-Underlayer-Datasheet.pdf|Shipley LOL2000}}
 
   
 
;<div id="EBLPR"><big>E-beam resists</big></div>
 
;<div id="EBLPR"><big>E-beam resists</big></div>
Line 360: Line 357:
 
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
 
*{{fl|PMMA-E-Beam-Resist-Datasheet.pdf|PMMA (PMMA, P(MMA-MAA) copolymer)}}
 
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
 
*{{fl|maN2403-E-Beam-Resist-Datasheet.pdf|maN 2403}}
 
   
 
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
 
;<div id="NanoImprinting"><big>Nanoimprinting</big></div>
Line 373: Line 369:
   
 
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
 
*{{fl|CEM365iS-Contrast-Enhancement-Datasheet.pdf|CEM365iS}}
 
   
 
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
 
;<div id="AntiReflectionCoatings"><big>Anti-Reflection Coatings</big></div>
Line 380: Line 375:
 
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P (DUV) (For AR2 replacement)}}
 
*{{fl|DUV42P-Anti-Reflective-Coating.pdf|DUV42P (DUV) (For AR2 replacement)}}
 
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
 
*{{fl|DS-K101-304-Anti-Reflective-Coating.pdf|DS-K101-304 (DUV developable BARC)}}
 
   
 
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
 
;<div id="AdhesionPromoters"><big>Adhesion Promoters</big></div>
Line 388: Line 382:
 
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
 
*{{fl|OMNICOAT-revA.pdf|Omnicoat, SU-8 Adhesion Promoter}}
 
*{{fl|OrmoPrime-NIL-Adhesion-RevA.pdf|Ormoprime08-Ormostsmp Adhesion Promoter}}
 
*{{fl|OrmoPrime-NIL-Adhesion-RevA.pdf|Ormoprime08-Ormostsmp Adhesion Promoter}}
 
   
 
;<div id="SpinOnDielectrics"><big>Spin-On Dielectrics</big></div>
 
;<div id="SpinOnDielectrics"><big>Spin-On Dielectrics</big></div>
Line 400: Line 393:
 
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
 
*{{fl|512B-Datasheet-revA.pdf|Spin-on-Glass, Honeywell 512B (Not Photosensitive)}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
 
*{{fl|512B-Application-Data-Bake-revA.pdf|Honeywell 512B Apps Data}}
 
   
 
;<div id="Developers"><big>Developers</big></div>
 
;<div id="Developers"><big>Developers</big></div>
Line 409: Line 401:
 
*SU-8 Developer
 
*SU-8 Developer
 
*101A Developer (for DUV Flood Exposed PMGI)
 
*101A Developer (for DUV Flood Exposed PMGI)
 
   
 
;<div id="PRRemovers"><big>Photoresist Removers</big></div>
 
;<div id="PRRemovers"><big>Photoresist Removers</big></div>

Revision as of 14:06, 17 June 2020

General Information

This page contains information and links to recipes/datasheets spin-coated materials used in the facility.

Table of Contents
  • Underlayers
    • These are used beneath resists for both adhesive purposes and to enable bi-layer lift-off profiles for use with photoresist.
    • Datasheets are provided.
  • Lift-Off Techniques
    • Verified Recipes for lift-off using various photolith. tools
    • General educational description of this technique and it's limitations/considerations.
  • Holography
    • For 1-D and 2-D gratings with 220nm nominal period, available on substrates up to 1 inch square.
    • Recipes for silicon substrates are provided, and have been translated to other substrates by users.
  • Anti-Reflection Coatings:
    • The Photoresist Recipes section contains recipes using these materials.
    • Bottom Anti-Reflection Coatings (BARC) are used in the stepper systems, underneath the resists to eliminate substrate reflections that can affect resolution and repeatability for small, near resolution limited, feature sizes.
    • Datasheets are provided for reference on use of the materials.
  • Contrast Enhancement Materials (CEM)
    • The Photoresist Recipes section contains recipes using these materials.
    • Used for resolution enhancement. Not for use in contact aligners, typically used on I-Line Steppers.
    • Datasheets provided with usage info.
  • Adhesion Promoters
    • These are used to improve wetting of photoresists to your substrate.
    • Datasheets are provided on use of these materials.

Photolithography Recipes

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Photolithography Recipes

Contact Aligner Recipes Steppers Recipes
Positive Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ4110 R R A A
AZ4210 R R A A
AZ4330RS R R A A
OCG 825-35CS A A A A
SPR 950-0.8 A A A A
SPR 955 CM-0.9 A R R R
SPR 955 CM-1.8 A A R R
SPR 220-3.0 R R R R
SPR 220-7.0 R R R R
THMR-IP3600 HP D

A A
UV6-0.8 R
UV210-0.3 R
UV26-2.5 A
Negative Resists SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
AZ5214-EIR R R R R
AZnLOF 2020 R R R R
AZnLOF 2035 A A A A
AZnLOF 2070 A A A A
AZnLOF 5510 A A R R
UVN30-0.8 R
SU-8 2005,2010, 2015 A R A A
SU-8 2075 A A A A
NR9-1000,3000,6000PY R R A R
Anti-Reflection Coatings SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)
DUV42-P R
DS-K101-304 R
SUSS MJB-3 SUSS MA-6 Stepper 1
(GCA 6300)
Stepper 2
(AutoStep 200)
Stepper 3
(ASML DUV)
MLA150
(Heidelberg)

E-Beam Lithography Recipes

  • Under Development.

Automated Coat/Develop System Recipes (S-Cubed Flexi)

Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.

To Be Added

Nanoimprinting Recipes

Holography Recipes

Low-K Spin-On Dielectric Recipes

Lift-Off Techniques

Chemicals Stocked + Datasheets

The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.

Positive Photoresists

i-line and broadband

DUV-248nm

Negative Photoresists

i-line and broadband

DUV-248nm

Underlayers
E-beam resists
Nanoimprinting
Contrast Enhancement Materials
Anti-Reflection Coatings
Adhesion Promoters
Spin-On Dielectrics

Low-K Spin-On Dielectrics such as Benzocyclobutane and Spin-on Glass

Developers
Photoresist Removers